Previsioni di mercato dei materiali per strati di ridistribuzione nell\'Asia del Pacifico fino al 2028 - Impatto del COVID-19 e analisi regionale per tipo di materiale [poliimmide (PI), polibenzossazolo (PBO), benzocilobutene (BCB) e altri] e applicazione [imballaggio a livello di wafer fan-out (FOWLP) ) e packaging IC 2.5D/3D]

Si prevede che il mercato dei materiali per strati di ridistribuzione nell’Asia del Pacifico crescerà da 132,21 milioni di dollari nel 2021 a 250,70 milioni di dollari entro il 2028; si stima che crescerà a un CAGR del 9,6% dal 2021 al 2028.\\n\\nL\'industria dei semiconduttori è sempre stata coinvolta nello sviluppo di soluzioni innovative alla ricerca della riduzione dei costi. Un approccio attualmente preso in considerazione dai principali produttori di semiconduttori è la migrazione dalle dimensioni di wafer e strisce a pannelli di grandi dimensioni dedicati all\'assemblaggio di circuiti integrati. Efficienza ed economie di scala sono il valore aggiunto di questo percorso. I produttori di chip, le organizzazioni di ricerca e sviluppo e gli OSAT stanno sviluppando la prossima ondata di pacchetti fan-out per varie applicazioni. Samsung Electro Mechanics (SEMCO) ha investito più di 400 milioni di dollari negli ultimi due anni e ha finalmente iniziato la produzione con APE integrato per il suo nuovo prodotto di consumo, il Galaxy Watch. Con questa scelta tecnica strategica, SEMCO punta alla leadership di TSMC nel packaging fan-out ad alta densità, con una roadmap aggressiva per lo sviluppo della tecnologia FOPLP. Samsung produce i propri processori basandosi su soluzioni di packaging interne. Questa strategia consente all\'azienda di controllare l\'intera filiera, dallo stampo al prodotto finale. I concorrenti come Apple, tuttavia, esternalizzano la produzione del processore a partner chiave. Due anni fa, Apple ha deciso di utilizzare una tecnologia basata su FOWLP rilasciata da TSMC, ovvero inFo. Il package-on-package (PoP) interposer a livello di wafer fan-out è un altro nuovo RDL con tecnologia di collegamento chip-to-wafer. La nuova tecnologia presenta numerosi vantaggi per le applicazioni mobili, come il percorso breve del segnale, il basso consumo energetico, l\'integrazione eterogenea per le multifunzione e il fattore di forma ridotto. Inoltre, il PoP interposer a livello di wafer fan-out può essere applicato in diverse piattaforme di pacchetto, tra cui PoP, pacchetto su scala chip (CSP) e sistema in pacchetto (SiP). La tecnologia IRDL (Inline Redistribution Layer) è una tecnologia FAB avanzata che forma il cablaggio utilizzando strati metallici aggiuntivi con uno strato isolante e alluminio. Questa tecnologia consente all\'utente di produrre incollaggi chip-to-chip più sottili e semplici. La domanda di memoria mobile è in costante miglioramento, insieme alla crescita costante dei dispositivi indossabili e dei telefoni cellulari. Quando si tratta di telefoni cellulari, è necessaria la portabilità, il che sta creando la necessità di una tecnologia a basso consumo e con contenitori ultrasottili. Pertanto, si prevede che IRDL sarà un elemento cruciale nel settore dei semiconduttori per soddisfare questo requisito. A causa della crescente domanda di semiconduttori ultra-piccoli e ad alte prestazioni, la tecnologia di packaging sta emergendo costantemente come tecnologia chiave per i semiconduttori di prossima generazione. Lo sviluppo della tecnologia di confezionamento di prossima generazione contribuirà a migliorare le prestazioni dei semiconduttori e l’efficienza produttiva. \\n\\nL\'Asia Pacifico è una delle regioni cruciali per la crescita del mercato dei materiali dello strato di ridistribuzione grazie alla presenza di paesi chiave, un\'enorme presenza industriale e politiche governative favorevoli per stimolare la crescita industriale. Si prevede inoltre che l’elevata urbanizzazione nei paesi in via di sviluppo dell’Asia Pacifico e l’aumento degli investimenti nella produzione industriale offriranno opportunità di crescita redditizie agli operatori del mercato nei prossimi anni. Tuttavia, la pandemia di COVID-19 ha portato a interruzioni nella crescita di vari settori industriali nell’Asia del Pacifico. Il blocco o la ridotta capacità di vari stabilimenti/fabbriche nei principali paesi sta restringendo l’equilibrio globale tra domanda e offerta, con un impatto negativo sulla produzione, sui programmi di consegna e sulla domanda di vari prodotti nella regione. Nel 2020, le attività industriali, i nuovi progetti, gli investimenti in ricerca e sviluppo e i programmi di consegna hanno registrato un calo a causa della carenza di materie prime e manodopera causata da varie restrizioni governative nei paesi dell’Asia del Pacifico. La maggior parte delle aziende RDL ha i propri stabilimenti di produzione in Cina, Taiwan, Corea del Sud e Giappone. Pertanto, l’impatto negativo dell’epidemia sull’economia dei paesi menzionati ha avuto un impatto diretto sui ricavi di queste società. Tutti questi fattori hanno influenzato negativamente la crescita del mercato dei materiali per strati di ridistribuzione nell\'Asia del Pacifico.\\n\\nEntrate e previsioni del mercato dei materiali per strati di ridistribuzione dell\'Asia del Pacifico fino al 2028 (milioni di dollari)\\n\\nSegmentazione del mercato dei materiali per strati di ridistribuzione dell\'Asia del Pacifico \\n\\nMercato dei materiali per strati di ridistribuzione nell\'Asia del Pacifico per tipo di materiale\\n- Poliimmide (PI)\\n- Polibenzossazolo (PBO)\\n- Benzocilobutene (BCB)\\n- Altri\\no alluminio\\no dielettrici fotosensibili\\no fenoli e altri\\ n\\nMercato dei materiali per strati di ridistribuzione nell\'Asia del Pacifico per applicazione\\n- Imballaggi a livello di wafer fan-out (FOWLP)\\n- Imballaggi IC 2.5D/3D\\nMercato dei materiali per strati di ridistribuzione nell\'Asia del Pacifico per Paese\\n- Corea del Sud\\n- Cina\\ n- Taiwan\\n- Giappone\\n- Resto dell\'Asia Pacifico\\nSocietà menzionate nel mercato dei materiali per strati di ridistribuzione nell\'Asia Pacifico\\n- Amkor Technology\\n- Gruppo ASE\\n- Fujifilm Corporation\\n- Hitachi Chemical DuPont MicroSystems LLC\\n- INFINEON TECHNOLOGIES AG\\n- Jiangsu Changjiang Electronics Technology Co., Ltd.\\n- NXP Semiconductors\\n- Samsung Electronics Co., Ltd.\\n- Shin-Etsu Chemical Co., Ltd.\\n- SK Hynix Inc.\\ n\\n

Table of Content

1. Introduction

1.1 The Insight Partners Research Report Guidance

1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights

2.2 Market Attractiveness

2.2.1 Market Attractiveness

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. Asia Pacific Redistribution Layer Material Market Landscape

4.1 Overview

4.2 Porter's Five Forces Analysis

4.2.1 Bargaining Power of Suppliers

4.2.2 Bargaining Power of Buyers

4.2.3 Threat of New Entrants

4.2.4 Intensity of Competitive Rivalry

4.2.5 Threat of Substitutes

4.3 Ecosystem Analysis

4.3.1 Raw Material Suppliers

4.3.2 Manufacturers

4.3.3 End Use

4.3.4 List of Vendors in the Value Chain

4.3.4.1 List of Raw Material Suppliers in Value Chain

4.3.4.2 List of Manufacturers in Value Chain

5. Asia Pacific Redistribution Layer Material Market - Key Market Dynamics

5.1 Market Drivers

5.1.1 Growing Focus on AI-based Equipment and Tools

5.1.2 Increasing Demand from Automotive and Telecommunication Industries

5.2 Market Restraints

5.2.1 Fluctuation in Raw Material Prices

5.3 Market Opportunities

5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals

5.4 Future Trends

5.4.1 Advancements in the Packaging Technology

5.5 Impact Analysis

6. Redistribution Layer Material Market - Asia Pacific Market Analysis

6.1 Asia Pacific Redistribution Layer Material Market Volume (Tons)

6.2 Asia Pacific Redistribution Layer Material Market Revenue (US$ Million)

6.3 Asia Pacific Redistribution Layer Material Market Forecast and Analysis

7. Asia Pacific Redistribution Layer Material Market Analysis - Type

7.1 Polyimide (PI)

7.1.1 Overview

7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)

7.2 Polybenzoxazole (PBO)

7.2.1 Overview

7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)

7.3 Benzocylobutene (BCB)

7.3.1 Overview

7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)

7.4 Others

7.4.1 Overview

7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. Asia Pacific Redistribution Layer Material Market Analysis - Application

8.1 Fan-Out Wafer Level Packaging (FOWLP)

8.1.1 Overview

8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)

8.2 2 5D/3D IC Packaging

8.2.1 Overview

8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)

8.2.3 High Bandwidth Memory (HBM)

8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)

8.2.4 Multi-Chip Integration

8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)

8.2.5 Package on Package (FOPOP)

8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)

8.2.6 Others

8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Asia Pacific Redistribution Layer Material Market - Country Analysis

9.1 Overview

9.1.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries

9.1.1.1 Redistribution Layer Material Market Breakdown by Country

9.1.1.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.3.1 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.2 China Redistribution Layer Material Market Breakdown by Type

9.1.1.3.3 China Redistribution Layer Material Market Breakdown by Application

9.1.1.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type

9.1.1.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application

9.1.1.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.7.1 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.2 Japan Redistribution Layer Material Market Breakdown by Type

9.1.1.7.3 Japan Redistribution Layer Material Market Breakdown by Application

9.1.1.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.9.1 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.2 South Korea Redistribution Layer Material Market Breakdown by Type

9.1.1.9.3 South Korea Redistribution Layer Material Market Breakdown by Application

9.1.1.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type

9.1.1.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

11.1 Heat Map Analysis by Key Players

11.2 Company Positioning & Concentration

11. Industry Landscape

12.1 Overview

12.2 Market Initiative

12.3 New Product Development

12.4 Merger and Acquisition

12. Company Profiles

12.1 SK Hynix Inc

13.1.1 Key Facts

13.1.2 Business Description

13.1.3 Products and Services

13.1.4 Financial Overview

13.1.5 SWOT Analysis

13.1.6 Key Developments

12.2 Samsung Electronics Co Ltd

13.2.1 Key Facts

13.2.2 Business Description

13.2.3 Products and Services

13.2.4 Financial Overview

13.2.5 SWOT Analysis

13.2.6 Key Developments

12.3 Infineon Technologies AG

13.3.1 Key Facts

13.3.2 Business Description

13.3.3 Products and Services

13.3.4 Financial Overview

13.3.5 SWOT Analysis

13.3.6 Key Developments

12.4 DuPont de Nemours Inc

13.4.1 Key Facts

13.4.2 Business Description

13.4.3 Products and Services

13.4.4 Financial Overview

13.4.5 SWOT Analysis

13.4.6 Key Developments

12.5 FUJIFILM Holdings Corp

13.5.1 Key Facts

13.5.2 Business Description

13.5.3 Products and Services

13.5.4 Financial Overview

13.5.5 SWOT Analysis

13.5.6 Key Developments

12.6 Amkor Technology Inc

13.6.1 Key Facts

13.6.2 Business Description

13.6.3 Products and Services

13.6.4 Financial Overview

13.6.5 SWOT Analysis

13.6.6 Key Developments

12.7 ASE Technology Holding Co Ltd

13.7.1 Key Facts

13.7.2 Business Description

13.7.3 Products and Services

13.7.4 Financial Overview

13.7.5 SWOT Analysis

13.7.6 Key Developments

12.8 NXP Semiconductors NV

13.8.1 Key Facts

13.8.2 Business Description

13.8.3 Products and Services

13.8.4 Financial Overview

13.8.5 SWOT Analysis

13.8.6 Key Developments

12.9 JCET Group Co Ltd

13.9.1 Key Facts

13.9.2 Business Description

13.9.3 Products and Services

13.9.4 Financial Overview

13.9.5 SWOT Analysis

13.9.6 Key Developments

12.10 Shin-Etsu Chemical Co Ltd

13.10.1 Key Facts

13.10.2 Business Description

13.10.3 Products and Services

13.10.4 Financial Overview

13.10.5 SWOT Analysis

13.10.6 Key Developments

13. Appendix

List of Tables

Table 1. Asia Pacific Redistribution Layer Material Market Segmentation

Table 2. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Table 3. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Table 4. Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type

Table 5. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Type

Table 6. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Application

Table 7. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 8. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 9. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 10. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 11. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 12. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 13. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 14. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 15. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 16. South Korea Redistribution Layer Material Market Revenue and Forecasts To 2030 (Kilo Ton) - By Type

Table 17. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 18. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 19. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 20. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 21. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 22. Company Positioning & Concentration

List of Figures

Figure 1. Asia Pacific Redistribution Layer Material Market Segmentation, By Country

Figure 2. Porter's Five Forces Analysis

Figure 3. Ecosystem: Asia Pacific Redistribution Layer Material Market

Figure 4. Market Dynamics: Asia Pacific Redistribution Layer Material Market

Figure 5. Asia Pacific Redistribution Layer Material Market Impact Analysis of Drivers and Restraints

Figure 6. Asia Pacific Redistribution Layer Material Market Volume (Tons), 2020 - 2030

Figure 7. Asia Pacific Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030

Figure 8. Asia Pacific Redistribution Layer Material Market Share (%) - Type, 2022 and 2030

Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)

Figure 10. Polyimide (PI) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)

Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)

Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 15. Others Market Volume and Forecasts To 2030 (Tons)

Figure 16. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 17. Asia Pacific Redistribution Layer Material Market Share (%) - Application, 2022 and 2030

Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts to 2030 (US$ Million)

Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 21. Multi-Chip Integration Market Revenue and Forecasts to 2030 (US$ Million)

Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 23. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 24. Asia Pacific Redistribution Layer Material Market Breakdown by Key Countries, (2022) (US$ Million)

Figure 25. Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)

Figure 26. China Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 27. China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 28. Taiwan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 29. Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 30. Japan Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 31. Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 32. South Korea Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 33. South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 34. Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 35. Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 36. Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 37. Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 38. Redistribution Layer Material Market Breakdown by Type (2022 and 2030)

Figure 39. Heat Map Analysis by Key Players

1. SK Hynix Inc

2. Samsung Electronics Co Ltd

3. Infineon Technologies AG

4. DuPont de Nemours Inc

5. FUJIFILM Holdings Corp

6. Amkor Technology Inc

7. ASE Technology Holding Co Ltd

8. NXP Semiconductors NV

9. JCET Group Co Ltd

10. Shin-Etsu Chemical Co Ltd

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the Asia Pacific redistribution layer material market.
Highlights key business priorities in order to assist companies to realign their business strategies.
The key findings and recommendations highlight crucial progressive industry trends in Asia Pacific redistribution layer material market, thereby allowing players across the value chain to develop effective long-term strategies.
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
Scrutinize in-depth Asia Pacific market trends and outlook coupled with the factors driving the redistribution layer material market, as well as those hindering it.
Enhance the decision-making process by understanding the strategies that underpin security interest with respect to client products, segmentation, pricing, and distribution.

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