亚太地区后壳市场预测至 2028 年 - COVID-19 影响和区域分析(按类型(圆形后壳和矩形后壳)、材料(铝、镍、不锈钢等)、军用标准(AS85049、MIL-DTL-38999、MIL) -DTL-83723、MIL-DTL-5015、MIL-DTL-26482 等)和应用(地面、海军和空中)

Historic Data: 2019-2020   |   Base Year: 2021   |   Forecast Period: 2022-2028


No. of Pages: 147    |    Report Code: TIPRE00025320    |    Category: Aerospace and Defense

Asia Pacific Backshell Market

市场介绍

军事现代化、经济繁荣、恐怖活动增加和领土争端对各国国防工业的发展产生了积极影响过去十年亚太国家。这也推动了对先进防御装备的需求,例如智能武器、装甲和非装甲军车、导弹防御系统和C4ISR系统。这些因素正在推动整个地区航空航天和国防工业的增长。中国、印度和日本等国家政府机构为支持飞机和军用车辆的制造而增加的投资,以及对军用飞机采购的投资,促进了整个地区后壳市场的增长。例如,2017年6月,洛克希德·马丁公司和塔塔先进系统公司在“印度制造”倡议下建立了战略合作伙伴关系,在印度制造F-16 Block 70飞机。这些举措预计将增加飞机制造所需零部件的需求,从而推动亚太地区后壳市场的增长。

由于广泛的疾病,COVID-19 大流行已严重影响亚太地区传播;该地区国家属于世界上人口稠密的国家,这导致感染传播的风险更大。许多全球品牌和科技公司的总部都设在该地区。经济合作与发展组织(OECD)表示,疫情影响了中国、印度、澳大利亚、日本等主要经济体,这些国家都出现了通货膨胀。自 2020 年初以来,COVID-19 大流行的迅速爆发导致该地区实施了严格的封锁。由于全国病例不断增加,印度等部分地区仍面临封锁。中国各工厂的封锁影响了全球供应链,并对各种产品和服务的开发、交付时间表产生了负面影响。尽管中国的工厂开始重新开业,但一些企业已经减少或暂停了运营。该地区由多个发展中国家组成,拥有大量制造设施。所有经济活动的暂时关闭和旅行限制大大减少了航空乘客,导致他们对飞机的需求较低。此外,各国实施的旅行限制还导致印度和中国等主要经济体的制造零部件和最终产品的供应链中断。由于 COVID-19 的爆发,这些因素对市场产生了负面影响。

市场概况和动态

后壳亚太地区市场预计将从2021年的1.057亿美元增长到2028年的1.7464亿美元;预计 2021 年至 2028 年复合年增长率为 7.4%。随着世界战争继续以不同方式出现,各国计划并采取措施来改善和重组其国防状况。威胁在不断演变,即从传统的陆基武力到混合战争。为了应对安全威胁和打击恐怖主义,一些国家的政府已经开始增加国防预算。中国和印度是国防预算逐年增加的主要国家之一。大量军事预算被分配用于采购先进的军用航母和作战飞机、车辆和海军舰艇。 AS85049 系列、MIL-DTL-38999、MIL-DTL-83723、MIL-DTL-5015 和 MIL-DTL-26482 是一些主要的军用级连接器,广泛用于先进军用航母和战斗机的组件、车辆和海军舰艇。为了保护连接器,各个制造商正在生产几种与上述连接器具有类似军用等级的后壳。在当前情况下,这正在催化后壳市场的增长。从军用飞机、军用地面车辆、海军舰艇的产量来看,产量都在以较快的速度增长,支撑着后壳市场的增长。

Key细分市场

从类型来看,2020年圆形细分市场份额较大。从材质来看,2020年不锈钢细分市场份额最大。从军用标准来看,2020年AS85049系列细分市场份额最大。从应用来看,2020年地面细分市场份额最大。

主要来源及上市公司

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准备本亚太地区后壳市场报告时提到的一些主要一手和二手来源是公司网站、年度报告、财务报告、国家政府文件和统计数据库等。报告中列出的主要公司有安费诺公司(Amphen Corporation);柯林斯航空航天公司; TE 连接;苏里奥阳光银行;艾睿电子公司;格莱奈尔公司;柯蒂斯莱特公司;和 PEI-Genesis.com 等

 

 

 

购买报告的理由< /strong>

  • 了解亚太地区后壳市场格局,并确定最有可能保证丰厚回报的细分市场
  • 通过了解不断变化的趋势,在竞争中保持领先地位-亚太后壳市场不断变化的竞争格局
  • 通过识别最有可能销售的细分市场,有效规划亚太后壳市场的并购和合作伙伴交易
  • 帮助吸收知识丰富的人才通过对亚太后壳市场各个细分市场的市场表现进行敏锐和全面的分析来做出业务决策
  • 获取亚太地区各个细分市场 2021-2028 年的市场收入预测

 

亚太地区后壳市场细分

 

亚太后壳市场 –按

类型

  • 圆形
  • 矩形

亚太后壳市场 –按材质

  • 不锈钢
  • 其他

亚太后壳市场 –按军用标准

  • AS85049系列
  • MIL-DTL-38999
  • MIL-DTL-83723
  • MIL-DTL-5015
  • MIL-DTL-26482
  • 其他

亚太后壳市场–按应用

  • 地面
  • 海军
  • 空中
  • 商用飞机
  •  
  • 军用飞机

亚太后壳市场 –

国家

  • 澳大利亚
  • 中国
  • 印度
  • 日本
  • 韩国
  • 亚太地区其他地区

亚太后壳市场;提及的公司

  • 安费诺公司

  • 安费诺公司;  
  • 柯林斯航空航天公司                 ;      
  • TE Connectivity           ;               
  • Souriau Sunbank (伊顿)  ;         
  • 艾睿电子有限公司         ;      
  • Glenair, Inc.                             ;    
  • Curtiss-Wright Corporation         
  • PEI-Genesis.com   ;            


Asia Pacific Backshell Strategic Insights

Strategic insights for Asia Pacific Backshell involve closely monitoring industry trends, consumer behaviours, and competitor actions to identify opportunities for growth. By leveraging data analytics, businesses can anticipate market shifts and make informed decisions that align with evolving customer needs. Understanding these dynamics helps companies adjust their strategies proactively, enhance customer engagement, and strengthen their competitive edge. Building strong relationships with stakeholders and staying agile in response to changes ensures long-term success in any market.

strategic-framework/asia-pacific-backshell-market-strategic-framework.webp
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Asia Pacific Backshell Report Scope

Report Attribute Details
Market size in 2021 US$ 105.70 Million
Market Size by 2028 US$ 174.64 Million
Global CAGR (2021 - 2028) 7.4%
Historical Data 2019-2020
Forecast period 2022-2028
Segments Covered By 类型
  • 圆形后壳
  • 矩形后壳
By 材质
  • 铝
  • 镍
  • 不锈钢
By 军用标准
  • AS85049
  • MIL-DTL-38999
  • MIL-DTL-83723
  • MIL-DTL-5015
  • MIL-DTL-26482
By 应用
  • 地面
  • 海军
  • 空中
Regions and Countries Covered 亚太地区
  • 中国
  • 印度
  • 日本
  • 澳大利亚
  • 亚太其他地区
Market leaders and key company profiles
  • Amphenol Corporation
  • Collins Aerospace
  • TE Connectivity
  • Souriau Sunbank (EATON)
  • Arrow Electronics, Inc.
  • Glenair, Inc.
  • Curtiss-Wright Corporation
  • PEI-Genesis.com
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    Asia Pacific Backshell Regional Insights

    The regional scope of Asia Pacific Backshell refers to the geographical area in which a business operates and competes. Understanding regional nuances, such as local consumer preferences, economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved regions or adapting their offerings to meet regional demands. A clear regional focus allows for more effective resource allocation, targeted marketing, and better positioning against local competitors, ultimately driving growth in those specific areas.

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    The List of Companies - Asia Pacific Backshell Market

    1. Amphenol Corporation                 
    2. Collins Aerospace                           
    3. TE Connectivity                               
    4. Souriau Sunbank (EATON)            
    5. Arrow Electronics, Inc.                  
    6. Glenair, Inc.                                     
    7. Curtiss-Wright Corporation          
    8. PEI-Genesis.com  
    Frequently Asked Questions
    How big is the Asia Pacific Backshell Market?

    The Asia Pacific Backshell Market is valued at US$ 105.70 Million in 2021, it is projected to reach US$ 174.64 Million by 2028.

    What is the CAGR for Asia Pacific Backshell Market by (2021 - 2028)?

    As per our report Asia Pacific Backshell Market, the market size is valued at US$ 105.70 Million in 2021, projecting it to reach US$ 174.64 Million by 2028. This translates to a CAGR of approximately 7.4% during the forecast period.

    What segments are covered in this report?

    The Asia Pacific Backshell Market report typically cover these key segments-

  • 类型 (圆形后壳, 矩形后壳)
  • 材质 (铝, 镍, 不锈钢)
  • 军用标准 (AS85049, MIL-DTL-38999, MIL-DTL-83723, MIL-DTL-5015, MIL-DTL-26482)
  • What is the historic period, base year, and forecast period taken for Asia Pacific Backshell Market?

    The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Asia Pacific Backshell Market report:

  • Historic Period : 2019-2020
  • Base Year : 2021
  • Forecast Period : 2022-2028
  • Who are the major players in Asia Pacific Backshell Market?

    The Asia Pacific Backshell Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:

  • Amphenol Corporation
  • Collins Aerospace
  • TE Connectivity
  • Souriau Sunbank (EATON)
  • Arrow Electronics, Inc.
  • Glenair, Inc.
  • Curtiss-Wright Corporation
  • PEI-Genesis.com
  • Who should buy this report?

    The Asia Pacific Backshell Market report is valuable for diverse stakeholders, including:

    • Investors: Provides insights for investment decisions pertaining to market growth, companies, or industry insights. Helps assess market attractiveness and potential returns.
    • Industry Players: Offers competitive intelligence, market sizing, and trend analysis to inform strategic planning, product development, and sales strategies.
    • Suppliers and Manufacturers: Helps understand market demand for components, materials, and services related to concerned industry.
    • Researchers and Consultants: Provides data and analysis for academic research, consulting projects, and market studies.
    • Financial Institutions: Helps assess risks and opportunities associated with financing or investing in the concerned market.

    Essentially, anyone involved in or considering involvement in the Asia Pacific Backshell Market value chain can benefit from the information contained in a comprehensive market report.