At 8.8% CAGR, South & Central America RF Front-End Chip Market is Projected to be worth US$ 21,117.24 million by 2030, says Business Market Insights

According to Business Market Insights' research, the South & Central America RF front-end chip market was valued at US$ 402.46 million in 2022 and is projected to reach US$ 792.28 million by 2030, registering a CAGR of 8.8% from 2022 to 2030. Increasing adoption of wireless network infrastructure and multi-chip front-end modules are among the critical factors attributed to drive the South & Central America RF front-end chip market growth.

A multi-chip module (MCM) is an electronic component made up of numerous integrated circuits (ICs) or dies combined into a single box or module. MCMs save board space by combining many components into a single module or package. They are also lighter and shorten the signal path between ICs, resulting in improved device performance. In recent decades, the development of a highly integrated and high-performance RF module based on silicon technologies has sparked increased interest in modern communication systems. To supply and receive data using various communication modalities, multiple RF channels are typically integrated into a single package, increasing the complexity and size of communication systems. To tackle this difficulty, researchers are focusing on attempts to merge many RF front-end devices into a single small module utilizing 3D packaging technology.

The growing system integration is expected to pack more functionality into a single chip. In consumer electronics, the need for lower costs, lower power consumption (especially in mobile and portable products), and smaller product sizes is growing. The multichip modules provide most of the analog signal processing, detection, filtering, amplification, and demodulation through a mixer. Thus, multi-chip front-end modules are expected to be a future trend in the RF front-end chip market.

On the contrary, the high manufacturing cost of RF front-end chips hampers the growth of the South & Central America RF front-end chip market.

Based on component, the South & Central America RF front-end chip market is segmented into power amplifier, radio frequency filter, low noise amplifier, RF switch, and others. The power amplifier segment held 32.5% market share in 2022, amassing US$ 130.73 million. It is projected to garner US$ 283.10 million by 2030 to register 10.1% CAGR during 2022-2030.

Based on application, the South & Central America RF front-end chip market is segmented into consumer electronics, wireless communication, and others. The consumer electronics segment held 62.9% market share in 2022, amassing US$ 252.95 million. It is projected to garner US$ 490.36 million by 2030 to register 8.6% CAGR during 2022-2030.

Based on country, the South & Central America RF front-end chip market is categorized into Brazil, Argentina, and the Rest of South & Central America. Our regional analysis states that Brazil captured 67.4% share of South & Central America RF front-end chip market in 2022. It was assessed at US$ 271.28 million in 2022 and is likely to hit US$ 562.47 million by 2030, registering a CAGR of 9.5% during 2022-2030.

Key players operating in the South & Central America RF front-end chip market are Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp, and Texas Instruments Inc, among others.

• In November 2022, Skyworks Solutions Inc and Sequans Communications SA introduced the SKY66431, a 5G Massive IoT SiP (system-in-package) solution. This next-generation SiP combines Sequans' Monarch 2 modem with Skyworks' industry-leading RF front-end solution, creating the world's smallest LTE-M/NB-IoT connectivity platform in a single package.

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