Asia Pacific SiP Technology Market

Historic Data: 2017-2018   |   Base Year: 2019   |   Forecast Period: 2020-2027

Analysis by Packaging Technology (2D IC, 2.5D IC, and 3D IC), Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, and Embedded SiP), Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, and Others), and End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication, and Others)

No. of Pages: 154
Report Code: TIPRE00018148
Category: Electronics and Semiconductor
Asia Pacific SiP Technology Market

Market Introduction

The SiP technology system market in APAC is further segmented into India, Japan, Australia, China, South Korea, and Rest of APAC. India and China are leading semiconductor manufacturing countries in APAC. Rising disposable income in developing countries, especially India and China—leading to large client base for high-tech consumer electronics such as smart wearables, smartphones, and electric vehicles—is driving the SiP technology market growth. China is a leading manufacturing hub for the SiP technology-based products, while India and Japan are also significant contributors to the regional growth. Many of the APAC countries are characterized by the mass production of electronic devices required for consumer electronics, automotive components, telecommunication devices, and other industrial machineries. Rising electronics manufacturing companies in India and China owing to strong availability of skilled human resources is driving the system in package technology market growth. Also, growing need of smartphone and PC to enhance the overall performance is a major factor driving the APAC SiP technology market.  

COVID-19 outbreak was first reported in China. China, India, South Korea, Japan, and other countries are increasingly moving toward the new networking solution such as 5G, 4G, and VoLTE. China and India are the biggest manufacturing hubs in the region and have increasing focus toward the industrialization. Lockdown, imposed due to COVID-19 outbreak, is hindering the market growth as businesses are remaining close. Manufacturing industry is also hampered, but soon its growth is expected to get recovered by enhancing the production capabilities in second half of the year 2021. The demand for many advanced electronics products such as smartwatch, smart wearable, and healthcare machines is rising at the significant rate. Companies in Asia are also restructuring their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, Universal Scientific Industrial (Shanghai) Co., Ltd. acquired the Asteelflash Group to utilize their production facilities for increasing production of SiP modules and other electronics devices.

Market Overview and Dynamics

The APAC SiP technology market is expected to grow from US$ 6,843.3 million in 2019 to US$ 9,881.8 million by 2027; it is estimated to grow at a CAGR of 7.0% from 2020 to 2027. Growing trend of the small form factor based handheld electronic devices is one of the major factors, which accelerates market growth. The technological advancement in electronics forming such as miniaturization has influenced various markets such as military, aerospace, medical, media, retail and consumer electronics. The devices with small form factor-based packages embed more functionality and becoming alternative for traditional packaging systems. Personalized healthcare gadgets, thin sized smartphone, compact PCs and others devices are occupied with system in package technology-based components such as processor, sensors, RF modules and others. Continuous development in advanced packaging technology such as 3D IC, 2.5D IC and others are further supplementing the market by resolving the technical challenges.

Key Market Segments

In terms of packaging technology, the 2D IC segment accounted for the largest share of the APAC SiP technology market in 2019. Based on packaging type, the flip-chip/wire-bond SiP segment held a larger market share of the APAC SiP technology market in 2019. On basis of interconnection technique, pin grid arrays held a substantial share throughout the forecast period. Based on end-user industry, consumer electronics segment is expected to be hold largest market share during the forecast period.

Major Sources and Companies Listed

A few major primary and secondary sources referred to for preparing this report on the SiP technology market in APAC are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Technology Holding Co., Ltd.; ChipMOS TECHNOLOGIES INC.; JCET Group Co., Ltd.; Qualcomm Technologies, Inc.; Renesas Electronics Corporation; Samsung; Taiwan Semiconductor Manufacturing Company, Limited; and Texas Instruments Incorporated.

Reasons to buy report

  • To understand the APAC SiP technology market landscape and identify market segments that are most likely to guarantee a strong return
  • Stay ahead of the race by comprehending the ever-changing competitive landscape for APAC SiP technology market
  • Efficiently plan M&A and partnership deals in APAC SiP technology market by identifying market segments with the most promising probable sales
  • Helps to take knowledgeable business decisions from perceptive and comprehensive analysis of market performance of various segment form APAC SiP technology market
  • Obtain market revenue forecast for market by various segments from 2020-2027 in APAC region.

APAC SiP technology Market Segmentation

APAC SiP technology Market - By Packaging

Technology

  • 2D IC
  • 2.5D IC
  • 3D

APAC SiP technology Market - By Packaging Type

  • Flip-Chip/Wire-Bond SiP
  • Fan-Out SiP
  • Embedded SiP

APAC SiP technology Market - By Interconnection Technique

  • Small Outline
  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
  • Others

APAC SiP technology Market - By End-User Industry

  • Automotive
  • Aerospace and Defense
  • Consumer Electronics
  • Telecommunication
  • Others

APAC SiP technology Market, By Country

  • Australia
  • China
  • India
  • Japan
  • South Korea
  • Rest of APAC

APAC SiP technology Market - Company Profiles

  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • ChipMOS TECHNOLOGIES INC.
  • JCET Group Co., Ltd.
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Texas Instruments Incorporated
 

Asia Pacific SiP Technology Market Strategic Insights

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Asia Pacific SiP Technology Market Segmentation Analysis

Asia Pacific SiP Technology Market Report Highlights

Asia Pacific SiP Technology Report Scope

Report Attribute Details
Market size in 2019 US$ 6,843.3 Million
Market Size by 2027 US$ 9,881.8 Million
CAGR (2020 - 2027) 7.0%
Historical Data 2017-2018
Forecast period 2020-2027
Segments Covered By Packaging Technology
  • 2D IC
  • 2.5D IC
  • 3D IC
By Packaging Type
  • Flip-Chip/Wire-Bond SiP
  • Fan-Out SiP
  • Embedded SiP
By Interconnection technique
  • Small Outline
  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
By End-User Industry
  • Automotive
  • Aerospace and Defense
  • Consumer Electronics
  • Telecommunication
Regions and Countries Covered
Asia-Pacific China, India, Japan, Australia, Rest of Asia-Pacific
Market leaders and key company profiles
  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • ChipMOS TECHNOLOGIES INC.
  • JCET Group Co., Ltd.
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Texas Instruments Incorporated
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Asia Pacific SiP Technology Market Country and Regional Insights

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The List of Companies - Asia Pacific SiP Technology Market

Some of the leading companies are:

  1. Amkor Technology, Inc.
  2. ASE Technology Holding Co., Ltd.
  3. ChipMOS TECHNOLOGIES INC.
  4. JCET Group Co., Ltd.
  5. Qualcomm Technologies, Inc.
  6. Renesas Electronics Corporation
  7. Samsung
  8. Taiwan Semiconductor Manufacturing Company, Limited
  9. Texas Instruments Incorporated
Frequently Asked Questions
How big is the Asia Pacific SiP Technology Market?

The Asia Pacific SiP Technology Market is valued at US$ 6,843.3 Million in 2019, it is projected to reach US$ 9,881.8 Million by 2027.

What is the CAGR for Asia Pacific SiP Technology Market by (2020 - 2027)?

As per our report Asia Pacific SiP Technology Market, the market size is valued at US$ 6,843.3 Million in 2019, projecting it to reach US$ 9,881.8 Million by 2027. This translates to a CAGR of approximately 7.0% during the forecast period.

What segments are covered in this report?

The Asia Pacific SiP Technology Market report typically cover these key segments-

  • Packaging Technology (2D IC, 2.5D IC, 3D IC)
  • Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, Embedded SiP)
  • Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount)
  • End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication)

What is the historic period, base year, and forecast period taken for Asia Pacific SiP Technology Market?

The historic period, base year, and forecast period can vary slightly depending on the specific market research report. However, for the Asia Pacific SiP Technology Market report:

  • Historic Period : 2017-2018
  • Base Year : 2019
  • Forecast Period : 2020-2027
  • Who are the major players in Asia Pacific SiP Technology Market?

    The Asia Pacific SiP Technology Market is populated by several key players, each contributing to its growth and innovation. Some of the major players include:

  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • ChipMOS TECHNOLOGIES INC.
  • JCET Group Co., Ltd.
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Texas Instruments Incorporated
  • Who should buy this report?

    The Asia Pacific SiP Technology Market report is valuable for diverse stakeholders, including:

    • Investors: Provides insights for investment decisions pertaining to market growth, companies, or industry insights. Helps assess market attractiveness and potential returns.
    • Industry Players: Offers competitive intelligence, market sizing, and trend analysis to inform strategic planning, product development, and sales strategies.
    • Suppliers and Manufacturers: Helps understand market demand for components, materials, and services related to concerned industry.
    • Researchers and Consultants: Provides data and analysis for academic research, consulting projects, and market studies.
    • Financial Institutions: Helps assess risks and opportunities associated with financing or investing in the concerned market.

    Essentially, anyone involved in or considering involvement in the Asia Pacific SiP Technology Market value chain can benefit from the information contained in a comprehensive market report.

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