At 7.6% CAGR, Asia Pacific Automotive Board to Board Connector Market is Projected to be WWorth US$ 1800.58 Million by 2031 says Business Market Insights

According to Business Market Insights’ research, the Asia Pacific automotive board to board connector market was valued at US$ 998.67 million in 2023 and is expected to reach US$ 1800.58 million by 2031, registering a CAGR of 7.6% from 2023 to 2031. Increasing electronics and infotainment systems in automotive sector and growing electric vehicles industry are among the critical factors attributed to drive the Asia Pacific automotive board to board connector market.

The increasing presence of electronic and infotainment systems in automobiles is indeed a major driver for the automotive board to board connector market. Modern infotainment systems equipped with features such as high-resolution displays, navigation, internet connectivity, and advanced audio systems require a high data transfer rate to function precisely. Automotive Board to Board Connectors are specifically designed to transmit data at faster speeds, ensuring a seamless user experience and optimal system performance.

The automotive industry is constantly innovating by integrating electronic features in vehicles. These features include advanced driver-assistance systems (ADAS), autonomous driving features, and telematics, which rely on high-speed data communication between various components. Automotive Board to Board Connectors play a crucial role in enabling these features by providing reliable and efficient data transfer between sensors, cameras, control units, and other electronic systems.

Several companies are engaged in investing in new technologies in infotainment systems. For instance, in June 2023, Nvidia Corp and MediaTek Inc announced to team up on technology to power advanced vehicle infotainment systems that are able to stream video or games or use artificial intelligence to interact with drivers. In addition, in January 2023, Garmin announced the plan to demonstrate their latest in-cabin solutions for the automotive original equipment manufacturer (OEM) at CES 2023 with the importance of technologies that unify multiple domains, touchscreens, wireless devices on a single system-on-chip (SoC). Featuring four infotainment touchscreens, an instrument cluster, wireless headphones, a cabin monitoring system, smartphones, wireless gaming controllers, and several entertainment options, powered by a single Garmin multi-domain computing module. Thus, the increasing complexity and data demands of modern automotive electronics and infotainment systems necessitate the use of automotive board to board connectors. These connectors enable faster data transfer, seamless feature integration, and weight reduction, making them a critical component in the evolution of the automotive industry.

On the contrary, complex design of connectors hampers the growth of Asia Pacific automotive board to board connector market.

Based on type, the Asia Pacific automotive board to board connector market is segmented into pin headers, socket, floating connector, and card edge connector. The pin headers segment held 42.9% market share in 2023, amassing US$ 427.95 million. It is projected to garner US$ 814.02 million by 2031 to register 8.4% CAGR during 2023–2031. Further pin header is sub segmented into stacked headers, and shrouded headers.

By application, the Asia Pacific automotive board to board connector market is segmented into powertrain control systems, infotainment and navigation systems, advanced driver assistance systems (ADAS), electric vehicles (EV) and hybrid vehicle systems, lighting control systems, and autonomous vehicles. The powertrain control systems segment held 30.5% share of Asia Pacific automotive board to board connector market in 2023, amassing US$ 304.10 million. It is projected to garner US$ 519.33 million by 2030 to expand at 6.9% CAGR from 2023 to 2031.

In terms of pitch, the Asia Pacific automotive board to board connector market is categorized into less than 1 mm, 1-2 mm, and more than 2 mm. The 1-2 mm segment held 49.0% share of Asia Pacific automotive board to board connector market in 2023, amassing US$ 489.78 million. It is projected to garner US$ 852.87 million by 2031 to expand at 7.2% CAGR from 2023 to 2031.

In terms of number of pins, the Asia Pacific automotive board to board connector market is categorized into 2-12 Pins, 12-30 Pins, 30-50 Pins, 50-100 Pins, and 100+ Pins. The 2-12 pins segment held 40.6% share of Asia Pacific automotive board to board connector market in 2023, amassing US$ 405.91 million. It is projected to garner US$ 654.08 million by 2031 to expand at 6.1% CAGR from 2023 to 2031

Based on country, the Asia Pacific automotive board to board connector market is categorized into Australia, China, India, Japan, South Korea, and the Rest of Asia Pacific. Our regional analysis states that China captured 53.6% share of Asia Pacific automotive board to board connector market in 2023. It was assessed at US$ 535.29 million in 2023 and is likely to hit US$ 1,041.69 million by 2031, registering a CAGR of 8.7% during 2023 to 2031.

Key players operating in the automotive board to board connector market are Amphenol Corp; GREENCONN Co.; Ltd; Yamaichi Electronics Co., Ltd; Molex LLC; Japan Aviation Electronics Industry, Ltd; Hirose Electric Co Ltd; Samtec Inc; KYOCERA Corporation; ENNOVI Holdings Pte. Ltd; and CSCONN Corporation, among others.

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