
Asia Pacific Automotive Board to Board Connector Market Report (2021-2031) by Scope, Segmentation, Dynamics, and Competitive Analysis
No. of Pages: 185 | Report Code: BMIRE00031829 | Category: Electronics and Semiconductor
No. of Pages: 185 | Report Code: BMIRE00031829 | Category: Electronics and Semiconductor
The Asia Pacific automotive board to board connector market size is expected to reach US$ 1,800.58 million by 2031 from US$ 998.67 million in 2023. The market is estimated to record a CAGR of 7.6% from 2023 to 2031.
The automotive board to board connectors market in Asia Pacific (APAC) is experiencing robust growth, driven by a combination of technological advancements, the rapid expansion of electric vehicle (EV) adoption, and increasing consumer demand for advanced automotive features. One of the most significant market drivers in the APAC is the accelerating adoption of EVs. Countries such as China, Japan, South Korea, and India are at the forefront of EV production and sales. According to the Automobile Inspection and Registration Information Association (Japan), the number of passengers EVs in Japan increased from 138,330 units in 2022 to 162,390 units in 2023, reflecting a significant surge in EV sales. As governments in these nations implement stricter environmental regulations and offer incentives for EV purchases, automakers are increasingly integrating advanced electrical systems to meet new performance and efficiency standards. Board to Board Connectors are critical for ensuring reliable power distribution and seamless data transmission between various components, including battery management systems, power inverters, electric drivetrains, and charging interfaces. The rising number of EVs on roads is driving the demand for these high-performance connectors.
Key segments that contributed to the derivation of the Automotive board to board connector market analysis are type, application, pitch, and number of pin.
Automotive IoT is a critical component of connected automobile technology, allowing cars to communicate with other vehicles, pedestrians, and road infrastructure, among others, resulting in improved road safety and traffic efficiency. This necessitates high-speed data transmission to handle the growing volume of information efficiently. Automotive Board to Board Connectors play a crucial role in facilitating this rapid data flow.
The need for automotive Board to Board Connectors to facilitate interconnection between devices, sensors, and edge computing modules is expected to propel by the growing usage of IoT devices and edge computing solutions. This provides low power consumption and secure connections for IoT and edge computing applications. Automotive Board to Board Connectors allow processing units, actuators, and sensors to be connected, facilitating effective data transfer and decision-making at the network's edge. Thus, the IoT, along with other disruptive technologies, is expected to transform the automotive industry and create lucrative opportunities during the forecast period
Based on country, the Asia Pacific automotive board to board connector market comprises China, Japan, India, Australia, South Korea, and the Rest of Asia Pacific. China held the largest share in 2023.
China is the largest EV market in the world. The government's strong push for green energy solutions through incentives, subsidies, and stricter emissions regulations is accelerating EV adoption. According to the Ministry of Public Security (China), the country registered 13.1 million new EVs in 2022, accounting for 4.1% of total vehicle sales. This marks a 67.13% increase compared to the 7.84 million EVs sold in 2021. As automakers focus on expanding their EV offerings, there is a rising demand for high-performance, reliable connectors to facilitate critical functions such as battery management systems, power inverters, charging infrastructure, and electric drivetrains. Board to Board Connectors are essential in ensuring efficient power distribution and data communication across these complex systems, fueling the market growth.
Report Attribute | Details |
---|---|
Market size in 2023 | US$ 998.67 Million |
Market Size by 2031 | US$ 1,800.58 Million |
Global CAGR (2023 - 2031) | 6.9% |
Historical Data | 2021-2022 |
Forecast period | 2024-2031 |
Segments Covered |
By Type
|
Regions and Countries Covered | Asia Pacific
|
Market leaders and key company profiles |
Some of the key players operating in the market include Amphenol Corp; GREENCONN Co., Ltd; Yamaichi Electronics Co., Ltd; Molex LLC; Japan Aviation Electronics Industry, Ltd; Hirose Electric Co Ltd; Samtec Inc; KYOCERA Corporation; ENNOVI Holdings Pte. Ltd; and CSCONN Corporation, among others. These players are adopting various strategies such as expansion, product innovation, and mergers and acquisitions to provide innovative products to their consumers and increase their market share.
The following methodology has been followed for the collection and analysis of data presented in this report:
The research process begins with comprehensive secondary research, utilizing both internal and external sources to gather qualitative and quantitative data for each market. Commonly referenced secondary research sources include, but are not limited to:
Note: All financial data included in the Company Profiles section has been standardized to USD. For companies reporting in other currencies, figures have been converted to USD using the relevant exchange rates for the corresponding year.
Business Market Insights’ conducts a significant number of primary interviews each year with industry stakeholders and experts to validate its data analysis, and gain valuable insights. These research interviews are designed to:
Primary research is conducted via email interactions and telephone interviews, encompassing various markets, categories, segments, and sub-segments across different regions. Participants typically include:
The Asia Pacific Automotive Board to Board Connector Market is valued at US$ 998.67 Million in 2023, it is projected to reach US$ 1,800.58 Million by 2031.
As per our report Asia Pacific Automotive Board to Board Connector Market, the market size is valued at US$ 998.67 Million in 2023, projecting it to reach US$ 1,800.58 Million by 2031. This translates to a CAGR of approximately 6.9% during the forecast period.
The Asia Pacific Automotive Board to Board Connector Market report typically cover these key segments-
The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Asia Pacific Automotive Board to Board Connector Market report:
The Asia Pacific Automotive Board to Board Connector Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
The Asia Pacific Automotive Board to Board Connector Market report is valuable for diverse stakeholders, including:
Essentially, anyone involved in or considering involvement in the Asia Pacific Automotive Board to Board Connector Market value chain can benefit from the information contained in a comprehensive market report.