Asia Pacific Solder Materials Market Forecast to 2030 – COVID-19 Impact and Analysis by Product (Wire, Paste, Bar, Flux, and Others), and Process (Screen-printing, Robotic, Laser, Wave/Reflow)
Number of Pages: 86
Market Introduction
APAC comprises of several developing economies such as India, Australia, Japan, South Korea, among others. Asia-Pacific region possesses the largest share in the global solder materials market and is further expected to grow with a highest CAGR during the forecast period. Asia-Pacific encompasses an ample amount of opportunities for the growth of solder materials. The region has been noticed as one of the prominent markets for the utilization of solder materials. Asia-Pacific has ranked highest amongst solder materials manufacturing regions. China is dominating the regional market, followed by other countries such as Japan, India, and South Korea. These countries are witnessing growing demand from the electronic and automobiles industries. Apart from its applications in the electronic industry, the solder materials market has been propelling due to its applications in electronic vehicles. The price for petrol, diesel, and CNG, has increased subsequently that has created opportunities for the electric, coupled with a shift in consumer living standards. This shift has fueled the growth of the market in the region. Demand for solder materials is high, and industrialists are eyeing for opportunities to enlarge their business operations with improving economic conditions. Thus, a rise in demand in the electronics industry is anticipated to create a drive for APAC solder materials market in the coming years.
Market Overview and Dynamics
The solder materials market in APAC is expected to grow from US$ 685.79 Mn in 2019 to US$ 1073.52 Mn by 2030; it is estimated to grow at a CAGR of 4.2% from 2020 to 2030. Solder is basically a fusible metal alloy utilized to create a permanent bond between metal work pieces. Solder is melted in order to adhere to as well as connect the pieces together after cooling, which further requires that an alloy suitable for use as solder with a lower melting point than the pieces being joined. Over the years, an increase in spending toward R&D activities related to solder materials has been initiated by several research institutions, centers, and industries. Further, research on such materials is gaining momentum, which is attributable to their properties, such as toughness along with ductility, better strength, and high electrical conductivity, making them ideal for diversified industrial applications. The market for solder materials embarks numerous opportunities, and, therefore, manufacturers are continuously looking forward to aligning the use of these materials with different application bases. These continuous R&D initiatives is bolstering the growth of the APAC solder materials market.
The COVID-19 pandemic is anticipated to cause a loss of more than 3 Billion in the Asia Pacific region. The consequence and impact can be even worse and totally depends on the spread of the virus. The government of Asia Pacific is taking possible steps to reduce its effects by announcing lockdown, and thus, impact the revenue generated by the market. The Airports Council International (ACI) Asia-Pacific warned that the prolonged duration of the COVID-19 (COVID-19) outbreak would drastically impact the region’s airports’ connectivity and economic sustainability, significantly restricting them from achieving previously forecasted growth prospects. Such closures are anticipated to negatively impact market growth in the coming period.
Key Market Segments
In terms of product, the wire segment accounted for the largest share of the APAC solder materials market in 2019. In terms of process, the wave/reflow segment held a larger market share of APAC solder materials market in 2019.
Major Sources and Companies Listed
A few major primary and secondary sources referred to for preparing this report on the APAC solder materials market are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Fusion Incorporated, Indium Corporation, Kester, KOKI Company Ltd., Lucas-Mihaupt Inc., Qualitek International Inc., Senju Metal Industry Co., Ltd., Stannol GmbH and Co. KG, Tamura Corporation, and Nihon Genma.
Reasons to buy report
APAC SOLDER MATERIALS MARKET SEGMENTATION
APAC solder materials market, by Product
APAC solder materials market, by Process
APAC solder materials market – By Country
Company Profiles
| Report Attribute | Details |
|---|---|
| Market size in 2019 | US$ 685.79 Million |
| Market Size by 2030 | US$ 1073.52 Million |
| CAGR (2020 - 2030) | 4.2% |
| Historical Data | 2017-2018 |
| Forecast period | 2020-2030 |
| Segments Covered |
By Product
|
| Regions and Countries Covered |
Asia-Pacific
|
| Market leaders and key company profiles |
|
The Asia Pacific Solder Materials Market is valued at US$ 685.79 Million in 2019, it is projected to reach US$ 1073.52 Million by 2030.
As per our report Asia Pacific Solder Materials Market, the market size is valued at US$ 685.79 Million in 2019, projecting it to reach US$ 1073.52 Million by 2030. This translates to a CAGR of approximately 4.2% during the forecast period.
The Asia Pacific Solder Materials Market report typically cover these key segments-
The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Asia Pacific Solder Materials Market report:
The Asia Pacific Solder Materials Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:
The Asia Pacific Solder Materials Market report is valuable for diverse stakeholders, including:
Essentially, anyone involved in or considering involvement in the Asia Pacific Solder Materials Market value chain can benefit from the information contained in a comprehensive market report.
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