Low Dielectric Materials Market by Material (Fluoropolymer, Modified Polyphenylene Ether, Polyimide, Cyclic Olefin Copolymer, Cyanate Ester, Liquid Crystal Polymer, and Others), End-Use Industry (PCBs, Antenna, Microelectronics, Wire & Cables, and Others): Global Market Size Estimates and Forecast (2022-2030)

Code: BMIRE00026378 | Pages: 100 | Industry: Chemicals and Materials | Date: Sep 2022 | Type: Global

The market crossed US$ 1.6 billion mark in 2022 and is expected to hit US$ 2.8 billion by 2030, recording a CAGR of approximately 6.5% during the forecast period.


Increase in delivery of airplanes and automobile production

With the increased demand for electronics like smartphones, TVs and other appliances, the demand for PCBs, wire and cables, microelectronics and antennas has increased tremendously in recent years. Due to their low cost, better heat resistance and low dielectric constants, fluoropolymers are optimum materials for making these components. A thermoplastic with qualities resembling those of thermoset polymers is polytetrafluoroethylene. Heat application affects it to alter the shape, though extremely slowly, making it appropriate for PCB manufacturing. The use of low dielectric materials is expected to pace up with the rising adoption among PCB manufacturers. Further, other applications such as antenna, microelectronics, wire & cables, and others is also expected to gain traction during the forecast period.

Within the report, the market is segmented into material, application, and geography. By material, the market is further segmented into fluoropolymer, modified polyphenylene ether, polyimide, cyclic olefin copolymer, cyanate ester, liquid crystal polymer, and others. Based on application, the market is divided into PCBs, antenna, microelectronics, wire & cables, and others. Geographically, the market is subsegmented into North America, Europe, Asia Pacific, South & Central America, and Middle East & Africa.

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Development of 5G communication is driving the market growth

Even though it is not an electrical conductor, a dielectric material is strongly polarized with the help of an electric field to hold an electric charge. Electricity cannot travel through low dielectric materials when an applied electric field is present, but the electric charge within the material could vary from its equilibrium position. The shift is known as electrical polarization. Low dielectric materials have a permanent electric dipole moment, a unit that can temporarily split the positive and negative charges. Further, high speed communication devices demand high performance polymers with low dielectric constant and minimum dielectric loss. Low dielectric constant resins are becoming more popular in these applications due to the development of the 5G network. Low dielectric loss resins are desirable materials for cables, antenna interlayers and communication equipment. Due to these characteristics, the low dielectric materials market is anticipated to witness an increase in demand for different low dielectric constant ceramics and resins.



Rising adoption in various applications is one of the major factors accelerating market growth

Thermoset resins such as cyanate esters and polyimide are low dielectric materials in the overall market. These resins have excellent heat resistance capacity and do not change shape with heat generation, making them a preferred material for manufacturing devices such as antenna, microelectronics, and radomes. Apart from this, ceramics are low in cost and have good strength and toughness. They are primarily used to manufacture microelectronics and radome, ultimately leading to the segment holding a considerable share in the global market.


Recent strategic developments in the low dielectric materials market

The low dielectric materials market has undergone several significant developments, and a few of these have been mentioned below:

  • In September 2021, Borealis and TOPAS Advanced Polymers collaborated to develop new class of engineering materials for capacitor film applications.
  • In November 2020, DuPont launched Kapton Polyimide Film to address the impact of faster voltage rise (dv/dt) on motor insulation.
  • In April 2020, AGC Chemicals launched Fluon+ mPEEK can be used to produce different geometries such as sheets, rods, tubes, gears, liners, wire and cable insulations, and film that better withstand demanding operational conditions.


The low dielectric materials market is driven by several players implementing strategic activities such as investments, new launches, mergers & acquisitions, and partnerships. Solvay S.A., Arxada, SABIC, The Chemours Company, and Shin-Etsu Chemical Co. Ltd. are among the prominent players operating in the market.

Target audience for the report:

  • Raw material providers
  • Low dielectric materials-related associations, organizations, forums, and alliances
  • Government bodies, such as regulating authorities and policy makers
  • Venture capitalists, private equity firms, and start-up companies
  • End users of low dielectric materials
  • Research institutes, organizations, and consulting companies
  • Electronics and Semiconductor Industry Associations

Scope of the report:

In this report, the market has been segmented on the basis of:

  • Material:
    • Fluoropolymer
    • Modified Polyphenylene Ether
    • Polyimide
    • Cyclic Olefin Copolymer
    • Cyanate Ester
    • Liquid Crystal Polymer
    • Others
  • Application:
    • PCBs
    • Antenna
    • Microelectronics
    • Wire & Cables
    • Others
  • Region
    • North America
    • Europe
    • Asia Pacific (APAC)
    • South & Central America
    • Middle East & Africa
  • Companies profiled
    • Solvay SA.
    • Arxada  
    • SABIC   
    • The Chemours Company  
    • Shin-Etsu Chemical Co. Ltd.     

Companies profiled
- Solvay SA.
- Arxada
- The Chemours Company
- Shin-Etsu Chemical Co. Ltd.

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