2028年までのアジア太平洋再配線層材料市場予測 - 新型コロナウイルス感染症の影響と材料タイプ別の地域分析[ポリイミド(PI)、ポリベンゾオキサゾール(PBO)、ベンゾシロブテン(BCB)、その他]および用途[ファンアウト・ウェーハ・レベル・パッケージング(FOWLP)] ) および 2.5D/3D IC パッケージング]

アジア太平洋地域の再配線層材料市場は、2021年の1億3,221万米ドルから2028年までに2億5,070万米ドルに成長すると予想されています。 2021 年から 2028 年までに 9.6% の CAGR で成長すると推定されています。\\n\\n半導体業界は、コスト削減を追求して常に革新的なソリューションの開発に取り組んできました。主要な半導体プレーヤーが現在検討しているアプローチの 1 つは、ウェーハおよびストリップサイズから、IC アセンブリ専用の大型パネルへの移行です。効率と規模の経済がこのパスの付加価値です。チップメーカー、研究開発組織、OSAT は、さまざまなアプリケーション向けのファンアウトパッケージの次の波を開発しています。 Samsung Electro Mechanics (SEMCO) は、過去 2 年間で 4 億米ドル以上を投資し、ついに新しい消費者向け製品である Galaxy Watch の統合 APE による生産を開始しました。この戦略的な技術的選択により、SEMCO は、FOPLP 技術開発の積極的なロードマップとともに、高密度ファンアウトパッケージングにおける TSMC のリーダーシップを目指しています。サムスンは、社内のパッケージングソリューションに基づいて独自のプロセッサを製造しています。この戦略により、同社は金型から最終製品に至るサプライチェーン全体を管理できるようになります。ただし、Apple などの競合他社は、プロセッサの製造を主要パートナーに委託しています。 2 年前、Apple は TSMC がリリースした FOWLP ベースのテクノロジー、つまり inFo を使用することを決定しました。ファンアウトウェーハレベルインターポーザパッケージオンパッケージ (PoP) は、チップとウェーハのボンディングテクノロジを備えたもう 1 つの新しい RDL です。この新しいテクノロジーは、短い信号経路、低消費電力、多機能のための異種統合、小型フォームファクタなど、モバイルアプリケーションにとって多くの利点をもたらします。また、ファンアウトウェーハレベルインターポーザ PoP は、PoP、チップスケールパッケージ (CSP)、システムインパッケージ (SiP) などのさまざまなパッケージプラットフォームに適用できます。インライン再配線層 (IRDL) テクノロジーは、絶縁層とアルミニウムを備えた追加の金属層を利用して配線を形成する高度な FAB テクノロジーです。この技術により、ユーザーはチップ間の接合をより薄く、より簡単に行うことができます。ウェアラブルデバイスと携帯電話の絶え間ない成長に伴い、モバイルメモリの需要は着実に改善しています。携帯電話では携帯性が求められるため、低消費電力かつ超薄型のパッケージ技術が求められています。したがって、IRDL は、この要件を満たすために半導体産業において重要な要素となることが期待されています。高性能かつ超小型の半導体に対する需要の高まりにより、パッケージング技術は次世代半導体の中核技術として浮上し続けています。次世代パッケージング技術の開発は、半導体の性能と生産効率の向上に役立ちます。 \\n\\nアジア太平洋地域は、主要国の存在、巨大な産業の存在、産業成長を促進する有利な政府政策により、再配線層材料市場の成長にとって重要な地域の 1 つです。アジア太平洋の発展途上国における高度な都市化と工業製造への投資の増加も、今後数年間で市場参加者に有利な成長機会を提供すると予測されています。しかし、新型コロナウイルス感染症のパンデミックにより、アジア太平洋地域のさまざまな産業セクターの成長に混乱が生じました。主要国のさまざまな工場のロックダウンや生産能力の低下により、世界的な需要と供給のバランスが制限され、この地域の製造、納期、さまざまな製品の需要に悪影響が及んでいます。 2020年には、アジア太平洋諸国における政府のさまざまな制限に起因する原材料や労働力の不足により、産業活動、新規プロジェクト、研究開発投資、納期の低下が見られました。ほとんどの RDL 企業は中国、台湾、韓国、日本に製造工場を持っています。このため、感染拡大による上記諸国の経済への悪影響は、これらの企業の収益に直接影響を与えています。これらすべての要因は、アジア太平洋地域の再配線層材料市場の成長に悪影響を及ぼしています。\\n\\nアジア太平洋地域の再配線層材料市場の収益と 2028 年までの予測 (百万米ドル)\\n\\nアジア太平洋地域の再配線層材料市場のセグメンテーション\\n\\n材料タイプ別のアジア太平洋再配線層材料市場\\n- ポリイミド (PI)\\n- ポリベンゾオキサゾール (PBO)\\n- ベンゾシロブテン (BCB)\\n- その他\\no アルミニウム \\no 感光性誘電体\\no フェノールおよびその他\\ n\\nアプリケーション別のアジア太平洋地域の再配線層材料市場\\n- ファンアウトウェーハレベルパッケージング (FOWLP)\\n- 2.5D/3D IC パッケージング\\n国別のアジア太平洋地域の再配線層材料市場\\n- 韓国\\n- 中国\\ n- 台湾\\n- 日本\\n- アジア太平洋地域のその他の地域\\nアジア太平洋地域の再配線層材料市場-言及された企業\\n- Amkor Technology\\n- ASE グループ\\n- 富士フイルム株式会社\\n- Hitachi Chemical DuPont MicroSystems LLC\\n- INFINEON TECHNOLOGIES AG\\n- Jiangsu Changjiang Electronics Technology Co., Ltd.\\n- NXP Semiconductors\\n- Samsung Electronics Co., Ltd.\\n- 信越化学工業株式会社\\n- SK Hynix Inc.\\ n\\n

Table of Content

1. Introduction

1.1 The Insight Partners Research Report Guidance

1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights

2.2 Market Attractiveness

2.2.1 Market Attractiveness

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. Asia Pacific Redistribution Layer Material Market Landscape

4.1 Overview

4.2 Porter's Five Forces Analysis

4.2.1 Bargaining Power of Suppliers

4.2.2 Bargaining Power of Buyers

4.2.3 Threat of New Entrants

4.2.4 Intensity of Competitive Rivalry

4.2.5 Threat of Substitutes

4.3 Ecosystem Analysis

4.3.1 Raw Material Suppliers

4.3.2 Manufacturers

4.3.3 End Use

4.3.4 List of Vendors in the Value Chain

4.3.4.1 List of Raw Material Suppliers in Value Chain

4.3.4.2 List of Manufacturers in Value Chain

5. Asia Pacific Redistribution Layer Material Market - Key Market Dynamics

5.1 Market Drivers

5.1.1 Growing Focus on AI-based Equipment and Tools

5.1.2 Increasing Demand from Automotive and Telecommunication Industries

5.2 Market Restraints

5.2.1 Fluctuation in Raw Material Prices

5.3 Market Opportunities

5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals

5.4 Future Trends

5.4.1 Advancements in the Packaging Technology

5.5 Impact Analysis

6. Redistribution Layer Material Market - Asia Pacific Market Analysis

6.1 Asia Pacific Redistribution Layer Material Market Volume (Tons)

6.2 Asia Pacific Redistribution Layer Material Market Revenue (US$ Million)

6.3 Asia Pacific Redistribution Layer Material Market Forecast and Analysis

7. Asia Pacific Redistribution Layer Material Market Analysis - Type

7.1 Polyimide (PI)

7.1.1 Overview

7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)

7.2 Polybenzoxazole (PBO)

7.2.1 Overview

7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)

7.3 Benzocylobutene (BCB)

7.3.1 Overview

7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)

7.4 Others

7.4.1 Overview

7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. Asia Pacific Redistribution Layer Material Market Analysis - Application

8.1 Fan-Out Wafer Level Packaging (FOWLP)

8.1.1 Overview

8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)

8.2 2 5D/3D IC Packaging

8.2.1 Overview

8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)

8.2.3 High Bandwidth Memory (HBM)

8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)

8.2.4 Multi-Chip Integration

8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)

8.2.5 Package on Package (FOPOP)

8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)

8.2.6 Others

8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Asia Pacific Redistribution Layer Material Market - Country Analysis

9.1 Overview

9.1.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries

9.1.1.1 Redistribution Layer Material Market Breakdown by Country

9.1.1.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.3.1 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.2 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.3 China Redistribution Layer Material Market Breakdown by Application

9.1.1.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application

9.1.1.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.7.1 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.2 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.3 Japan Redistribution Layer Material Market Breakdown by Application

9.1.1.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.9.1 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.2 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.3 South Korea Redistribution Layer Material Market Breakdown by Application

9.1.1.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

11.1 Heat Map Analysis by Key Players

11.2 Company Positioning & Concentration

11. Industry Landscape

12.1 Overview

12.2 Market Initiative

12.3 New Product Development

12.4 Merger and Acquisition

12. Company Profiles

12.1 SK Hynix Inc

13.1.1 Key Facts

13.1.2 Business Description

13.1.3 Products and Services

13.1.4 Financial Overview

13.1.5 SWOT Analysis

13.1.6 Key Developments

12.2 Samsung Electronics Co Ltd

13.2.1 Key Facts

13.2.2 Business Description

13.2.3 Products and Services

13.2.4 Financial Overview

13.2.5 SWOT Analysis

13.2.6 Key Developments

12.3 Infineon Technologies AG

13.3.1 Key Facts

13.3.2 Business Description

13.3.3 Products and Services

13.3.4 Financial Overview

13.3.5 SWOT Analysis

13.3.6 Key Developments

12.4 DuPont de Nemours Inc

13.4.1 Key Facts

13.4.2 Business Description

13.4.3 Products and Services

13.4.4 Financial Overview

13.4.5 SWOT Analysis

13.4.6 Key Developments

12.5 FUJIFILM Holdings Corp

13.5.1 Key Facts

13.5.2 Business Description

13.5.3 Products and Services

13.5.4 Financial Overview

13.5.5 SWOT Analysis

13.5.6 Key Developments

12.6 Amkor Technology Inc

13.6.1 Key Facts

13.6.2 Business Description

13.6.3 Products and Services

13.6.4 Financial Overview

13.6.5 SWOT Analysis

13.6.6 Key Developments

12.7 ASE Technology Holding Co Ltd

13.7.1 Key Facts

13.7.2 Business Description

13.7.3 Products and Services

13.7.4 Financial Overview

13.7.5 SWOT Analysis

13.7.6 Key Developments

12.8 NXP Semiconductors NV

13.8.1 Key Facts

13.8.2 Business Description

13.8.3 Products and Services

13.8.4 Financial Overview

13.8.5 SWOT Analysis

13.8.6 Key Developments

12.9 JCET Group Co Ltd

13.9.1 Key Facts

13.9.2 Business Description

13.9.3 Products and Services

13.9.4 Financial Overview

13.9.5 SWOT Analysis

13.9.6 Key Developments

12.10 Shin-Etsu Chemical Co Ltd

13.10.1 Key Facts

13.10.2 Business Description

13.10.3 Products and Services

13.10.4 Financial Overview

13.10.5 SWOT Analysis

13.10.6 Key Developments

13. Appendix

List of Tables

Table 1. Asia Pacific Redistribution Layer Material Market Segmentation

Table 2. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Table 3. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Table 4. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type

Table 5. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Type

Table 6. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Application

Table 7. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 8. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 9. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 10. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 11. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 12. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 13. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 14. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 15. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 16. South Korea Redistribution Layer Material Market Revenue and Forecasts To 2030 (Kilo Ton) - By Type

Table 17. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 18. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 19. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 20. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 21. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 22. Company Positioning & Concentration

List of Figures

Figure 1. Asia Pacific Redistribution Layer Material Market Segmentation, By Country

Figure 2. Porter's Five Forces Analysis

Figure 3. Ecosystem: Asia Pacific Redistribution Layer Material Market

Figure 4. Market Dynamics: Asia Pacific Redistribution Layer Material Market

Figure 5. Asia Pacific Redistribution Layer Material Market Impact Analysis of Drivers and Restraints

Figure 6. Asia Pacific Redistribution Layer Material Market Volume (Tons), 2020 - 2030

Figure 7. Asia Pacific Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030

Figure 8. Asia Pacific Redistribution Layer Material Market Share (%) - Type, 2022 and 2030

Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)

Figure 10. Polyimide (PI) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)

Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)

Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 15. Others Market Volume and Forecasts To 2030 (Tons)

Figure 16. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 17. Asia Pacific Redistribution Layer Material Market Share (%) - Application, 2022 and 2030

Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts to 2030 (US$ Million)

Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 21. Multi-Chip Integration Market Revenue and Forecasts to 2030 (US$ Million)

Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 23. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 24. Asia Pacific Redistribution Layer Material Market Breakdown by Key Countries, (2022) (US$ Million)

Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)

Figure 26. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 27. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 28. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 29. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 30. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 31. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 32. South Korea Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 33. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 34. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 35. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 36. Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 37. Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 38. Redistribution Layer Material Market Breakdown by Type (2022 and 2030)

Figure 39. Heat Map Analysis by Key Players

1. SK Hynix Inc

2. Samsung Electronics Co Ltd

3. Infineon Technologies AG

4. DuPont de Nemours Inc

5. FUJIFILM Holdings Corp

6. Amkor Technology Inc

7. ASE Technology Holding Co Ltd

8. NXP Semiconductors NV

9. JCET Group Co Ltd

10. Shin-Etsu Chemical Co Ltd

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the Asia Pacific redistribution layer material market.
Highlights key business priorities in order to assist companies to realign their business strategies.
The key findings and recommendations highlight crucial progressive industry trends in Asia Pacific redistribution layer material market, thereby allowing players across the value chain to develop effective long-term strategies.
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
Scrutinize in-depth Asia Pacific market trends and outlook coupled with the factors driving the redistribution layer material market, as well as those hindering it.
Enhance the decision-making process by understanding the strategies that underpin security interest with respect to client products, segmentation, pricing, and distribution.

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