Asia Pacific Solder Materials Market is expected to reach US$ 527.74 Mn in 2030

Wave/Reflow Segment to Dominate APAC Solder Materials Market during 2020–2030

According to a new market research study on “APAC Solder Materials Market to 2030 – Covid-19 Impact and Analysis - By Product (Wire, Paste, Bar, Flux, and Others); Process (Screen-printing, Robotic, Laser, Wave/Reflow),” is expected to reach US$ 1073.52 Mn by 2030 from US$ 685.79 Mn in 2019. The market is estimated to grow at a CAGR of 4.2% from 2020 to 2030. The report provides trends prevailing in the APAC solder material market along with the drivers and restraints pertaining to the market growth. The rise in demand in the electronic industry and the accessibility to various solder products are the major factors driving the growth of the APAC solder materials market. However, issues associated with various regulations imposed by authorities on solder materials may hinder the growth of APAC solder materials market.

The market for APAC solder materials market is segmented into product, process and country. Based on product, the market is segmented into wire, paste, flux, bar and others. In 2019, the wire segment held the largest share in APAC solder materials market. Based on process the APAC solder materials market is divided into wave/reflow, screen printing, laser, and robotic. Robotic is expected to be the fastest growing segment over the forecast period. Furthermore in this present scenario of COVID 19 pandemic, the APAC solder materials market has been facing difficulties as most of the industries are facing severe impacts by the outbreak of COVID-19, and the virus critically affected several countries such as China, India, and Australia among others. The majority of the countries have imposed lockdown or restricted human movement causing the industries to face a severe impact on production as a result of less labor footfall.

Fusion Incorporated, Indium Corporation, Kester, KOKI Company Ltd., Lucas-Mihaupt Inc., Qualitek International Inc., Senju Metal Industry Co., Ltd., Stannol GmbH and Co. KG, Tamura Corporation, and Nihon Genma are among the leading companies in the APAC solder materials market. The companies are focused on adopting organic growth strategies such as product launches and expansions to sustain their position in the dynamic market. For instance, in 2018, Indium Corporation and MEL Systems and Services Ltd. (MELSS) formed a strategic partnership to expand accessibility to Indium Corporation solder materials throughout India

APAC Solder Materials Market, By Country, 2019 and 2030 (%)

The report segments the APAC solder materials market as follows:

APAC solder materials market, by Product

• Wire
• Paste
• Bar
• Flux
• Others

APAC solder materials market, by Process

• Screen-Printing
• Robotic
• Laser
• Wave/Reflow

APAC solder materials market – By Country

• Australia
• China
• India
• Japan
• South Korea
• Rest of APAC