At 9.4% CAGR, the Asia Pacific Semiconductor Bonding Market is projected to be worth US$ 469.89 million by 2028, says Business Market Insights

According to the Insight Partners’ research, the Asia Pacific semiconductor bonding market was valued at US$ 274.55 million in 2022 and is expected to reach US$ 469.89 million by 2028, registering a CAGR of 9.4% from 2022 to 2028. Rising demand for hybrid bonding and adoption of die bonding in telecommunication are the critical factors attributed to the market expansion.

The growing need for I/O density and faster connections between chips is transforming system designs that include 3D architectures and hybrid bonding. Hybrid bonding connects power and signal-carrying copper pads and the surrounding dielectric through die-to-wafer or wafer-to-wafer connections, providing up to 1,000X more connections than copper microbumps. While accelerating bump density by three orders of magnitude above 2.5D integration techniques, it reduces signal delay to approximately nonexistent levels. Hybrid bonding is currently only used in a few high-end applications, such as processor/cache and HBM (High Bandwidth Memory), but it is expected that its adoption will increase in 3D DRAM, RF modems, and GaN/Si bonding for microbleeds’. Hybrid bonding presents a practical alternative to transistor node scaling, where high performance is required. Thus, to meet the enormous demand from high-end processors, HBM, microLED, and other applications, hybrid bonding will create a lucrative opportunity for the growth of the Asia Pacific semiconductor bonding market during the forecast period. Moreover, various market players are forming joint ventures and agreements to cater to the growing demand for hybrid bonding. Thus, various collaborative approaches by the market players in bringing forward the hybrid bonding technology will further lead to the growth of the Asia Pacific semiconductor bonding market during the forecast period.

On the contrary, fluctuation in the price of semiconductor components hurdles the growth of Asia Pacific semiconductor bonding market.

• Based on type, the Asia Pacific semiconductor bonding market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment held 42.5% market share in 2022, amassing US$ 116.57 million. It is projected to garner US$ 197.04 million by 2028 to expand at 9.1% CAGR during 2022–2028.
• Based on application, the Asia Pacific semiconductor bonding market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D Nand. The MEMS and sensors segment held 35.2% market share in 2022, amassing US$ 96.73 million. It is projected to garner US$ 184.18 million by 2028 to expand at 11.3% CAGR during 2022–2028.
• Based on country, the Asia Pacific semiconductor bonding market has been categorized into Australia, China, India, Japan, South Korea, and rest of Asia Pacific. Our regional analysis states that rest of Asia Pacific captured 30.2% market share in 2022. It was assessed at US$ 82.88 million in 2022 and is likely to hit US$ 153.61 million by 2028, exhibiting a CAGR of 10.8% during the forecast period.

Key players profiles in the Asia Pacific semiconductor bonding market report are ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation, among others.

• Jul-2022, EV Group (EVG) announced it had achieved a breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating a 100-percent void-free bonding yield of multiple dies of varied sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using EVG's GEMINI FB automated hybrid bonding system.

• Nov-2021, EV Group (EVG) introduced the EVG 40 NT2 automated metrology system, which provides overlay and critical dimension (CD) measurements for wafer-to-wafer (W2W), die-to-wafer (D2W), and die-to-die (D2D) bonding as well as maskless lithography applications.

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