
Published On: Dec 2022
Published On: Dec 2022
At 9.4% CAGR, the Asia Pacific Semiconductor Bonding Market is projected to be worth US$ 469.89 million by 2028, says Business Market Insights
According to the Insight Partners’ research, the Asia Pacific semiconductor bonding market was valued at US$ 274.55 million in 2022 and is expected to reach US$ 469.89 million by 2028, registering a CAGR of 9.4% from 2022 to 2028. Rising demand for hybrid bonding and adoption of die bonding in telecommunication are the critical factors attributed to the market expansion.
The growing need for I/O density and faster connections between chips is transforming system designs that include 3D architectures and hybrid bonding. Hybrid bonding connects power and signal-carrying copper pads and the surrounding dielectric through die-to-wafer or wafer-to-wafer connections, providing up to 1,000X more connections than copper microbumps. While accelerating bump density by three orders of magnitude above 2.5D integration techniques, it reduces signal delay to approximately nonexistent levels. Hybrid bonding is currently only used in a few high-end applications, such as processor/cache and HBM (High Bandwidth Memory), but it is expected that its adoption will increase in 3D DRAM, RF modems, and GaN/Si bonding for microbleeds’. Hybrid bonding presents a practical alternative to transistor node scaling, where high performance is required. Thus, to meet the enormous demand from high-end processors, HBM, microLED, and other applications, hybrid bonding will create a lucrative opportunity for the growth of the Asia Pacific semiconductor bonding market during the forecast period. Moreover, various market players are forming joint ventures and agreements to cater to the growing demand for hybrid bonding. Thus, various collaborative approaches by the market players in bringing forward the hybrid bonding technology will further lead to the growth of the Asia Pacific semiconductor bonding market during the forecast period.
On the contrary, fluctuation in the price of semiconductor components hurdles the growth of Asia Pacific semiconductor bonding market.
Key players profiles in the Asia Pacific semiconductor bonding market report are ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation, among others.
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