Asia Pacific SiP Technology Market Forecast to 2027 - COVID-19 Impact and Regional Analysis by Packaging Technology (2D IC, 2.5D IC, and 3D IC), Packaging Type (Flip-Chip/Wire-Bond SiP, Fan-Out SiP, and Embedded SiP), Interconnection technique (Small Outline, Flat Packages, Pin Grid Arrays, Surface Mount, and Others), and End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, Telecommunication, and Others)
Market Introduction
The SiP technology system market in APAC is further segmented into India, Japan, Australia, China, South Korea, and Rest of APAC. India and China are leading semiconductor manufacturing countries in APAC. Rising disposable income in developing countries, especially India and China—leading to large client base for high-tech consumer electronics such as smart wearables, smartphones, and electric vehicles—is driving the SiP technology market growth. China is a leading manufacturing hub for the SiP technology-based products, while India and Japan are also significant contributors to the regional growth. Many of the APAC countries are characterized by the mass production of electronic devices required for consumer electronics, automotive components, telecommunication devices, and other industrial machineries. Rising electronics manufacturing companies in India and China owing to strong availability of skilled human resources is driving the system in package technology market growth. Also, growing need of smartphone and PC to enhance the overall performance is a major factor driving the APAC SiP technology market.
COVID-19 outbreak was first reported in China. China, India, South Korea, Japan, and other countries are increasingly moving toward the new networking solution such as 5G, 4G, and VoLTE. China and India are the biggest manufacturing hubs in the region and have increasing focus toward the industrialization. Lockdown, imposed due to COVID-19 outbreak, is hindering the market growth as businesses are remaining close. Manufacturing industry is also hampered, but soon its growth is expected to get recovered by enhancing the production capabilities in second half of the year 2021. The demand for many advanced electronics products such as smartwatch, smart wearable, and healthcare machines is rising at the significant rate. Companies in Asia are also restructuring their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, Universal Scientific Industrial (Shanghai) Co., Ltd. acquired the Asteelflash Group to utilize their production facilities for increasing production of SiP modules and other electronics devices.
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Market Overview and Dynamics
The APAC SiP technology market is expected to grow from US$ 6,843.3 million in 2019 to US$ 9,881.8 million by 2027; it is estimated to grow at a CAGR of 7.0% from 2020 to 2027. Growing trend of the small form factor based handheld electronic devices is one of the major factors, which accelerates market growth. The technological advancement in electronics forming such as miniaturization has influenced various markets such as military, aerospace, medical, media, retail and consumer electronics. The devices with small form factor-based packages embed more functionality and becoming alternative for traditional packaging systems. Personalized healthcare gadgets, thin sized smartphone, compact PCs and others devices are occupied with system in package technology-based components such as processor, sensors, RF modules and others. Continuous development in advanced packaging technology such as 3D IC, 2.5D IC and others are further supplementing the market by resolving the technical challenges.
Key Market Segments
In terms of packaging technology, the 2D IC segment accounted for the largest share of the APAC SiP technology market in 2019. Based on packaging type, the flip-chip/wire-bond SiP segment held a larger market share of the APAC SiP technology market in 2019. On basis of interconnection technique, pin grid arrays held a substantial share throughout the forecast period. Based on end-user industry, consumer electronics segment is expected to be hold largest market share during the forecast period.
Major Sources and Companies Listed
A few major primary and secondary sources referred to for preparing this report on the SiP technology market in APAC are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Technology Holding Co., Ltd.; ChipMOS TECHNOLOGIES INC.; JCET Group Co., Ltd.; Qualcomm Technologies, Inc.; Renesas Electronics Corporation; Samsung; Taiwan Semiconductor Manufacturing Company, Limited; and Texas Instruments Incorporated.
Reasons to buy report
- To understand the APAC SiP technology market landscape and identify market segments that are most likely to guarantee a strong return
- Stay ahead of the race by comprehending the ever-changing competitive landscape for APAC SiP technology market
- Efficiently plan M&A and partnership deals in APAC SiP technology market by identifying market segments with the most promising probable sales
- Helps to take knowledgeable business decisions from perceptive and comprehensive analysis of market performance of various segment form APAC SiP technology market
- Obtain market revenue forecast for market by various segments from 2020-2027 in APAC region.
APAC SiP technology Market Segmentation
APAC SiP technology Market - By Packaging
Technology
- 2D IC
- 2.5D IC
- 3D
APAC SiP technology Market - By Packaging Type
- Flip-Chip/Wire-Bond SiP
- Fan-Out SiP
- Embedded SiP
APAC SiP technology Market - By Interconnection Technique
- Small Outline
- Flat Packages
- Pin Grid Arrays
- Surface Mount
- Others
APAC SiP technology Market - By End-User Industry
- Automotive
- Aerospace and Defense
- Consumer Electronics
- Telecommunication
- Others
APAC SiP technology Market, By Country
- Australia
- China
- India
- Japan
- South Korea
- Rest of APAC
APAC SiP technology Market - Company Profiles
- Amkor Technology, Inc.
- ASE Technology Holding Co., Ltd.
- ChipMOS TECHNOLOGIES INC.
- JCET Group Co., Ltd.
- Qualcomm Technologies, Inc.
- Renesas Electronics Corporation
- Samsung
- Taiwan Semiconductor Manufacturing Company, Limited
- Texas Instruments Incorporated
TABLE OF CONTENTS
1. Introduction
1.1 Scope of the Study
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
1.3.1 APAC System in Package (SiP) Technology Market – By Packaging Technology
1.3.2 APAC System in Package (SiP) Technology Market – By Packaging Type
1.3.3 APAC System in Package (SiP) Technology Market – By Interconnection Technology
1.3.4 APAC System in Package (SiP) Technology Market – By End-User Industry
1.3.5 APAC System in Package (SiP) Technology Market – By Country
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. APAC SiP Technology – Market Landscape
4.1 Market Overview
4.2 APAC PEST Analysis
4.3 Ecosystem Analysis
5. APAC SiP Technology –Market Dynamics
5.1 Key Market Drivers
5.1.1 Miniaturization of Electronic Devices Witnessing High Demand
5.1.2 Increase in Network 5G Network Services Growth
5.2 Key Market Restraints
5.2.1 Technical Problems and Presence of Substitutes
5.3 Key Market Opportunities
5.3.1 Growing Need of Smartphone and PC to Enhance the performance
5.4 Future Trends
5.4.1 Wearable technology and IoT Expecting Substantial Growth
5.5 Impact Analysis of Drivers and Restraints
6. SiP Technology Market – APAC Analysis
6.1 APAC System in Package (SiP) Technology Market Overview
6.2 APAC System in Package (SiP) Technology Market Revenue Forecast and Analysis
6.3 Market Positioning – Five Key Players
7. APAC SiP Technology Market Analysis – by Packaging Technology
7.1 Overview
7.2 APAC SiP Technology Market Breakdown, by packaging technology, 2019 & 2027
7.3 2D IC
7.3.1 Overview
7.3.2 2D IC Market Forecast and Analysis
7.4 2.5D IC
7.4.1 Overview
7.4.2 2.5D IC Market Forecast and Analysis
7.5 3D IC
7.5.1 Overview
7.5.2 3D IC Market Forecast and Analysis
8. APAC SiP Technology Market Analysis – Packaging Type
8.1 Overview
8.2 APAC SiP Technology Market Breakdown, By Packaging Type, 2019 &2027
8.3 Flip-Chip/Wire-Bond SiP Market
8.3.1 Overview
8.3.2 Flip-Chip/Wire-Bond SiP Market Forecast and Analysis
8.4 Fan-Out SiP Market
8.4.1 Overview
8.4.2 Fan-Out SiP Market Forecast and Analysis
8.5 Embedded SiP Market
8.5.1 Overview
8.5.2 Embedded SiP Market Forecast and Analysis
9. APAC SiP Technology Market Analysis – By Interconnection Technique
9.1 Overview
9.2 APAC SiP technology Market Breakdown, By Interconnection Technique, 2019 &2027
9.3 Small Outline
9.3.1 Overview
9.3.2 Small Outline Market Forecast and Analysis
9.4 Flat Packages
9.4.1 Overview
9.4.2 Flat Packages Market Forecast and Analysis
9.5 Pin Grid Arrays
9.5.1 Overview
9.5.2 Pin Grid Arrays Market Forecast and Analysis
9.6 Surface Mount
9.6.1 Overview
9.6.2 Surface Mount Market Forecast and Analysis
9.7 Others
9.7.1 Overview
9.7.2 Others Market Forecast and Analysis
10. APAC SiP Technology Market Analysis – By End-User Industry
10.1 Overview
10.2 APAC SiP technology Market Breakdown, By END-USER INDUSTRY, 2019 & 2027
10.3 Automotive
10.3.1 Overview
10.3.2 Automotive Market Forecast and Analysis
10.4 Aerospace & Defense
10.4.1 Overview
10.4.2 Aerospace and Defense Market Forecast and Analysis
10.5 Consumer Electronics
10.5.1 Overview
10.5.2 Consumer Electronics
10.6 Telecommunications
10.6.1 Overview
10.6.2 Telecommunication Market Forecast and Analysis
10.7 Others
10.7.1 Overview
10.7.2 Others Market Forecast and Analysis
11. APAC SiP Technology Market – Country Analysis
11.1 Overview
11.1.1 APAC: SiP technology Market, By Country
11.1.2 China SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
11.1.2.1 China System in Package (SiP) Technology Market, by Packaging Technology
11.1.2.2 China System in Package (SiP) Technology Market, by Packaging Type
11.1.2.3 China System in Package (SiP) Technology Market, by Interconnection Technology
11.1.2.4 China System in Package (SiP) Technology Market, by End-User Industry
11.1.3 Japan SiP Technology Market Revenue and Forecast to 2027 (US$ million)
11.1.3.1 Japan System in Package (SiP) Technology Market, by Packaging Technology
11.1.3.2 Japan System in Package (SiP) Technology Market, by Packaging
11.1.3.3 Japan System in Package (SiP) Technology Market, by Interconnection Technology
11.1.3.4 Japan System in Package (SiP) Technology Market, by End-user Industry
11.1.4 Australia SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
11.1.4.1 Australia System in Package (SiP) Technology Market, by Packaging Technology
11.1.4.2 Australia System in Package (SiP) Technology Market, by Packaging Type
11.1.4.3 Australia System in Package (SiP) Technology Market, by Interconnection Technology
11.1.4.4 Australia System in Package (SiP) Technology Market, by End-user Industry
11.1.5 India SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.1.5.1 India System in Package (SiP) Technology Market, by Packaging Technology
11.1.5.2 India System in Package (SiP) Technology Market, by Packaging Type
11.1.5.3 India System in Package (SiP) Technology Market, by Interconnection Technology
11.1.5.4 India System in Package (SiP) Technology Market, by End-User Industry
11.1.6 South Korea SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.1.6.1 South Korea System in Package (SiP) Technology Market, by Packaging Technogym
11.1.6.2 South Korea System in Package (SiP) Technology Market, by Packaging Type
11.1.6.3 South Korea System in Package (SiP) Technology Market, by Interconnection Technology
11.1.6.4 South Korea System in Package (SiP) Technology Market, by End-user Industry
11.1.7 Rest of APAC SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.1.7.1 Rest of APAC System in Package (SiP) Technology Market, by Packaging Technology
11.1.7.2 Rest of APAC System in Package (SiP) Technology Market, by Packaging
11.1.7.3 Rest of APAC System in Package (SiP) Technology Market, by Interconnection Technology
11.1.7.4 Rest of APAC System in Package (SiP) Technology Market, by End-user Industry
12. APAC SiP Technology Market - COVID-19 Impact Analysis
12.1 APAC: Impact Assessment of COVID-19 Pandemic
13. Industry Landscape
13.1 Overview
13.2 Market Initiative
14. Company Profiles
14.1 Amkor Technology, Inc.
14.1.1 Key Facts
14.1.2 Business Description
14.1.3 Products and Services
14.1.4 Financial Overview
14.1.5 SWOT Analysis
14.1.6 Key Developments
14.2 ASE Technology Holding Co. Ltd
14.2.1 Key Facts
14.2.2 Business Description
14.2.3 Products and Services
14.2.4 Financial Overview
14.2.5 SWOT Analysis
14.2.6 Key Developments
14.3 ChipMOS TECHNOLOGIES INC.
14.3.1 Key Facts
14.3.2 Business Description
14.3.3 Products and Services
14.3.4 Financial Overview
14.3.5 SWOT Analysis
14.3.6 Key Developments
14.4 JCET Group Co., Ltd.
14.4.1 Key Facts
14.4.2 Business Description
14.4.3 Products and Services
14.4.4 SWOT Analysis
14.4.5 Key Developments
14.5 QUALCOMM INCORPORATED
14.5.1 Key Facts
14.5.2 Business Description
14.5.3 Products and Services
14.5.4 Financial Overview
14.5.5 SWOT Analysis
14.5.6 Key Developments
14.6 Samsung
14.6.1 Key Facts
14.6.2 Business Description
14.6.3 Products and Services
14.6.4 Financial Overview
14.6.5 SWOT Analysis
14.6.6 Key Developments
14.7 Renesas Electronics Corporation
14.7.1 Key Facts
14.7.2 Business Description
14.7.3 Products and Services
14.7.4 Financial Overview
14.7.5 SWOT Analysis
14.7.6 Key Developments
14.8 Texas Instruments Incorporated
14.8.1 Key Facts
14.8.2 Business Description
14.8.3 Products and Services
14.8.4 Financial Overview
14.8.5 SWOT Analysis
14.8.6 Key Developments
14.9 Taiwan Semiconductor Manufacturing Company, Limited
14.9.1 Key Facts
14.9.2 Business Description
14.9.3 Products and Services
14.9.4 Financial Overview
14.9.5 SWOT Analysis
14.9.6 Key Developments
15. Appendix
15.1 About The Insight Partners
15.2 Glossary of TermsLIST OF TABLES
Table 1. APAC System in Package (SiP) Technology Market Revenue and Forecasts to 2027 (US$ Million)
Table 2. China System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 3. China System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 4. China System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 5. China System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 6. Japan System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 7. Japan System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 8. Japan System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 9. Japan System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 10. Australia System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 11. Australia System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 12. Australia System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 13. Australia System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 14. India System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 15. India System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 16. India System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 17. India System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)
Table 18. South Korea System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 19. South Korea System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 20. South Korea System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 21. South Korea System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 22. Rest of APAC System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 23. Rest of APAC System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 24. Rest of APAC System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 25. Rest of APAC System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 26. Glossary of TermsLIST OF FIGURES
Figure 1. APAC System in Package (SiP) Technology Market Segmentation
Figure 2. APAC System in Package (SiP) Technology Market Segmentation - Country
Figure 3. APAC System in Package (SiP) Technology Market Overview
Figure 4. China Held the Largest Share in APAC System in Package (SiP) Technology Market in 2019
Figure 5. APAC System in Package (SiP) Technology Market, By Packaging Technology
Figure 6. APAC System in Package (SiP) Technology Market, By Packaging Type
Figure 7. APAC System in Package (SiP) Technology Market, By Interconnection Technology
Figure 8. APAC System in Package (SiP) Technology Market, By End-User Industry
Figure 9. APAC: PEST Analysis
Figure 10. APAC System in package (SiP) technology Market- Ecosystem Analysis
Figure 11. APAC System in package (SiP) technology Market Impact Analysis of Drivers and Restraints
Figure 12. APAC System in Package (SiP) Technology Market Revenue Forecast and Analysis, (US$ Million)
Figure 13. APAC SiP technology Market Breakdown, by packaging technology, 2019 & 2027 (%)
Figure 14. APAC 2D IC Market Revenue and Forecast to 2027 (US$ Mn)
Figure 15. APAC 2.5D IC Market Revenue and Forecast to 2027 (US$ Mn)
Figure 16. APAC 3D IC Market Revenue and Forecast to 2027 (US$ Mn)
Figure 17. APAC SiP Technology Market Breakdown, By Packaging Type, 2019 & 2027 (%)
Figure 18. APAC Flip-Chip/ Wire-Bond Sip Market Revenue and Forecast to 2027 (US$ MN)
Figure 19. APAC Fan-Out SiP Market Revenue and Forecast to 2027 (US$ Mn)
Figure 20. APAC Embedded SiP Market Revenue and Forecast to 2027 (US$ Mn)
Figure 21. APAC SiP Technology Market Breakdown, By Interconnection Technique, 2019 &2027 (%)
Figure 22. APAC Small Outline Market Revenue and Forecast to 2027 (US$ Mn)
Figure 23. APAC Flat Packages Market Revenue and Forecast to 2027 (US$ Mn)
Figure 24. APAC Pin Grid Arrays Market Revenue and Forecast to 2027 (US$ Mn)
Figure 25. APAC Surface Mount Market Revenue and Forecast to 2027 (US$ Mn)
Figure 26. APAC Others Market Revenue and Forecast to 2027 (US$ Mn)
Figure 27. APAC SiP Technology Market Breakdown, By END-USER INDUSTRY, 2019 & 2027 (%)
Figure 28. APAC Automotive Market Revenue and Forecast to 2027 (US$ Mn)
Figure 29. APAC Aerospace and Defense Market Revenue and Forecast to 2027 (US$ Mn)
Figure 30. APAC Consumer Electronics Market Revenue and Forecast to 2027 (US$ Mn)
Figure 31. APAC Telecommunication Market Revenue and Forecast to 2027 (US$ Mn)
Figure 32. APAC Others Market Revenue and Forecast to 2027 (US$ Mn)
Figure 33. APAC SiP Technology Market Revenue Share, By Country (2019 and 2027)
Figure 34. China SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
Figure 35. Japan SiP Technology Market Revenue and Forecast to 2027 (US$ million)
Figure 36. Australia SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
Figure 37. India SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 38. South Korea SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 39. Rest of APAC SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 40. Impact of COVID-19 Pandemic in APAC Country Markets
Some of the leading companies are:
- Amkor Technology, Inc.
- ASE Technology Holding Co., Ltd.
- ChipMOS TECHNOLOGIES INC.
- JCET Group Co., Ltd.
- Qualcomm Technologies, Inc.
- Renesas Electronics Corporation
- Samsung
- Taiwan Semiconductor Manufacturing Company, Limited
- Texas Instruments Incorporated
- Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the APAC SiP technology market
- Highlights key business priorities in order to assist companies to realign their business strategies
- The key findings and recommendations highlight crucial progressive industry trends in the APAC SiP technology market, thereby allowing players across the value chain to develop effective long-term strategies
- Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
- Scrutinize in-depth APAC market trends and outlook coupled with the factors driving the SiP technology market, as well as those hindering it
- Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution