Asia Pacific SiP Technology Market Forecast to 2027 - COVID-19 Impact and Regional Analysis by Packaging Technology (2D IC, 2.5D IC, and 3D IC), Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, and Embedded SiP), Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, and Others), and End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication, and Others)

Code: TIPRE00018148 | Pages: 154 | Industry: Electronics and Semiconductor | Date: Jan 2021 | Type: Regional

Market Introduction

The SiP technology system market in APAC is further segmented into India, Japan, Australia, China, South Korea, and Rest of APAC. India and China are leading semiconductor manufacturing countries in APAC. Rising disposable income in developing countries, especially India and China—leading to large client base for high-tech consumer electronics such as smart wearables, smartphones, and electric vehicles—is driving the SiP technology market growth. China is a leading manufacturing hub for the SiP technology-based products, while India and Japan are also significant contributors to the regional growth. Many of the APAC countries are characterized by the mass production of electronic devices required for consumer electronics, automotive components, telecommunication devices, and other industrial machineries. Rising electronics manufacturing companies in India and China owing to strong availability of skilled human resources is driving the system in package technology market growth. Also, growing need of smartphone and PC to enhance the overall performance is a major factor driving the APAC SiP technology market.  

COVID-19 outbreak was first reported in China. China, India, South Korea, Japan, and other countries are increasingly moving toward the new networking solution such as 5G, 4G, and VoLTE. China and India are the biggest manufacturing hubs in the region and have increasing focus toward the industrialization. Lockdown, imposed due to COVID-19 outbreak, is hindering the market growth as businesses are remaining close. Manufacturing industry is also hampered, but soon its growth is expected to get recovered by enhancing the production capabilities in second half of the year 2021. The demand for many advanced electronics products such as smartwatch, smart wearable, and healthcare machines is rising at the significant rate. Companies in Asia are also restructuring their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, Universal Scientific Industrial (Shanghai) Co., Ltd. acquired the Asteelflash Group to utilize their production facilities for increasing production of SiP modules and other electronics devices.


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Market Overview and Dynamics

The APAC SiP technology market is expected to grow from US$ 6,843.3 million in 2019 to US$ 9,881.8 million by 2027; it is estimated to grow at a CAGR of 7.0% from 2020 to 2027. Growing trend of the small form factor based handheld electronic devices is one of the major factors, which accelerates market growth. The technological advancement in electronics forming such as miniaturization has influenced various markets such as military, aerospace, medical, media, retail and consumer electronics. The devices with small form factor-based packages embed more functionality and becoming alternative for traditional packaging systems. Personalized healthcare gadgets, thin sized smartphone, compact PCs and others devices are occupied with system in package technology-based components such as processor, sensors, RF modules and others. Continuous development in advanced packaging technology such as 3D IC, 2.5D IC and others are further supplementing the market by resolving the technical challenges.

Key Market Segments

In terms of packaging technology, the 2D IC segment accounted for the largest share of the APAC SiP technology market in 2019. Based on packaging type, the flip-chip/wire-bond SiP segment held a larger market share of the APAC SiP technology market in 2019. On basis of interconnection technique, pin grid arrays held a substantial share throughout the forecast period. Based on end-user industry, consumer electronics segment is expected to be hold largest market share during the forecast period.

Major Sources and Companies Listed

A few major primary and secondary sources referred to for preparing this report on the SiP technology market in APAC are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Technology Holding Co., Ltd.; ChipMOS TECHNOLOGIES INC.; JCET Group Co., Ltd.; Qualcomm Technologies, Inc.; Renesas Electronics Corporation; Samsung; Taiwan Semiconductor Manufacturing Company, Limited; and Texas Instruments Incorporated.

Reasons to buy report

  • To understand the APAC SiP technology market landscape and identify market segments that are most likely to guarantee a strong return
  • Stay ahead of the race by comprehending the ever-changing competitive landscape for APAC SiP technology market
  • Efficiently plan M&A and partnership deals in APAC SiP technology market by identifying market segments with the most promising probable sales
  • Helps to take knowledgeable business decisions from perceptive and comprehensive analysis of market performance of various segment form APAC SiP technology market
  • Obtain market revenue forecast for market by various segments from 2020-2027 in APAC region.

APAC SiP technology Market Segmentation

APAC SiP technology Market - By Packaging

Technology

  • 2D IC
  • 2.5D IC
  • 3D

APAC SiP technology Market - By Packaging Type

  • Flip-Chip/Wire-Bond SiP
  • Fan-Out SiP
  • Embedded SiP

APAC SiP technology Market - By Interconnection Technique

  • Small Outline
  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
  • Others

APAC SiP technology Market - By End-User Industry

  • Automotive
  • Aerospace and Defense
  • Consumer Electronics
  • Telecommunication
  • Others

APAC SiP technology Market, By Country

  • Australia
  • China
  • India
  • Japan
  • South Korea
  • Rest of APAC

APAC SiP technology Market - Company Profiles

  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • ChipMOS TECHNOLOGIES INC.
  • JCET Group Co., Ltd.
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Texas Instruments Incorporated
 

TABLE OF CONTENTS

1.           Introduction

1.1         Scope of the Study

1.2         The Insight Partners Research Report Guidance

1.3         Market Segmentation

1.3.1        APAC System in Package (SiP) Technology Market – By Packaging Technology

1.3.2        APAC System in Package (SiP) Technology Market – By Packaging Type

1.3.3        APAC System in Package (SiP) Technology Market – By Interconnection Technology

1.3.4        APAC System in Package (SiP) Technology Market – By End-User Industry

1.3.5        APAC System in Package (SiP) Technology Market – By Country

2.           Key Takeaways

3.           Research Methodology

3.1         Coverage

3.2         Secondary Research

3.3         Primary Research

4.           APAC SiP Technology – Market Landscape

4.1         Market Overview

4.2         APAC PEST Analysis

4.3         Ecosystem Analysis

5.           APAC SiP Technology –Market Dynamics

5.1         Key Market Drivers

5.1.1        Miniaturization of Electronic Devices Witnessing High Demand

5.1.2        Increase in Network 5G Network Services Growth

5.2         Key Market Restraints

5.2.1        Technical Problems and Presence of Substitutes

5.3         Key Market Opportunities

5.3.1        Growing Need of Smartphone and PC to Enhance the performance

5.4         Future Trends

5.4.1        Wearable technology and IoT Expecting Substantial Growth

5.5         Impact Analysis of Drivers and Restraints

6.           SiP Technology Market – APAC Analysis

6.1         APAC System in Package (SiP) Technology Market Overview

6.2         APAC System in Package (SiP) Technology Market Revenue Forecast and Analysis

6.3         Market Positioning – Five Key Players

7.           APAC SiP Technology Market Analysis – by Packaging Technology

7.1         Overview

7.2         APAC SiP Technology Market Breakdown, by packaging technology, 2019 & 2027

7.3         2D IC

7.3.1        Overview

7.3.2        2D IC Market Forecast and Analysis

7.4         2.5D IC

7.4.1        Overview

7.4.2        2.5D IC Market Forecast and Analysis

7.5         3D IC

7.5.1        Overview

7.5.2        3D IC Market Forecast and Analysis

8.           APAC SiP Technology Market Analysis –  Packaging Type

8.1         Overview

8.2         APAC SiP Technology Market Breakdown, By Packaging Type, 2019 &2027

8.3         Flip-Chip/Wire-Bond SiP Market

8.3.1        Overview

8.3.2        Flip-Chip/Wire-Bond SiP Market Forecast and Analysis

8.4         Fan-Out SiP Market

8.4.1        Overview

8.4.2        Fan-Out SiP Market Forecast and Analysis

8.5         Embedded SiP Market

8.5.1        Overview

8.5.2        Embedded SiP Market Forecast and Analysis

9.           APAC SiP Technology Market Analysis – By Interconnection Technique

9.1         Overview

9.2         APAC SiP technology Market Breakdown, By Interconnection Technique, 2019 &2027

9.3         Small Outline

9.3.1        Overview

9.3.2        Small Outline Market Forecast and Analysis

9.4         Flat Packages

9.4.1        Overview

9.4.2        Flat Packages Market Forecast and Analysis

9.5         Pin Grid Arrays

9.5.1        Overview

9.5.2        Pin Grid Arrays Market Forecast and Analysis

9.6         Surface Mount

9.6.1        Overview

9.6.2        Surface Mount Market Forecast and Analysis

9.7         Others

9.7.1        Overview

9.7.2        Others Market Forecast and Analysis

10.        APAC SiP Technology Market Analysis – By End-User Industry

10.1      Overview

10.2      APAC SiP technology Market Breakdown, By END-USER INDUSTRY, 2019 & 2027

10.3      Automotive

10.3.1     Overview

10.3.2     Automotive Market Forecast and Analysis

10.4      Aerospace & Defense

10.4.1     Overview

10.4.2     Aerospace and Defense Market Forecast and Analysis

10.5      Consumer Electronics

10.5.1     Overview

10.5.2     Consumer Electronics

10.6      Telecommunications

10.6.1     Overview

10.6.2     Telecommunication Market Forecast and Analysis

10.7      Others

10.7.1     Overview

10.7.2     Others Market Forecast and Analysis

11.        APAC SiP Technology Market – Country Analysis

11.1      Overview

11.1.1     APAC: SiP technology Market, By Country

11.1.2     China SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

11.1.2.1       China System in Package (SiP) Technology Market, by Packaging Technology

11.1.2.2       China System in Package (SiP) Technology Market, by Packaging Type

11.1.2.3       China System in Package (SiP) Technology Market, by Interconnection Technology

11.1.2.4       China System in Package (SiP) Technology Market, by End-User Industry

11.1.3     Japan SiP Technology Market Revenue and Forecast to 2027 (US$ million)

11.1.3.1       Japan System in Package (SiP) Technology Market, by Packaging Technology

11.1.3.2       Japan System in Package (SiP) Technology Market, by Packaging

11.1.3.3       Japan System in Package (SiP) Technology Market, by Interconnection Technology

11.1.3.4       Japan System in Package (SiP) Technology Market, by End-user Industry

11.1.4     Australia SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

11.1.4.1       Australia System in Package (SiP) Technology Market, by Packaging Technology

11.1.4.2       Australia System in Package (SiP) Technology Market, by Packaging Type

11.1.4.3       Australia System in Package (SiP) Technology Market, by Interconnection Technology

11.1.4.4       Australia System in Package (SiP) Technology Market, by End-user Industry

11.1.5     India SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

11.1.5.1       India System in Package (SiP) Technology Market, by Packaging Technology

11.1.5.2       India System in Package (SiP) Technology Market, by Packaging Type

11.1.5.3       India System in Package (SiP) Technology Market, by Interconnection Technology

11.1.5.4       India System in Package (SiP) Technology Market, by End-User Industry

11.1.6     South Korea SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

11.1.6.1       South Korea System in Package (SiP) Technology Market, by Packaging Technogym

11.1.6.2       South Korea System in Package (SiP) Technology Market, by Packaging Type

11.1.6.3       South Korea System in Package (SiP) Technology Market, by Interconnection Technology

11.1.6.4       South Korea System in Package (SiP) Technology Market, by End-user Industry

11.1.7     Rest of APAC SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

11.1.7.1       Rest of APAC System in Package (SiP) Technology Market, by Packaging Technology

11.1.7.2       Rest of APAC System in Package (SiP) Technology Market, by Packaging

11.1.7.3       Rest of APAC System in Package (SiP) Technology Market, by Interconnection Technology

11.1.7.4       Rest of APAC System in Package (SiP) Technology Market, by End-user Industry

12.        APAC SiP Technology Market - COVID-19 Impact Analysis

12.1      APAC: Impact Assessment of COVID-19 Pandemic

13.        Industry Landscape

13.1      Overview

13.2      Market Initiative

14.        Company Profiles

14.1      Amkor Technology, Inc.

14.1.1     Key Facts

14.1.2     Business Description

14.1.3     Products and Services

14.1.4     Financial Overview

14.1.5     SWOT Analysis

14.1.6     Key Developments

14.2      ASE Technology Holding Co. Ltd

14.2.1     Key Facts

14.2.2     Business Description

14.2.3     Products and Services

14.2.4     Financial Overview

14.2.5     SWOT Analysis

14.2.6     Key Developments

14.3      ChipMOS TECHNOLOGIES INC.

14.3.1     Key Facts

14.3.2     Business Description

14.3.3     Products and Services

14.3.4     Financial Overview

14.3.5     SWOT Analysis

14.3.6     Key Developments

14.4      JCET Group Co., Ltd.

14.4.1     Key Facts

14.4.2     Business Description

14.4.3     Products and Services

14.4.4     SWOT Analysis

14.4.5     Key Developments

14.5      QUALCOMM INCORPORATED

14.5.1     Key Facts

14.5.2     Business Description

14.5.3     Products and Services

14.5.4     Financial Overview

14.5.5     SWOT Analysis

14.5.6     Key Developments

14.6      Samsung

14.6.1     Key Facts

14.6.2     Business Description

14.6.3     Products and Services

14.6.4     Financial Overview

14.6.5     SWOT Analysis

14.6.6     Key Developments

14.7      Renesas Electronics Corporation

14.7.1     Key Facts

14.7.2     Business Description

14.7.3     Products and Services

14.7.4     Financial Overview

14.7.5     SWOT Analysis

14.7.6     Key Developments

14.8      Texas Instruments Incorporated

14.8.1     Key Facts

14.8.2     Business Description

14.8.3     Products and Services

14.8.4     Financial Overview

14.8.5     SWOT Analysis

14.8.6     Key Developments

14.9      Taiwan Semiconductor Manufacturing Company, Limited

14.9.1     Key Facts

14.9.2     Business Description

14.9.3     Products and Services

14.9.4     Financial Overview

14.9.5     SWOT Analysis

14.9.6     Key Developments

15.        Appendix

15.1      About The Insight Partners

             15.2      Glossary of Terms

LIST OF TABLES

Table 1.             APAC System in Package (SiP) Technology Market Revenue and Forecasts to 2027 (US$ Million)

Table 2.             China System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 3.             China System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 4.             China System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 5.             China System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 6.             Japan System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 7.             Japan System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 8.             Japan System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 9.             Japan System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 10.          Australia System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 11.          Australia System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 12.          Australia System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 13.          Australia System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 14.          India System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 15.          India System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027  (USD Million)

Table 16.          India System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 17.          India System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)

Table 18.          South Korea System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 19.          South Korea System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 20.          South Korea System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 21.          South Korea System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 22.          Rest of APAC System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)

Table 23.          Rest of APAC System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)

Table 24.          Rest of APAC System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)

Table 25.          Rest of APAC System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)

Table 26.            Glossary of Terms

LIST OF FIGURES

Figure 1.           APAC System in Package (SiP) Technology Market Segmentation

Figure 2.           APAC System in Package (SiP) Technology Market Segmentation - Country

Figure 3.           APAC System in Package (SiP) Technology Market Overview

Figure 4.           China Held the Largest Share in APAC System in Package (SiP) Technology Market in 2019

Figure 5.           APAC System in Package (SiP) Technology Market, By Packaging Technology

Figure 6.           APAC System in Package (SiP) Technology Market, By Packaging Type

Figure 7.           APAC System in Package (SiP) Technology Market, By Interconnection Technology

Figure 8.           APAC System in Package (SiP) Technology Market, By End-User Industry

Figure 9.           APAC: PEST Analysis

Figure 10.        APAC System in package (SiP) technology Market- Ecosystem Analysis

Figure 11.        APAC System in package (SiP) technology Market Impact Analysis of Drivers and Restraints

Figure 12.        APAC System in Package (SiP) Technology Market Revenue Forecast and Analysis, (US$ Million)

Figure 13.        APAC SiP technology Market Breakdown, by packaging technology, 2019 & 2027 (%)

Figure 14.        APAC 2D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 15.        APAC 2.5D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 16.        APAC 3D IC Market Revenue and Forecast to 2027 (US$ Mn)

Figure 17.        APAC SiP Technology Market Breakdown, By Packaging Type, 2019 & 2027 (%)

Figure 18.        APAC Flip-Chip/ Wire-Bond Sip Market Revenue and Forecast to 2027 (US$ MN)

Figure 19.        APAC Fan-Out SiP Market Revenue and Forecast to 2027 (US$ Mn)

Figure 20.        APAC Embedded SiP Market Revenue and Forecast to 2027 (US$ Mn)

Figure 21.        APAC SiP Technology Market Breakdown, By Interconnection Technique, 2019 &2027 (%)

Figure 22.        APAC Small Outline Market Revenue and Forecast to 2027 (US$ Mn)

Figure 23.        APAC Flat Packages Market Revenue and Forecast to 2027 (US$ Mn)

Figure 24.        APAC Pin Grid Arrays Market Revenue and Forecast to 2027 (US$ Mn)

Figure 25.        APAC Surface Mount Market Revenue and Forecast to 2027 (US$ Mn)

Figure 26.        APAC Others Market Revenue and Forecast to 2027 (US$ Mn)

Figure 27.        APAC SiP Technology Market Breakdown, By END-USER INDUSTRY, 2019 & 2027 (%)

Figure 28.        APAC Automotive Market Revenue and Forecast to 2027 (US$ Mn)

Figure 29.        APAC Aerospace and Defense Market Revenue and Forecast to 2027 (US$ Mn)

Figure 30.        APAC Consumer Electronics Market Revenue and Forecast to 2027 (US$ Mn)

Figure 31.        APAC Telecommunication Market Revenue and Forecast to 2027 (US$ Mn)

Figure 32.        APAC Others Market Revenue and Forecast to 2027 (US$ Mn)

Figure 33.        APAC SiP Technology Market Revenue Share, By Country (2019 and 2027)

Figure 34.        China SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

Figure 35.        Japan SiP Technology Market Revenue and Forecast to 2027 (US$ million)

Figure 36.        Australia SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)

Figure 37.        India SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

Figure 38.        South Korea SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

Figure 39.        Rest of APAC SiP Technology Market Revenue and Forecasts to 2027 (US$ million)

Figure 40.          Impact of COVID-19 Pandemic in APAC Country Markets

 

Some of the leading companies are:

  1. Amkor Technology, Inc.
  2. ASE Technology Holding Co., Ltd.
  3. ChipMOS TECHNOLOGIES INC.
  4. JCET Group Co., Ltd.
  5. Qualcomm Technologies, Inc.
  6. Renesas Electronics Corporation
  7. Samsung
  8. Taiwan Semiconductor Manufacturing Company, Limited
  9. Texas Instruments Incorporated
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