Power Discrete Segment has the Largest Share of Type in the Asia Pacific Power Discrete and Modules Market during 2020–2028 

According to a new market research study on “Asia Pacific Power Discrete and Modules Market to 2028 – COVID-19 Impact and Regional Analysis and Forecast by Type, Application, Material, Wafer Size, and Country” is expected to reach US$ 18,189.68million by 2028 from US$ 10,779.67 million in 2021. The market is estimated to grow at a CAGR of 7.8% from 2021 to 2028. The report provides trends prevailing in the Asia Pacific Power Discrete and Modules market along with the drivers and restraints pertaining to the market growth. The growth of this market is estimated to increase in demand for power electronic modules across various industries and growing requirement for SiC-based power devices are the key factors driving the market growth. However, the market is expected to experience slow growth during the forecast period owing to limited availability of gallium nitride (GaN) material.

Except few developed countries such as Australia, South Korea and Japan, Asia Pacific region is still considered to be in developing state. The developing countries do not have required health infrastructure and this was the main reason that led to the increase in the count of recorded cases in 2020. As per the Organization for Economic Co-operation and Development (OECD), the pandemic has affected significant economies such as India, Australia and Japan to some extent. Due to inadequate health and medicine facilities, government authorities had to impose restrictions for working with limited workforce at production sites. In most of the highly populated countries such as China and India, the demand for power electronic components has witnessed a short downfall in 2020 wherein the overall impact of the pandemic across the market was positive.

The market for Asia Pacific is segmented into the type, application, material, wafer size and country. Based on Type, the Asia Pacific Power Discrete and Modules market is segmented into power discrete and power module. Power discrete are important components in circuits intended to lengthen the battery life in portable electronics. In 2021, the power discrete segment accounted for a larger revenue share during the forecast period. However, the power module segment is estimated to register the highest CAGR during the forecast period.

Infineon Technologies AG, Mitsubishi Electric Corporation, Toshiba Corporation, ON Semiconductor, STMicroelectronics, NXP Semiconductors, Renesas Electronics Corporation, Texas Instruments, ROHM Semiconductors, and Semtech Corporation. Among the leading companies in the Asia Pacific Power Discrete and Modules market. The companies are focused on adopting organic growth strategies such as product launches and expansions to sustain their position in the dynamic market.

The market for Asia Pacific power discrete and modules market is segmented into type, application, material, wafer size. Based on type, the Asia Pacific power discrete and modules market is segmented into power discrete, and power module, Based on application, the Asia Pacific power discrete and modules market is segmented into industrial, consumer electronics, it & telecom, automotive, and others, Based on material, the Asia Pacific power discrete and modules market is segmented into silicone, silicon carbide, and Gallium nitride. Based on wafer size, the Asia pacific power discrete and modules market is segmented into up to 200 mm, and 300 mm. By region, Asia Pacific power discrete and modules market is segmented into (China, Japan, India, South Korea, and Rest of Asia Pacific).

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