
No. of Pages: 130 | Report Code: TIPRE00022130 | Category: Electronics and Semiconductor
No. of Pages: 130 | Report Code: TIPRE00022130 | Category: Electronics and Semiconductor
1. Introduction
1.1 Study Scope
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
1.3.1 APAC Embedded Die Packaging Technology Market – By Platform
1.3.2 APAC Embedded Die Packaging Technology Market – By Application
1.3.3 APAC Embedded Die Packaging Technology Market – By Industry
1.3.4 APAC Embedded Die Packaging Technology Market- By Country
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. APAC Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 APAC PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinion
5. APAC Embedded Die Packaging Technology Market – Key Market Dynamics
5.1 Market Drivers
5.1.1 Burgeoning Demand for Miniaturization of Electronic Devices
5.1.2 Escalating Developments in Embedded Die Packaging Technology
5.2 Market Restraints
5.2.1 Technical Issues and Availability of Alternative Solutions
5.3 Market Opportunities
5.3.1 Surging Demand to Enhance Smartphone and Automotive Device Performance
5.4 Future Trends
5.4.1 Mounting Adoption of Wearable Devices and Internet of Things
5.5 Impact Analysis of Drivers and Restraints
6. Embedded Die Packaging Technology Market – APAC Analysis
6.1 APAC Embedded Die Packaging Technology Market Overview
6.2 APAC Embedded Die Packaging Technology Market –Revenue and Forecast to 2028 (US$ Thousand)
7. APAC Embedded Die Packaging Technology Market Analysis – By Platform
7.1 Overview
7.2 APAC Embedded Die Packaging Technology Market, By Platform (2020 and 2028)
7.3 IC Package Substrate
7.3.1 Overview
7.3.2 IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.4 Rigid Board
7.4.1 Overview
7.4.2 Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.5 Flexible Board
7.5.1 Overview
7.5.2 Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8. APAC Embedded Die Packaging Technology Market – By Application
8.1 Overview
8.2 APAC Embedded Die Packaging Technology Market, by Application (2020 and 2028)
8.3 Smartphone and Tablets
8.3.1 Overview
8.3.2 Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.4 Medical and Wearable Devices
8.4.1 Overview
8.4.2 Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.5 Industrial Devices
8.5.1 Overview
8.5.2 Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.6 Security Devices
8.6.1 Overview
8.6.2 Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.7 Other Applications
8.7.1 Overview
8.7.2 Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9. APAC Embedded Die Packaging Technology Market – By Industry
9.1 Overview
9.2 APAC Embedded Die Packaging Technology Market, by Industry (2020 and 2028)
9.3 Consumer Electronics
9.3.1 Overview
9.3.2 Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.4 IT and Telecommunication
9.4.1 Overview
9.4.2 IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.5 Automotive
9.5.1 Overview
9.5.2 Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.6 Healthcare
9.6.1 Overview
9.6.2 Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.7 Other Industries
9.7.1 Overview
9.7.2 Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10. APAC Embedded Die Packaging Technology Market – Country Analysis
10.1 Overview
10.1.1 APAC: Embedded Die Packaging Technology Market- by Key Country
10.1.1.1 Australia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.1.1 Australia: Embedded Die Packaging Technology Market- By Platform
10.1.1.1.2 Australia: Embedded Die Packaging Technology Market- By Application
10.1.1.1.3 Australia: Embedded Die Packaging Technology Market- By Industry
10.1.1.2 China: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.2.1 China: Embedded Die Packaging Technology Market- By Platform
10.1.1.2.2 China: Embedded Die Packaging Technology Market- By Application
10.1.1.2.3 China: Embedded Die Packaging Technology Market- By Industry
10.1.1.3 India: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.3.1 India: Embedded Die Packaging Technology Market- By Platform
10.1.1.3.2 India: Embedded Die Packaging Technology Market- By Application
10.1.1.3.3 India: Embedded Die Packaging Technology Market- By Industry
10.1.1.4 Japan: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.4.1 Japan: Embedded Die Packaging Technology Market- By Platform
10.1.1.4.2 Japan: Embedded Die Packaging Technology Market- By Application
10.1.1.4.3 Japan: Embedded Die Packaging Technology Market- By Industry
10.1.1.5 South Korea: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.5.1 South Korea: Embedded Die Packaging Technology Market- By Platform
10.1.1.5.2 South Korea: Embedded Die Packaging Technology Market- By Application
10.1.1.5.3 South Korea: Embedded Die Packaging Technology Market- By Industry
10.1.1.6 Rest of APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.6.1 Rest of APAC: Embedded Die Packaging Technology Market- By Platform
10.1.1.6.2 Rest of APAC: Embedded Die Packaging Technology Market- By Application
10.1.1.6.3 Rest of APAC: Embedded Die Packaging Technology Market- By Industry
11. APAC Embedded Die Packaging Technology Market- COVID-19 Impact Analysis
11.1 APAC
12. Industry Landscape
12.1 Overview
12.2 Market Initiative
12.3 New Product Development
13. Company Profiles
13.1 ASE Group
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Amkor Technology, Inc.
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 Fujikura Ltd.
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 General Electric Company
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 Infineon Technologies AG
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Microsemi
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Shinko Electric Industries Co., Ltd.
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 Schweizer Electronic AG
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
13.10 Taiwan Semiconductor Manufacturing Company, Limited
13.10.1 Key Facts
13.10.2 Business Description
13.10.3 Products and Services
13.10.4 Financial Overview
13.10.5 SWOT Analysis
13.10.6 Key Developments
14. Appendix
14.1 About The Insight Partners
14.2 Word Index
LIST OF TABLES
Table 1. APAC Embedded Die Packaging Technology Market – Revenue, and Forecast to 2028 (US$ Thousand)
Table 2. Australia: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 3. Australia: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 4. Australia: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 5. China: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 6. China: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 7. China: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 8. India: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 9. India: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 10. India: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 11. Japan: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 12. Japan: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 13. Japan: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 14. South Korea: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 15. South Korea: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 16. South Korea: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 17. Rest of APAC: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 18. Rest of APAC: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 19. Rest of APAC: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 20. List of Abbreviation
LIST OF FIGURES
Figure 1. APAC Embedded Die Packaging Technology Market Segmentation
Figure 2. APAC Embedded Die Packaging Technology Market Segmentation – By Country
Figure 3. APAC Embedded Die Packaging Technology Market Overview
Figure 4. IC Package Substrate Platform Held the Largest Market Share in 2020
Figure 5. Smartphones and Tablets Held the Largest Market Share in 2020
Figure 6. Consumer Electronics Held the Largest Market Share in 2020
Figure 7. China was the Largest Revenue Contributor in 2020
Figure 8. APAC – PEST Analysis
Figure 9. APAC Embedded Die Packaging Technology Market– Ecosystem Analysis
Figure 10. Expert Opinion
Figure 11. APAC Embedded Die Packaging Technology Market Impact Analysis of Drivers and Restraints
Figure 12. APAC Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 13. APAC Embedded Die Packaging Technology Market Revenue Share, by Platform (2020 and 2028)
Figure 14. APAC IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 15. APAC Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 16. APAC Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 17. APAC Embedded Die Packaging Technology Market Revenue Share, by Application (2020 and 2028)
Figure 18. APAC Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 19. APAC Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 20. APAC Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 21. APAC Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 22. APAC Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 23. APAC Embedded Die Packaging Technology Market Revenue Share, by Industry (2020 and 2028)
Figure 24. APAC Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 25. APAC IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 26. APAC Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 27. APAC Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 28. APAC Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 29. APAC: Embedded Die Packaging Technology Market, by Key Country – Revenue (2020) (USD Thousand)
Figure 30. APAC: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)
Figure 31. Australia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 32. China: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 33. India: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 34. Japan: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 35. South Korea: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 36. Rest of APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 37. Impact of COVID-19 Pandemic in APAC Country Markets