The semiconductor bonding market in Asia Pacific is expected to grow from US$ 274.55 million in 2022 to US$ 469.89 million by 2028. It is estimated to grow at a CAGR of 9.4% from 2022 to 2028.
Adoption of Die Bonding in Telecommunication
The growing demand for high-performance optical communication devices boosts 5G deployment and datacenter applications. Further, this supports 5G wireless fronthaul and next-generation Ethernet modules, which include 2x200GbE, 4x100GbE, 400GbE, and CWDM/DWDM transceivers. The demand for high-performance optical devices is also generating requirements for smaller packaging housing, rapid technology innovation, smaller chips/dies with higher density in the package, higher-volume manufacturing, quick product iterations, and an economical price point. The new requirements are also needed in lidar, AR/VR, advanced photonic sensors, MEMS, and highly integrated silicon photonics devices. For manufacturing all the above devices, successfully deploying flexible die bonding solutions with high post-bonding accuracy and great long-term stability is required. Various manufacturers are producing flexible high bonding solutions to meet this requirement. For instance, MRSI-HVM by MRSI Systems is a flexible high-speed die bonder which can achieve <±1.5 µm @ 3 sigma. Thus, with this, the company provides the best manufacturing solution for increasing volume and mix in manufacturing 5G and datacenter core devices.
Market Overview
Australia, China, India, Japan, South Korea, and rest of Asia Pacific are the key contributors to the semiconductor bonding market in the Asia Pacific. The market growth is attributed to the presence of several OSAT (Outsourced Semiconductor Assembly and Test) players in Taiwan and China. In February 2021, SMIC (Semiconductor Manufacturing International Co) announced the total investment of US$ 9.06 billion in Shanghai wafer plant with the government-backed China Integrated Circuit Industry Investment Fund. Similarly, in June 2020, GlobalWafers Co., Ltd invested US$ 339 million in its Taisil (Taiwan) branch to upsurge 300-mm silicon wafer capabilities. This enhanced capacity is projected to meet the growing demand for high-quality silicon wafers. Such developments in the region are driving the demand for wafer bonding devices. ASM Pacific Technology; DIAS Automation (HK) Ltd; Kulicke and Soffa Industries, Inc; Panasonic Corporation; SHINKAWA Electric Co., Ltd; and TORAY ENGINEERING Co. Ltd are a few of the prominent companies operating in the Asia Pacific semiconductor bonding market. These companies are majorly focusing on the market for MEMS sensors, LED sensors, and CMOS image sensors. The increasing number of Integrated Device Manufacturer (IDMs) and bulk manufacturing of electronic devices such as smart watches, mobile phones, and household appliances in China and Taiwan is projected to boost the market growth. For example, HANIMI Semiconductor Co. Ltd has launched its new Flip Chip Bonder-5.0. Its major focus is on high-end semiconductor production, which is propelling the demand for semiconductor bonding.
Asia Pacific Semiconductor Bonding Market Segmentation
The Asia Pacific semiconductor bonding market is segmented into type, application, and country.
ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the Asia Pacific region.
| Report Attribute | Details |
|---|---|
| Market size in 2022 | US$ 274.55 Million |
| Market Size by 2028 | US$ 469.89 Million |
| CAGR (2022 - 2028) | 9.4% |
| Historical Data | 2020-2021 |
| Forecast period | 2023-2028 |
| Segments Covered |
By Type
|
| Regions and Countries Covered |
Asia-Pacific
|
| Market leaders and key company profiles |
|
The Asia Pacific Semiconductor Bonding Market is valued at US$ 274.55 Million in 2022, it is projected to reach US$ 469.89 Million by 2028.
As per our report Asia Pacific Semiconductor Bonding Market, the market size is valued at US$ 274.55 Million in 2022, projecting it to reach US$ 469.89 Million by 2028. This translates to a CAGR of approximately 9.4% during the forecast period.
The Asia Pacific Semiconductor Bonding Market report typically cover these key segments-
The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Asia Pacific Semiconductor Bonding Market report:
The Asia Pacific Semiconductor Bonding Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
The Asia Pacific Semiconductor Bonding Market report is valuable for diverse stakeholders, including:
Essentially, anyone involved in or considering involvement in the Asia Pacific Semiconductor Bonding Market value chain can benefit from the information contained in a comprehensive market report.
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