Analysis By Platform (IC Package Substrate, Rigid Board, and Flexible Board), Application (Smartphone and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications), and Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Other Industries)
No. of Pages:130
Report Code:
TIPRE00022130
Category:
Electronics and Semiconductor
Asia Pacific Embedded Die Packaging Technology Market
Taiwan and China are the leading semiconductor manufacturing countries in APAC. Rising disposable income in developing countries, such as India and China are leading to a large client base for high-tech consumer electronics such as smart wearables, smartphones, and electric vehicles. This factor is expected to drive the embedded die packaging technology market growth. China is a leading manufacturing hub for the IC packaging technology-based products, while Taiwan, South Korea, and Japan are also significant contributors to the regional market growth. Many of the APAC countries are characterized by the mass production of electronic devices required for consumer electronics, automotive components, telecommunication devices, and other industrial machineries. Rising number of electronics manufacturing companies in India and China owing to strong availability of skilled human resources is driving the embedded die packaging technology market growth. According to the Cisco annual internet report, Asia Pacific would mark ~3.1 billion Internet users by 2023. Further, according to the Ericsson Mobility Report, their mobile connections in Asia Pacific are expected rise from ~4 billion to 4.6 billion by 2021. Increase in smartphones and advanced internet connecting devices is anticipated to support the adoption of the embedded die packaging technology in components such as ICs, RF modules, and processors.
In case of COVID-19, APAC is highly affected specially India. Countries such as China, India, South Korea, and Japan are moving toward new networking solutions such as 5G, 4G, and VoLTE. China and India are the most prominent manufacturing hub in the region and have an enhanced focus on industrialization. The growth of the manufacturing industry has been hampered due to lockdown but soon recovered the development by enhancing the production capabilities in the second half of the year. The demand for advanced electronics such as a smartwatch, smart wearables, and healthcare machines has risen significantly. Also, companies in the Asian region have restructured their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, in 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea
Market Overview and Dynamics
The APAC embedded die packaging technology market is expected to grow from US$ 32,019.28 thousand in 2020 to US$ 1,21,957.05 thousand by 2028; it is estimated to grow at a CAGR of 18.5 % from 2021 to 2028. Burgeoning demand for miniaturization of electronic devices is expected to surge the APAC embedded die packaging technology market. The growing trend of the small form factor-based handheld electronic devices is one of the significant factors accelerating the APAC market growth. Technological advancements, such as miniaturization, in electronics forming have influenced various markets including military, aerospace, medical, retail, and consumer electronics. Devices with small form factor-based packages embed more functionality and are considered the best alternative for traditional packaging systems. Personalized healthcare gadgets, thin-sized smartphones, and compact PCs are equipped with embedded die packaging technology-based components, such as ICs, processors, sensors, and RF modules. Continuous development in advanced packaging technologies, including flexible boards and IC package substrate, further supplement the APAC market growth by resolving the technical challenges. Innovations in solutions such as multi-die integration and flexible ICs enhance device performance by offering small form factors. New packaging technologies are aiding the integration of multiple components in a single die. Moreover, market players across APAC region are making efforts to optimize the embedded die packaging technology for better solution formation. The embedded die packaging technology is used to form chiplets with high bandwidth and low power consumption. So the miniaturization of electronics devices is expected to increase the demand of embedded die packaging technology, which will drive the APAC embedded die packaging technology market.
Key Market Segments
In terms of platform, the IC package substrate segment accounted for the largest share of the APAC embedded die packaging technology market in 2020. In terms of application, the smartphone and tablets segment held a larger market share of the APAC embedded die packaging technology market in 2020. Further, the consumer electronics segment held a larger share of the APAC embedded die packaging technology market based on industry in 2020.
Major Sources and Companies Listed
A few major primary and secondary sources referred to for preparing this report on the APAC embedded die packaging technology market are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; Shinko Electric Industries Co., Ltd.; and Taiwan Semiconductor Manufacturing Company, Limited
Reasons to buy report
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APAC Embedded Die Packaging Technology Market Segmentation
APAC Embedded Die Packaging Technology Market - By Platform
IC Package Substrate
Rigid Board
Flexible Board
APAC Embedded Die Packaging Technology Market -By Application
Smartphone and Tablets
Medical and Wearable Devices
Industrial Devices
Security Devices
Other Applications
APAC Embedded Die Packaging Technology Market -By Industry
Consumer Electronics
IT and Telecommunication
Automotive
Healthcare
Other Industries
APAC Embedded Die Packaging Technology Market - By Country
Australia
China
India
Japan
South Korea
Rest of APAC
APAC Embedded Die Packaging Technology Market - Company Profiles
Amkor Technology, Inc.
ASE Group
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
How big is the Asia Pacific Embedded Die Packaging Technology Market?
The Asia Pacific Embedded Die Packaging Technology Market is valued at US$ 32,019.28 thousand in 2020, it is projected to reach US$ 1,21,957.05 thousand by 2028.
What is the CAGR for Asia Pacific Embedded Die Packaging Technology Market by (2021 - 2028)?
As per our report Asia Pacific Embedded Die Packaging Technology Market, the market size is valued at US$ 32,019.28 thousand in 2020, projecting it to reach US$ 1,21,957.05 thousand by 2028. This translates to a CAGR of approximately 18.5 % during the forecast period.
What segments are covered in this report?
The Asia Pacific Embedded Die Packaging Technology Market report typically cover these key segments-
Application (Smartphone and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, Other Applications)
Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, Other Industries)
What is the historic period, base year, and forecast period taken for Asia Pacific Embedded Die Packaging Technology Market?
The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Asia Pacific Embedded Die Packaging Technology Market report:
Historic Period : 2018-2019
Base Year : 2020
Forecast Period : 2021-2028
Who are the major players in Asia Pacific Embedded Die Packaging Technology Market?
The Asia Pacific Embedded Die Packaging Technology Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
Amkor Technology, Inc.
ASE Group
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
The Asia Pacific Embedded Die Packaging Technology Market report is valuable for diverse stakeholders, including:
Investors: Provides insights for investment decisions pertaining to market growth, companies, or industry insights. Helps assess market attractiveness and potential returns.
Industry Players: Offers competitive intelligence, market sizing, and trend analysis to inform strategic planning, product development, and sales strategies.
Suppliers and Manufacturers: Helps understand market demand for components, materials, and services related to concerned industry.
Researchers and Consultants: Provides data and analysis for academic research, consulting projects, and market studies.
Financial Institutions: Helps assess risks and opportunities associated with financing or investing in the concerned market.
Essentially, anyone involved in or considering involvement in the Asia Pacific Embedded Die Packaging Technology Market value chain can benefit from the information contained in a comprehensive market report.
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