Asia Pacific Power Discrete and Modules Market

Historic Data: 2019-2020   |   Base Year: 2021   |   Forecast Period: 2022-2028

Analysis By Type(Power Discrete, and Power Module),Application( Industrial, Consumer Electronics, IT and Telecom, Automotive, and Others) ,Material (Silicone, Silicon Carbide, and Gallium nitride ),Wafer Size(Up to 200 mm, and 300 mm )


No. of Pages: 100    |    Report Code: TIPRE00027081    |    Category: Electronics and Semiconductor

Asia Pacific Power Discrete and Modules Market
Buy Now

The Asia Pacific power discrete and module market in Asia Pacific is expected to grow from US$ 10,779.67 million in 2021 to US$ 18,189.68million by 2028; it is estimated to grow at a CAGR of 7.8% from 2021 to 2028.

A high voltage direct current (HVDC) electric power transmission system utilizes direct current for transmitting electrical power in contrast with the other common alternating current systems. The system is also known as electrical superhighway or power superhighway. High power IGBT (Insulated Gate Bipolar Transistor) module is one of the crucial components required for the flexible power transfer through a HVDC transmission system. The overhead HVDC power transmission system infrastructure can transmit more power than a high voltage alternating current (HVAC) system. The 3300 V 1500 A power IGBT modules are used in flexible HVDC projects in China and are expected to serve up to almost 30 to 40 years.

 

Except few developed countries such as Australia, South Korea and Japan, Asia Pacific region is still considered to be in developing state. The developing countries do not have required health infrastructure and this was the main reason that led to the increase in the count of recorded cases in 2020. As per the Organization for Economic Co-operation and Development (OECD), the pandemic has affected significant economies such as India, Australia and Japan to some extent. Due to inadequate health and medicine facilities, government authorities had to impose restrictions for working with limited workforce at production sites. In most of the highly populated countries such as China and India, the demand for power electronic components has witnessed a short downfall in 2020 wherein the overall impact of the pandemic across the market was positive.

 

With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the power discrete and module market. The Asia Pacific power discrete and module market is expected to grow at a good CAGR during the forecast period.

 

Asia Pacific Power Discrete and Modules Revenue and Forecast to 2028(US$ Million)
Asia Pacific Power Discrete and Modules Revenue and Forecast to 2028(US$ Million)

   

Asia Pacific Power Discrete and Modules Segmentation

By Type

  • Power Discrete
  • Power Module

By Application

  •  Industrial
  • Consumer Electronics
  •  IT & Telecom
  • Automotive
  • Others

By Material

  • Silicone (Si)
  • Silicon Carbide(SiC)
  • Gallium nitride(GaN)

By Wafer Size

  • Up to 200 mm
  • 300 mm

By Country

  • Asia Pacific
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia Pacific

Companies Mentioned -

  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • Toshiba Corporation
  • ON Semiconductor
  •  STMicroelectronics
  • NXP Semiconductors
  •  Renesas Electronics Corporation
  •  Texas Instruments
  •  ROHM Semiconductors
  •  Semtech Corporation

Asia Pacific Power Discrete and Modules Strategic Insights

Strategic insights for the Asia Pacific Power Discrete and Modules provides data-driven analysis of the industry landscape, including current trends, key players, and regional nuances. These insights offer actionable recommendations, enabling readers to differentiate themselves from competitors by identifying untapped segments or developing unique value propositions. Leveraging data analytics, these insights help industry players anticipate the market shifts, whether investors, manufacturers, or other stakeholders. A future-oriented perspective is essential, helping stakeholders anticipate market shifts and position themselves for long-term success in this dynamic region. Ultimately, effective strategic insights empower readers to make informed decisions that drive profitability and achieve their business objectives within the market.

strategic-framework/asia-pacific-power-discrete-and-modules-market-strategic-framework.webp
Get more information on this report

Asia Pacific Power Discrete and Modules Report Scope

Report Attribute Details
Market size in 2021 US$ 10,779.67 Million
Market Size by 2028 US$ 18,189.68 Million
Global CAGR (2021 - 2028) 7.8%
Historical Data 2019-2020
Forecast period 2022-2028
Segments Covered By Type
  • Power Discrete
  • Power Module
By Application
  • Industrial
  • Consumer Electronics
  • IT and Telecom
  • Automotive
By Material
  • Silicone
  • Silicon Carbide
  • Gallium nitride
By Wafer Size
  • Up to 200 mm
  • 300 mm
Regions and Countries Covered Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
Market leaders and key company profiles
  • Infineon Technologies AG,
  • Mitsubishi Electric Corporation,
  • Toshiba Corporation,
  • ON Semiconductor,
  • STMicroelectronics,
  • NXP Semiconductors,
  • Renesas Electronics Corporation,
  • Texas Instruments,
  • ROHM Semiconductors,
  • Semtech Corporation.
  • Get more information on this report

    Asia Pacific Power Discrete and Modules Regional Insights

    The geographic scope of the Asia Pacific Power Discrete and Modules refers to the specific areas in which a business operates and competes. Understanding local distinctions, such as diverse consumer preferences (e.g., demand for specific plug types or battery backup durations), varying economic conditions, and regulatory environments, is crucial for tailoring strategies to specific markets. Businesses can expand their reach by identifying underserved areas or adapting their offerings to meet local demands. A clear market focus allows for more effective resource allocation, targeted marketing campaigns, and better positioning against local competitors, ultimately driving growth in those targeted areas.

    geography/asia-pacific-power-discrete-and-modules-market-geography.webp
    Get more information on this report

    The List of Companies - Asia Pacific Power Discrete and Modules Market

    1. Infineon Technologies AG,
    2. Mitsubishi Electric Corporation,
    3. Toshiba Corporation,
    4. ON Semiconductor,
    5.  STMicroelectronics,
    6. NXP Semiconductors,
    7.  Renesas Electronics Corporation,
    8.  Texas Instruments,
    9.  ROHM Semiconductors,
    10.  Semtech Corporation.
    Frequently Asked Questions
    How big is the Asia Pacific Power Discrete and Modules Market?

    The Asia Pacific Power Discrete and Modules Market is valued at US$ 10,779.67 Million in 2021, it is projected to reach US$ 18,189.68 Million by 2028.

    What is the CAGR for Asia Pacific Power Discrete and Modules Market by (2021 - 2028)?

    As per our report Asia Pacific Power Discrete and Modules Market, the market size is valued at US$ 10,779.67 Million in 2021, projecting it to reach US$ 18,189.68 Million by 2028. This translates to a CAGR of approximately 7.8% during the forecast period.

    What segments are covered in this report?

    The Asia Pacific Power Discrete and Modules Market report typically cover these key segments-

    • Type (Power Discrete, Power Module)
    • Application (Industrial, Consumer Electronics, IT and Telecom, Automotive)
    • Material (Silicone, Silicon Carbide, Gallium nitride)
    • Wafer Size (Up to 200 mm, 300 mm)

    What is the historic period, base year, and forecast period taken for Asia Pacific Power Discrete and Modules Market?

    The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Asia Pacific Power Discrete and Modules Market report:

  • Historic Period : 2019-2020
  • Base Year : 2021
  • Forecast Period : 2022-2028
  • Who are the major players in Asia Pacific Power Discrete and Modules Market?

    The Asia Pacific Power Discrete and Modules Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:

  • Infineon Technologies AG,
  • Mitsubishi Electric Corporation,
  • Toshiba Corporation,
  • ON Semiconductor,
  • STMicroelectronics,
  • NXP Semiconductors,
  • Renesas Electronics Corporation,
  • Texas Instruments,
  • ROHM Semiconductors,
  • Semtech Corporation.
  • Who should buy this report?

    The Asia Pacific Power Discrete and Modules Market report is valuable for diverse stakeholders, including:

    • Investors: Provides insights for investment decisions pertaining to market growth, companies, or industry insights. Helps assess market attractiveness and potential returns.
    • Industry Players: Offers competitive intelligence, market sizing, and trend analysis to inform strategic planning, product development, and sales strategies.
    • Suppliers and Manufacturers: Helps understand market demand for components, materials, and services related to concerned industry.
    • Researchers and Consultants: Provides data and analysis for academic research, consulting projects, and market studies.
    • Financial Institutions: Helps assess risks and opportunities associated with financing or investing in the concerned market.

    Essentially, anyone involved in or considering involvement in the Asia Pacific Power Discrete and Modules Market value chain can benefit from the information contained in a comprehensive market report.

    Available Report Formats

    pdf-format excel-format pptx-format
    Buy Now