Report : South America Semiconductor Bonding Market Forecast to 2028 - COVID-19 Impact and Regional Analysis by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder) and Application (RF Devices, MEMS and Sensors, LED, CMOS Image Sensors, and 3D NAND)
At 2.5% CAGR, the South America Semiconductor Bonding Market is speculated to be worth US$ 18.82 million by 2028, says Business Market Insights
According to the Insight Partners’ research, the South America semiconductor bonding market was valued at US$ 16.23 million in 2022 and is expected to reach US$ 18.82 million by 2028, registering a CAGR of 2.5% from 2022 to 2028. Adoption of die bonding in telecommunication and rising demand for hybrid bonding are the critical factors attributed to the market expansion.
The growing demand for high-performance optical communication devices boosts 5G deployment and datacenter applications. Further, this supports 5G wireless fronthaul and next-generation Ethernet modules, which include 2x200GbE, 4x100GbE, 400GbE, and CWDM/DWDM transceivers. The demand for high-performance optical devices is also generating requirements for smaller packaging housing, rapid technology innovation, smaller chips/dies with higher density in the package, higher-volume manufacturing, quick product iterations, and an economical price point. The new requirements are also needed in lidar, AR/VR, advanced photonic sensors, MEMS, and highly integrated silicon photonics devices. For manufacturing all the above devices, successfully deploying flexible die bonding solutions with high post-bonding accuracy and great long-term stability is required. Various manufacturers are producing flexible high bonding solutions to meet this requirement. For instance, MRSI-HVM by MRSI Systems is a flexible high-speed die bonder which can achieve <±1.5 µm @ 3 sigma. Thus, with this, the company provides the best manufacturing solution for increasing volume and mix in manufacturing 5G and datacenter core devices.
On the contrary, fluctuation in the price of semiconductor components hurdles the growth of South America semiconductor bonding market.
Based on type, the South America semiconductor bonding market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment held 42.7% market share in 2022, amassing US$ 6.93 million. It is projected to garner US$ 7.98 million by 2028 to expand at 2.4% CAGR during 2022–2028.
Based on application, the South America semiconductor bonding market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held 34.2% market share in 2022, amassing US$ 5.56 million. It is projected to garner US$ 6.79 million by 2028 to expand at 3.4% CAGR during 2022–2028.
Based on country, the South America semiconductor bonding market has been categorized into Brazil, Argentina, and the Rest of South America. Our regional analysis states that Brazil captured 69.2% market share in 2022. It was assessed at US$ 11.24 million in 2022 and is likely to hit US$ 13.37 million by 2028, exhibiting a CAGR of 2.9% during the forecast period.
Key players profiles in the South America semiconductor bonding market report are ASMPT; EV Group; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation, among others.
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