Smartphones have evolved from 4G LTE to 5G, and the complexity of Massive MIMO antenna configurations has made RF front-ends take up more space in 5G smartphones. In addition, the amount of data processed by the 5G system is expected to grow geometrically shortly, increasing the requirement for high battery capacity, which means that PCBs and other electronic components must be compressed to achieve higher density and smaller form factor, which has pushed substrate-like PCB toward thinner, smaller, and more complex processes. Substrate-like PCB (SLP PCB) is the next generation of high-density PCB, which requires trace/spacing equal to or less than 30/30 μm (now 40/40 μm is the limit for HDI), for further reducing the device size, leaving more space for other components. The rising adoption of SLP by smartphone players due to the transition from 4G to 5G technology provides a massive opportunity to the Asia Pacific substrate-like PCB market. The expansion in 5G infrastructure is expected to increase the demand for PCBs and substrates for mainboards and modules in various end-use industries, such as consumer electronics, automotive, medical, industrial, telecommunication, and others.
APAC is a crucial region in terms of manufacturing and industrial growth and any disruptions may negatively impact the growth of various industries. With the COVID-19 outbreak, the IC substrate production came to an abrupt end in China from February 2020 to March 2020. Thus, this influenced the demand for the product, worldwide, and influenced the price. The governments of various countries of this region are taking drastic measures to reduce the effects of coronavirus outbreaks by announcing lockdowns, travel and trade bans. All these measures hurt the adoption and growth of substrate-like PCB till Mid-2021.
With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the substrate like PCB market. The Asia Pacific substrate like PCB market is expected to grow at a good CAGR during the forecast period.
| Report Attribute | Details |
|---|---|
| Market size in 2021 | US$ 1,180.2 Million |
| Market Size by 2028 | US$ 3,922.8 Million |
| CAGR (2021 - 2028) | 18.7% |
| Historical Data | 2019-2020 |
| Forecast period | 2022-2028 |
| Segments Covered |
By Line/Space
|
| Regions and Countries Covered |
Asia-Pacific
|
| Market leaders and key company profiles |
|
The Asia Pacific Substrate like PCB Market is valued at US$ 1,180.2 Million in 2021, it is projected to reach US$ 3,922.8 Million by 2028.
As per our report Asia Pacific Substrate like PCB Market, the market size is valued at US$ 1,180.2 Million in 2021, projecting it to reach US$ 3,922.8 Million by 2028. This translates to a CAGR of approximately 18.7% during the forecast period.
The Asia Pacific Substrate like PCB Market report typically cover these key segments-
The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Asia Pacific Substrate like PCB Market report:
The Asia Pacific Substrate like PCB Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
The Asia Pacific Substrate like PCB Market report is valuable for diverse stakeholders, including:
Essentially, anyone involved in or considering involvement in the Asia Pacific Substrate like PCB Market value chain can benefit from the information contained in a comprehensive market report.
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