At 2.3% CAGR, South & Central America SMT Equipment Market is Projected to be Worth US$ 312.74 Million by 2031, says Business Market Insights

According to Business Market Insights' research, the South & Central America SMT equipment market was valued at US$ 260.82 million in 2023 and is expected to reach US$ 312.74 million by 2031, registering a CAGR of 2.3% from 2023 to 2031. Increasing need for environment-friendly electronic components and evolution of 3d packaging and through silicon via (TSV) technologies are among the critical factors attributed to drive the South & Central America SMT equipment market growth. 

Future electronic device development is expected to be strongly influenced by through-silicon-via technology, a type of vertical interconnect access (VIA) connection used in IC packaging to provide vertical electrical connections between silicon wafers or dies. TSV technology establishes electrical contact with surface-mounted devices while mirrored sidewalls enhance package reflectivity and improve light efficiency. Due to the growing need for small and compact electronic devices, semiconductor firms are focusing on developing three-dimensional (3D) SIP technology to create 3D ICs. TSV is the core technology underpinning these 3D integrated circuits. To solve the problems of miniaturization and performance, the industry is looking at novel 3D packaging options. Through Silicon Via (TSV) technology allows vertical stacking of several dies or chips, resulting in high-density 3D integrated circuits (3D ICs). This method not only decreases the total package footprint but also shortens interconnect lengths and increases signal integrity and performance. The evolution of 3D packaging and TSV is expected to be a trend in the South & Central America SMT equipment market.

On the conversely, the high initial investments hamper the growth of South & Central America SMT equipment market.

Based on component, the South & Central America SMT equipment market is bifurcated into passive component and active component. The active component segment held 71.1% market share in 2023, amassing US$ 185.48 million. It is projected to garner US$ 228.22 million by 2031 to register 2.6% CAGR during 2023-2031.

In terms of equipment type, the South & Central America SMT equipment market is segmented into inspection equipment, placement equipment, soldering equipment, screen printing equipment, cleaning equipment, and others. The placement equipment segment held 35.3% share of South & Central America SMT equipment market in 2023, amassing US$ 91.99 million. It is anticipated to garner US$ 116.16 million by 2031 to expand at 3.0% CAGR during 2023-2031.

By end user, the South & Central America SMT equipment market is divided into consumer electronics, telecommunication, aerospace and defense, automotive, industrial, and others. The consumer electronics segment held 45.0% share of South & Central America SMT equipment market in 2023, amassing US$ 117.33 million. It is projected to garner US$ 144.87 million by 2031 to expand at 2.7% CAGR from 2023 to 2031.

Based on country, the South & Central America SMT equipment market is categorized Brazil, Argentina, and the Rest of South & Central America. Our regional analysis states that Brazil captured 63.3% share of South & Central America SMT equipment market in 2023. It was assessed at US$ 165.23 million in 2023 and is likely to hit US$ 204.13 million by 2031, registering a CAGR of 2.7% during 2023-2031.

Key players operating in the South & Central America SMT equipment market are FUJI CORPORATION; Hitachi High-Tech Corp; JUKI CORPORATION; KLA Corp; Mycronic; Nordson Corp; SAKI CORPORATION; Viscom AG; and Yamaha Motor Co., Ltd, among others.

In 2023, FUJI CORPORATION launched The FUJI SMT Site, which focuses primarily on SMT machines and related equipment.

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