At 8.4% CAGR, the Europe Semiconductor Bonding Market is projected to be worth US$ 349.17 million by 2028, says Business Market Insights

According to the Insight Partners’ research, the Europe semiconductor bonding market was valued at US$ 215.77 million in 2022 and is expected to reach US$ 349.17 million by 2028, registering a CAGR of 8.4% from 2022 to 2028. Growing number of product launches, partnerships, and collaborations related to semiconductor bonding solutions is driving the growth of the market and rising adoption of stacked die technology in IoT devices are the critical factors attributed to the market expansion.

Due to the OEM’s increased need for enhanced capabilities and performance in smaller printed circuit boards (PCBs), the adoption of stacked die technology has grown in various electronic applications such as IoT and mobile devices. Stacked die refers to the placement of one chip on top of another or a spacer instead of the chip, followed by another chip. Sets of many rows of wire bonding loops are arranged, with each set connecting to a different die or spacer. Hence, remaining space after stacked die is used to fit many functionalities into a small die placement area. Thus, using stacked die technology to place the circuitry helps preserve valuable PCB space. Due to the limited workspace that PCB assembly and manufacturing companies witnessed with such extremely rigid and rigid-flex circuits, the demand for stacked die technology in IoT device is increasing. Moreover, the usage of stacked die significantly enhances design processes of semiconductor. The stacked die technology is used to produce a small-sized final design. One of the main factors causing the stacked die technique to advance is handheld electronic devices. Also, live tracking IoT gadget cannot be huge either. By reducing the amount of design effort and raising the likelihood of first-time success, time to market is reduced. Thus, the increasing adoption of stacked die technology in IoT devices is raising the demand for semiconductor bonding solutions in the market. In addition, OEMs in the semiconductor sector are utilizing the benefits of IoT beyond connectivity. Sensors, RFID tags, smart beacons, smart meters, and distribution control systems are IoT devices and technologies that are increasingly being used in various applications such as building and home automation, connected logistics, smart manufacturing, smart retail, smart mobility, and smart transportation. In Internet of Things (IoT) devices, semiconductor bonding techniques are utilized to compactly attach several stacked dies to substrates which will lead to the growth of the Europe semiconductor bonding market.

On the contrary, fluctuation in the price of semiconductor components hurdles the growth of Europe semiconductor bonding market.

• Based on type, the Europe semiconductor bonding market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment held 43.0% market share in 2022, amassing US$ 92.82 million. It is projected to garner US$ 148.72 million by 2028 to expand at 8.2% CAGR during 2022–2028.
• Based on application, the Europe semiconductor bonding market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held 35.2% market share in 2022, amassing US$ 75.88 million. It is projected to garner US$ 130.20 million by 2028 to expand at 9.4% CAGR during 2022–2028.
• Based on country, the Europe semiconductor bonding market has been categorized into Germany, France, Italy, Russia, the UK, and rest of Europe.  Our regional analysis states that Germany captured 30.0% market share in 2022. It was assessed at US$ 64.70 million in 2022 and is likely to hit US$ 103.39 million by 2028, exhibiting a CAGR of 8.1% during the forecast period.

Key players profiles in the Europe semiconductor bonding market report are ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation, among others.

• Jan-2021, ASM Pacific Technology collaborated with the EV Group (Austria) to facilitate ultra-precision die-to-wafer hybrid bonding remedies for 3D-IC diverse assimilation.

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