Previsioni di mercato dei materiali per strati di ridistribuzione per il Nord America fino al 2028: impatto del COVID-19 e analisi regionale per tipo di materiale [poliimmide (PI), polibenzossazolo (PBO), benzocilobutene (BCB) e altri] e applicazione [imballaggio a livello di wafer fan-out (FOWLP) ) e packaging IC 2.5D/3D]

Si prevede che il mercato dei materiali per strati di ridistribuzione in Nord America crescerà da 17,19 milioni di dollari nel 2021 a 34,06 milioni di dollari entro il 2028; si stima che crescerà a un CAGR del 10,3% dal 2021 al 2028.\\n\\nIl settore dell\'elettronica di consumo si sta evolvendo a un ritmo esponenziale. La pressione delle richieste da parte dei consumatori ha costretto i fornitori a fornire prodotti distinti e ad essere i primi a muoversi sul mercato. La dura concorrenza con i concorrenti nel settore dell’elettronica di consumo ha portato a guerre di prezzi che hanno portato a una diminuzione della redditività per i produttori. Come risultato di questi fattori, i produttori cercano continuamente innovazioni nella loro offerta di prodotti. Spesso i produttori sono curiosi di diventare pionieri di nuovi prodotti sul mercato. La conversione da analogico a digitale ha introdotto molti nuovi standard nell\'audio e nel video, che hanno migliorato la qualità e la convenienza dell\'esperienza multimediale digitale. Inoltre, con l’avvento della banda larga, l’accesso ai media è diventato facile e gratificante per i consumatori. La proliferazione di prodotti intelligenti sta spingendo gli ingegneri a dover migliorare la progettazione dei prodotti elettronici e concentrarsi sulla fornitura di costi inferiori, consumi inferiori e prestazioni più elevate attraverso l\'integrazione di funzioni discrete. I prodotti intelligenti di oggi contengono sistemi elettronici complessi che richiedono un funzionamento impeccabile nel mondo reale. La miniaturizzazione dei dispositivi, il supporto di più tecnologie wireless, velocità di trasmissione dati più elevate e una maggiore durata della batteria richiedono un\'analisi rigorosa. Inoltre, la richiesta di numerose integrazioni di funzionalità su un singolo dispositivo ha portato a progetti complessi di circuiti stampati di questi dispositivi elettronici. Ad esempio, uno smartphone include una fotocamera, una funzione di chiamata, una torcia, unità di memorizzazione, connettività con altri dispositivi, porte compatibili per le connessioni, un lettore multimediale e molte altre funzioni. Allo stesso modo, altri dispositivi elettronici di consumo stanno migliorando in modo simile, incoraggiando i produttori di semiconduttori a miniaturizzare ulteriormente i chip e integrare più funzionalità. La tendenza alla miniaturizzazione nel settore dell’elettronica di consumo ha portato la domanda di dimensioni dei componenti del contenitore al livello delle tecnologie basate sulle regole di progettazione. La tecnologia del pacchetto del circuito integrato (IC) deve garantire un numero maggiore di conduttori, un passo dei conduttori ridotto, un\'area di ingombro minima e una significativa riduzione del volume. Pertanto, le continue complessità di progettazione nel settore dell’elettronica di consumo, insieme alla miniaturizzazione di questi dispositivi, spingerebbero la domanda di materiale per strati di ridistribuzione in tutto il Nord America. \\n\\nLa pandemia di COVID-19 ha creato un impatto negativo sulla crescita economica del Nord America. Gli Stati Uniti sono il paese più colpito al mondo a causa dell\'epidemia di COVID-19. Di conseguenza, si registra un calo nell\'approvvigionamento di nuovi dispositivi a causa della chiusura temporanea delle attività commerciali e delle interruzioni nella catena di fornitura e nelle attività produttive. Tutto questo I fattori che hanno influenzato le entrate e la crescita del mercato dei materiali per strati di ridistribuzione in Nord America. Le piccole e medie imprese/startup sul mercato hanno assistito a un grave impatto della pandemia. Tuttavia, gli sforzi di ristrutturazione in corso intrapresi dalle società semicustom per affrontare i problemi della catena di approvvigionamento e aumentare il coordinamento con partner di vendita e fornitori possono aiutare a ridurre l\'impatto negativo della pandemia.\\n\\nEntrate e previsioni del mercato dei materiali per strati di ridistribuzione del Nord America fino al 2028 (milioni di dollari)\\n\\nSegmentazione del mercato dei materiali per strati di ridistribuzione del Nord America\\n \\nMercato dei materiali per strati di ridistribuzione in Nord America per tipo di materiale\\n- Poliimmide (PI)\\n- Polibenzossazolo (PBO)\\n- Benzocilobutene (BCB)\\n- Altri\\no alluminio\\no dielettrici fotosensibili\\no fenoli e altri\\n\\ nMercato dei materiali per strati di ridistribuzione in Nord America per applicazione\\n- Fan-Out Wafer Level Packaging (FOWLP)\\n- Imballaggi per circuiti integrati 2.5D/3D\\nMercato dei materiali per strati di ridistribuzione in Nord America per Paese\\n- Stati Uniti\\n- Canada \\n- Messico \\nSocietà menzionate nel mercato dei materiali per strati di ridistribuzione del Nord America\\n- Amkor Technology\\n- Gruppo ASE\\n- Fujifilm Corporation\\n- Hitachi Chemical DuPont MicroSystems LLC\\n- INFINEON TECHNOLOGIES AG\\n- Jiangsu Changjiang Electronics Technology Co., Ltd .\\n- NXP Semiconductors\\n- Samsung Electronics Co., Ltd.\\n- Shin-Etsu Chemical Co., Ltd.\\n- SK Hynix Inc.\\n\\n

Table of Content

1. Introduction

1.1 The Insight Partners Research Report Guidance

1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights

2.2 Market Attractiveness

2.2.1 Market Attractiveness

3. Research Methodology

3.1 Coverage

3.2 Secondary Research

3.3 Primary Research

4. North America Redistribution Layer Material Market Landscape

4.1 Overview

4.2 Porter's Five Forces Analysis

4.2.1 Bargaining Power of Suppliers

4.2.2 Bargaining Power of Buyers

4.2.3 Threat of New Entrants

4.2.4 Intensity of Competitive Rivalry

4.2.5 Threat of Substitutes

4.3 Ecosystem Analysis

4.3.1 Raw Material Suppliers

4.3.2 Manufacturers

4.3.3 End Use

5. North America Redistribution Layer Material Market - Key Market Dynamics

5.1 Market Drivers

5.1.1 Growing Focus on AI-based Equipment and Tools

5.1.2 Increasing Demand from Automotive and Telecommunication Industries

5.2 Market Restraints

5.2.1 Fluctuation in Raw Material Prices

5.3 Market Opportunities

5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals

5.4 Future Trends

5.4.1 Advancements in the Packaging Technology

5.5 Impact Analysis

6. Redistribution Layer Material Market - North America Market Analysis

6.1 North America Redistribution Layer Material Market Volume (Tons)

6.2 North America Redistribution Layer Material Market Revenue (US$ Million)

6.3 North America Redistribution Layer Material Market Forecast and Analysis

7. North America Redistribution Layer Material Market Analysis - Type

7.1 Polyimide (PI)

7.1.1 Overview

7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)

7.2 Polybenzoxazole (PBO)

7.2.1 Overview

7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)

7.3 Benzocylobutene (BCB)

7.3.1 Overview

7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)

7.4 Others

7.4.1 Overview

7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. North America Redistribution Layer Material Market Analysis - Application

8.1 Fan-Out Wafer Level Packaging (FOWLP)

8.1.1 Overview

8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)

8.2 2 5D/3D IC Packaging

8.2.1 Overview

8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)

8.2.3 High Bandwidth Memory (HBM)

8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)

8.2.4 Multi-Chip Integration

8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)

8.2.5 Package on Package (FOPOP)

8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)

8.2.6 Others

8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. North America Redistribution Layer Material Market - Country Analysis

9.1 Overview

9.1.1 North America Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries

9.1.1.1 North America Redistribution Layer Material Market Breakdown by Country

9.1.1.2 US: North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.3 US: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.3.1 US: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.3.2 US: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.3.3 US: North America Redistribution Layer Material Market Breakdown by Application

9.1.1.4 Canada: North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.5 Canada North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.5.1 Canada: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.5.2 Canada: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.5.3 Canada: North America Redistribution Layer Material Market Breakdown by Application

9.1.1.6 Mexico: North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)

9.1.1.7 Mexico: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

9.1.1.7.1 Mexico: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.7.2 Mexico: North America Redistribution Layer Material Market Breakdown by Type

9.1.1.7.3 Mexico: North America Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

10.1 Heat Map Analysis by Key Players

10.2 Company Positioning & Concentration

11. Industry Landscape

11.1 Overview

11.2 Market Initiative

11.3 New Product Development

11.4 Merger and Acquisition

12. Company Profiles

12.1 SK Hynix Inc

12.1.1 Key Facts

12.1.2 Business Description

12.1.3 Products and Services

12.1.4 Financial Overview

12.1.5 SWOT Analysis

12.1.6 Key Developments

12.2 Samsung Electronics Co Ltd

12.2.1 Key Facts

12.2.2 Business Description

12.2.3 Products and Services

12.2.4 Financial Overview

12.2.5 SWOT Analysis

12.2.6 Key Developments

12.3 Infineon Technologies AG

12.3.1 Key Facts

12.3.2 Business Description

12.3.3 Products and Services

12.3.4 Financial Overview

12.3.5 SWOT Analysis

12.3.6 Key Developments

12.4 DuPont de Nemours Inc

12.4.1 Key Facts

12.4.2 Business Description

12.4.3 Products and Services

12.4.4 Financial Overview

12.4.5 SWOT Analysis

12.4.6 Key Developments

12.5 FUJIFILM Holdings Corp

12.5.1 Key Facts

12.5.2 Business Description

12.5.3 Products and Services

12.5.4 Financial Overview

12.5.5 SWOT Analysis

12.5.6 Key Developments

12.6 Amkor Technology Inc

12.6.1 Key Facts

12.6.2 Business Description

12.6.3 Products and Services

12.6.4 Financial Overview

12.6.5 SWOT Analysis

12.6.6 Key Developments

12.7 ASE Technology Holding Co Ltd

12.7.1 Key Facts

12.7.2 Business Description

12.7.3 Products and Services

12.7.4 Financial Overview

12.7.5 SWOT Analysis

12.7.6 Key Developments

12.8 NXP Semiconductors NV

12.8.1 Key Facts

12.8.2 Business Description

12.8.3 Products and Services

12.8.4 Financial Overview

12.8.5 SWOT Analysis

12.8.6 Key Developments

12.9 JCET Group Co Ltd

12.9.1 Key Facts

12.9.2 Business Description

12.9.3 Products and Services

12.9.4 Financial Overview

12.9.5 SWOT Analysis

12.9.6 Key Developments

12.10 Shin-Etsu Chemical Co Ltd

12.10.1 Key Facts

12.10.2 Business Description

12.10.3 Products and Services

12.10.4 Financial Overview

12.10.5 SWOT Analysis

12.10.6 Key Developments

13. Appendix

List of Tables

Table 1. North America Redistribution Layer Material Market Segmentation

Table 2. North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Table 3. North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Table 4. North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - Type

Table 5. North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Type

Table 6. North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - Application

Table 7. US: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 8. US: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 9. US: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 10. Canada: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 11. Canada: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 12. Canada: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 13. Mexico: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons) - By Type

Table 14. Mexico: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Type

Table 15. Mexico: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million) - By Application

Table 16. Company Positioning & Concentration

List of Figures

Figure 1. North America Redistribution Layer Material Market Segmentation, By Country

Figure 2. Porter's Five Forces Analysis

Figure 3. Ecosystem: North America Redistribution Layer Material Market

Figure 4. Market Dynamics: North America Redistribution Layer Material Market

Figure 5. North America Redistribution Layer Material Market Impact Analysis of Drivers and Restraints

Figure 6. North America Redistribution Layer Material Market Volume (Tons), 2020 - 2030

Figure 7. North America Redistribution Layer Material Market Revenue (US$ Million), 2020 - 2030

Figure 8. North America Redistribution Layer Material Market Share (%) - Type, 2022 and 2030

Figure 9. Polyimide (PI) Market Volume and Forecasts To 2030 (Tons)

Figure 10. Polyimide (PI) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 11. Polybenzoxazole (PBO) Market Volume and Forecasts To 2030 (Tons)

Figure 12. Polybenzoxazole (PBO) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 13. Benzocylobutene (BCB) Market Volume and Forecasts To 2030 (Tons)

Figure 14. Benzocylobutene (BCB) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 15. Others Market Volume and Forecasts To 2030 (Tons)

Figure 16. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 17. North America Redistribution Layer Material Market Share (%) - Application, 2022 and 2030

Figure 18. Fan-Out Wafer Level Packaging (FOWLP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 19. 2 5D/3D IC Packaging Market Revenue and Forecasts to 2030 (US$ Million)

Figure 20. High Bandwidth Memory (HBM) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 21. Multi-Chip Integration Market Revenue and Forecasts to 2030 (US$ Million)

Figure 22. Package on Package (FOPOP) Market Revenue and Forecasts to 2030 (US$ Million)

Figure 23. Others Market Revenue and Forecasts to 2030 (US$ Million)

Figure 24. North America Redistribution Layer Material Market by Key Countries - Revenue (2022) (US$ Million)

Figure 25. North America Redistribution Layer Material Market Breakdown by Key Countries, 2022 and 2030 (%)

Figure 26. US: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 27. US: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 28. Canada: North America Redistribution Layer Material Market Volume and Forecasts To 2030 (Tons)

Figure 29. Canada North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 30. Mexico: North America Redistribution Layer Material Market Revenue and Forecasts To 2030 (Tons)

Figure 31. Mexico: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)

Figure 32. Heat Map Analysis by Key Players

1. SK Hynix Inc

2. Samsung Electronics Co Ltd

3. Infineon Technologies AG

4. DuPont de Nemours Inc

5. FUJIFILM Holdings Corp

6. Amkor Technology Inc

7. ASE Technology Holding Co Ltd

8. NXP Semiconductors NV

9. JCET Group Co Ltd

10. Shin-Etsu Chemical Co Ltd

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the North America redistribution layer material market.
Highlights key business priorities in order to assist companies to realign their business strategies.
The key findings and recommendations highlight crucial progressive industry trends in North America redistribution layer material market, thereby allowing players across the value chain to develop effective long-term strategies.
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
Scrutinize in-depth North America market trends and outlook coupled with the factors driving the redistribution layer material market, as well as those hindering it.
Enhance the decision-making process by understanding the strategies that underpin security interest with respect to client products, segmentation, pricing, and distribution.

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