Report : Asia Pacific Substrate like PCB Market Forecast to 2028 - COVID-19 Impact and Regional Analysis By Line/Space (25/25 and 30/30 µm, and less than 25/25 µm), Inspection Technologies (Automated Optical Inspection, Direct Imaging, and Automated Optical Shaping), Application (Consumer Electronics, Automotive, Medical, Industrial, and Others)
25/25 and 30/30 um Segment has the Largest Share of Line/Space in the Asia Pacific Substrate like PCB Market during 2021–2028
According to our latest study on “Asia Pacific Substrate like PCB Market Forecast to 2028 – COVID-19 Impact and Analysis – by Line/Space/ Inspection Technology, and Application,” the market is projected to reach US$ 3,922.8 million by 2028 from US$ 1,180.2 million in 2021; it is expected to grow at a CAGR of 18.7% from 2021 to 2028. The report highlights trends prevailing in the market, and the drivers and restraints pertaining to the market growth. The growth of this market is estimated to grow owing to key driving factors such as the increasing acceptance of substrate-like PCB in OEMs, smart consumer electronics, and wearable devices and growing due to the demand for downsizing and effective connectivity solutions. However, the fluctuations with the raw material prices are expected to restrict the market growth during the forecast period.
APAC is a crucial region in terms of manufacturing and industrial growth and any disruptions may negatively impact the growth of various industries. With the COVID-19 outbreak, the IC substrate production came to an abrupt end in China from February 2020 to March 2020. Thus, this influenced the demand for the product, worldwide, and influenced the price. The governments of various countries of this region are taking drastic measures to reduce the effects of coronavirus outbreaks by announcing lockdowns, travel and trade bans. All these measures hurt the adoption and growth of substrate-like PCB till Mid-2021.
Based on line/space, the Asia Pacific substrate like PCB market is bifurcated into 25/25 and 30/30 um and less than 25/25 um. In 2021, the the less than 25 um segment held the largest market share during the forecast period. Also, the same segment is estimated to register the highest CAGR during the forecast period. End customers are increasingly demanding thinner/smaller but more functioning smartphones, necessitating a reduction in the board area. As a result, minimum line spacing (i.e., the space between lines, via, components, layers, and so on) must be maintained in order to build a larger battery. Apple and Samsung, for example, have used SLP with 25/25 and 30/30 m line/space in their devices.
Compaq Manufacturing Co., Ltd., DAEDUCK ELECTRONICS CO., LTD., Ibiden Co, Ltd., Kinsus Interconnect Technology, SAMSUNG ELECTRO-MECHANICS CO, Ltd, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Zhen Ding Tech. Group Technology Holding Limited, Technologies Inc., Korea Circuit, and Unimicron Technology Corp. are among the leading companies in the Asia Pacific substrate like PCB market. The companies are focused on adopting organic growth strategies such as product launches and expansions to sustain their position in the dynamic market.
The market for substrate like PCB market is segmented into line/space, inspection technology, and application. Based on line/space, the Asia Pacific substrate like PCB market is segmented25/25 and 30/30 um and less than 25/25 um. Based on inspection technology, the substrate like PCB market is segmented into automated optical inspection, direct imaging, and automated optical shaping. Based on application, the substrate like PCB market is segmented into consumer electronics, automotive, medical, industrial, and others. Geographically, the substrate like PCB market is segmented into Asia Pacific (China, Japan, India, Australia, South Korea, Vietnam, Rest of APAC).
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