亚太地区重新分布层材料市场预测至 2028 年 - COVID-19 影响和按材料类型 [聚酰亚胺 (PI)、聚苯并恶唑 (PBO)、苯环丁烯 (BCB) 等] 和应用 [扇出晶圆级封装 (FOWLP) ）和2.5D/3D IC封装]

亚太地区再分布层材料市场预计将从2021年的1.3221亿美元增长到2028年的2.507亿美元；预计 2021 年至 2028 年复合年增长率为 9.6%。\\n\\n半导体行业一直致力于开发创新解决方案，以寻求降低成本。领先的半导体厂商目前考虑的一种方法是从晶圆和条带尺寸迁移到专用于 IC 组装的大尺寸面板。效率和规模经济是这条道路的附加值。芯片制造商、研发组织和 OSAT 正在为各种应用开发下一波扇出封装。三星电机 (SEMCO) 在过去两年中投资了超过 4 亿美元，终于开始为其新消费产品 Galaxy Watch 生产集成 APE 的产品。通过这一战略性技术选择，SEMCO 瞄准了台积电在高密度扇出封装领域的领导地位，并为 FOPLP 技术开发制定了积极的路线图。三星正在基于内部封装解决方案制造自己的处理器。这一战略使公司能够控制从模具到最终产品的整个供应链。然而，像苹果这样的竞争对手将处理器制造外包给主要合作伙伴。两年前，苹果决定采用台积电发布的基于FOWLP的技术，即inFo。扇出晶圆级中介层封装 (PoP) 是另一种采用芯片到晶圆键合技术的新型 RDL。该新技术对于移动应用具有许多优势，如信号路径短、功耗低、多功能异构集成和小外形尺寸。此外，扇出晶圆级中介层PoP可应用于不同的封装平台，包括PoP、芯片级封装（CSP）和系统级封装（SiP）。内联再分布层 (IRDL) 技术是一种先进的 FAB 技术，利用带有绝缘层和铝的附加金属层形成布线。该技术使用户能够生产更薄、更简单的芯片间接合。随着可穿戴设备和手机的不断增长，移动存储器的需求正在稳步增长。对于手机来说，便携性是必需的，这就产生了对低功耗和超薄封装技术的需求。因此，IRDL 预计将成为半导体行业满足这一要求的关键要素。由于对高性能和超小型半导体的需求不断增加，封装技术不断成为下一代半导体的核心技术。下一代封装技术的发展将有助于提高半导体性能和生产效率。由于主要国家的存在、巨大的工业存在以及促进工业增长的有利政府政策，亚太地区是再分配层材料市场增长的关键地区之一。亚太地区发展中国家的高度城市化和工业制造业投资的增加预计也将在未来几年为市场参与者提供利润丰厚的增长机会。然而，COVID-19 大流行导致亚太地区各行业的增长受到干扰。主要国家各种工厂的封锁或产能减少正在限制全球供需平衡，这对该地区的制造、交货时间表和各种产品需求产生负面影响。 2020年，由于亚太各国政府限制导致原材料和劳动力短缺，工业活动、新项目、研发投资和交付进度均出现下降。大多数RDL公司在中国、台湾、韩国和日本设有制造工厂，因此疫情对上述国家经济的负面影响直接影响了这些公司的收入。所有这些因素都对亚太地区再分布层材料市场的增长产生了负面影响。\\n\\n到 2028 年亚太地区再分布层材料市场收入和预测（百万美元）\\n\\n亚太地区再分布层材料市场细分\\n\\n按材料类型划分的亚太地区再分布层材料市场\\n- 聚酰亚胺 (PI)\\n- 聚苯并恶唑 (PBO)\\n- 苯并环丁烯 (BCB)\\n- 其他\\无铝\\无光敏电介质\\无酚类及其他\\ n\\n亚太地区再分布层材料市场（按应用）\\n- 扇出晶圆级封装 (FOWLP)\\n- 2.5D/3D IC 封装\\n亚太地区再分布层材料市场（按国家）\\n- 韩国\\n- 中国\\ n- 台湾\\n- 日本\\n- 亚太地区其他地区\\n亚太地区再分布层材料市场 - 提及的公司\\n- Amkor Technology\\n- ASE Group\\n- Fujifilm Corporation\\n- Hitachi Chemical DuPont MicroSystems LLC\\n- INFINEON TECHNOLOGIES AG\\n- 江苏长电科技有限公司\\n- 恩智浦半导体\\n- 三星电子有限公司\\n- 信越化学有限公司\\n- SK 海力士公司\\ n\\n

Table of Content

1. Introduction

1.1 The Insight Partners Research Report Guidance

1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights

2.2 Market Attractiveness

2.2.1 Market Attractiveness

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. Asia Pacific Redistribution Layer Material Market Landscape

4.1 Overview

4.2 Porter's Five Forces Analysis

4.2.1 Bargaining Power of Suppliers

4.2.2 Bargaining Power of Buyers

4.2.3 Threat of New Entrants

4.2.4 Intensity of Competitive Rivalry

4.2.5 Threat of Substitutes

4.3 Ecosystem Analysis

4.3.1 Raw Material Suppliers

4.3.2 Manufacturers

4.3.3 End Use

4.3.4 List of Vendors in the Value Chain

4.3.4.1 List of Raw Material Suppliers in Value Chain

4.3.4.2 List of Manufacturers in Value Chain

5. Asia Pacific Redistribution Layer Material Market - Key Market Dynamics

5.1 Market Drivers

5.1.1 Growing Focus on AI-based Equipment and Tools

5.1.2 Increasing Demand from Automotive and Telecommunication Industries

5.2 Market Restraints

5.2.1 Fluctuation in Raw Material Prices

5.3 Market Opportunities

5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals

5.4 Future Trends

5.4.1 Advancements in the Packaging Technology

5.5 Impact Analysis

6. Redistribution Layer Material Market - Asia Pacific Market Analysis

6.1 Asia Pacific Redistribution Layer Material Market Volume (Tons)

6.2 Asia Pacific Redistribution Layer Material Market Revenue (US$ Million)

6.3 Asia Pacific Redistribution Layer Material Market Forecast and Analysis

7. Asia Pacific Redistribution Layer Material Market Analysis - Type

7.1 Polyimide (PI)

7.1.1 Overview

7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)

7.2 Polybenzoxazole (PBO)

7.2.1 Overview

7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)

7.3 Benzocylobutene (BCB)

7.3.1 Overview

7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)

7.4 Others

7.4.1 Overview

7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. Asia Pacific Redistribution Layer Material Market Analysis - Application

8.1 Fan-Out Wafer Level Packaging (FOWLP)

8.1.1 Overview

8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)

8.2 2 5D/3D IC Packaging

8.2.1 Overview

8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)

8.2.3 High Bandwidth Memory (HBM)

8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)

8.2.4 Multi-Chip Integration

8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)

8.2.5 Package on Package (FOPOP)

8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)

8.2.6 Others

8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Asia Pacific Redistribution Layer Material Market - Country Analysis

9.1 Overview

9.1.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries

9.1.1.1 Redistribution Layer Material Market Breakdown by Country

9.1.1.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.3.1 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.2 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.3 China Redistribution Layer Material Market Breakdown by Application

9.1.1.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application

9.1.1.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.7.1 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.2 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.3 Japan Redistribution Layer Material Market Breakdown by Application

9.1.1.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.9.1 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.2 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.3 South Korea Redistribution Layer Material Market Breakdown by Application

9.1.1.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

11.1 Heat Map Analysis by Key Players

11.2 Company Positioning & Concentration

11. Industry Landscape

12.1 Overview

12.2 Market Initiative

12.3 New Product Development

12.4 Merger and Acquisition

12. Company Profiles

12.1 SK Hynix Inc

13.1.1 Key Facts

13.1.2 Business Description

13.1.3 Products and Services

13.1.4 Financial Overview

13.1.5 SWOT Analysis

13.1.6 Key Developments

12.2 Samsung Electronics Co Ltd

13.2.1 Key Facts

13.2.2 Business Description

13.2.3 Products and Services

13.2.4 Financial Overview

13.2.5 SWOT Analysis

13.2.6 Key Developments

12.3 Infineon Technologies AG

13.3.1 Key Facts

13.3.2 Business Description

13.3.3 Products and Services

13.3.4 Financial Overview

13.3.5 SWOT Analysis

13.3.6 Key Developments

12.4 DuPont de Nemours Inc

13.4.1 Key Facts

13.4.2 Business Description

13.4.3 Products and Services

13.4.4 Financial Overview

13.4.5 SWOT Analysis

13.4.6 Key Developments

12.5 FUJIFILM Holdings Corp

13.5.1 Key Facts

13.5.2 Business Description

13.5.3 Products and Services

13.5.4 Financial Overview

13.5.5 SWOT Analysis

13.5.6 Key Developments

12.6 Amkor Technology Inc

13.6.1 Key Facts

13.6.2 Business Description

13.6.3 Products and Services

13.6.4 Financial Overview

13.6.5 SWOT Analysis

13.6.6 Key Developments

12.7 ASE Technology Holding Co Ltd

13.7.1 Key Facts

13.7.2 Business Description

13.7.3 Products and Services

13.7.4 Financial Overview

13.7.5 SWOT Analysis

13.7.6 Key Developments

12.8 NXP Semiconductors NV

13.8.1 Key Facts

13.8.2 Business Description

13.8.3 Products and Services

13.8.4 Financial Overview

13.8.5 SWOT Analysis

13.8.6 Key Developments

12.9 JCET Group Co Ltd

13.9.1 Key Facts

13.9.2 Business Description

13.9.3 Products and Services

13.9.4 Financial Overview

13.9.5 SWOT Analysis

13.9.6 Key Developments

12.10 Shin-Etsu Chemical Co Ltd

13.10.1 Key Facts

13.10.2 Business Description

13.10.3 Products and Services

13.10.4 Financial Overview

13.10.5 SWOT Analysis

13.10.6 Key Developments

13. Appendix

List of Tables

Table 1. Asia Pacific Redistribution Layer Material Market Segmentation

Table 2. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Table 3. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Table 4. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type

Table 5. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Type

Table 6. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Application

Table 7. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 8. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 9. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 10. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 11. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 12. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 13. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 14. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 15. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 16. South Korea Redistribution Layer Material Market Revenue and Forecasts To 2030 (Kilo Ton) - By Type

Table 17. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 18. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 19. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 20. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 21. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 22. Company Positioning & Concentration

List of Figures

Figure 1. Asia Pacific Redistribution Layer Material Market Segmentation, By Country

Figure 2. Porter's Five Forces Analysis

Figure 3. Ecosystem: Asia Pacific Redistribution Layer Material Market

Figure 4. Market Dynamics: Asia Pacific Redistribution Layer Material Market

Figure 5. Asia Pacific Redistribution Layer Material Market Impact Analysis of Drivers and Restraints

Figure 6. Asia Pacific Redistribution Layer Material Market Volume (Tons), 2020 - 2030

Figure 7. Asia Pacific Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030

Figure 8. Asia Pacific Redistribution Layer Material Market Share (%) - Type, 2022 and 2030

Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)

Figure 10. Polyimide (PI) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)

Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)

Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 15. Others Market Volume and Forecasts To 2030 (Tons)

Figure 16. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 17. Asia Pacific Redistribution Layer Material Market Share (%) - Application, 2022 and 2030

Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts to 2030 (US$ Million)

Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 21. Multi-Chip Integration Market Revenue and Forecasts to 2030 (US$ Million)

Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 23. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 24. Asia Pacific Redistribution Layer Material Market Breakdown by Key Countries, (2022) (US$ Million)

Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)

Figure 26. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 27. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 28. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 29. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 30. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 31. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 32. South Korea Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 33. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 34. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 35. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 36. Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 37. Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 38. Redistribution Layer Material Market Breakdown by Type (2022 and 2030)

Figure 39. Heat Map Analysis by Key Players

1. SK Hynix Inc

2. Samsung Electronics Co Ltd

3. Infineon Technologies AG

4. DuPont de Nemours Inc

5. FUJIFILM Holdings Corp

6. Amkor Technology Inc

7. ASE Technology Holding Co Ltd

8. NXP Semiconductors NV

9. JCET Group Co Ltd

10. Shin-Etsu Chemical Co Ltd

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the Asia Pacific redistribution layer material market.
Highlights key business priorities in order to assist companies to realign their business strategies.
The key findings and recommendations highlight crucial progressive industry trends in Asia Pacific redistribution layer material market, thereby allowing players across the value chain to develop effective long-term strategies.
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
Scrutinize in-depth Asia Pacific market trends and outlook coupled with the factors driving the redistribution layer material market, as well as those hindering it.
Enhance the decision-making process by understanding the strategies that underpin security interest with respect to client products, segmentation, pricing, and distribution.

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亚太地区重新分布层材料市场预测至 2028 年 - COVID-19 影响和按材料类型 [聚酰亚胺 (PI)、聚苯并恶唑 (PBO)、苯环丁烯 (BCB) 等] 和应用 [扇出晶圆级封装 (FOWLP) ）和2.5D/3D IC封装]

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