
Published On: Sep 2024
Published On: Sep 2024
According to Business Market Insights' research, the South & Central America high speed connector market was valued at US$ 227.68 million in 2023 and is expected to reach US$ 360.75 million by 2031, registering a CAGR of 5.9% from 2023 to 2031. Higher speed networking technologies and miniaturization and growing adoption of IoT and edge computing are among the critical factors attributed to the South & Central America high speed connector market expansion.
High-speed connectors are a crucial component in various industries, enabling efficient and reliable data transmission between devices. Continuous advancements in these connectors help manufacturers keep pace with the ever-increasing demand for faster data transfer speeds and enhanced performance. Connectors are being designed to handle higher data rates, supporting advancements such as 5G. In addition, the miniaturization trend creates a scope for further improvements in high-speed connectors. As electronic devices become smaller and lighter, there is a growing demand for compact connectors. This is achieved using innovative materials such as aluminum alloy that allow for smaller footprints while maintaining performance. The growing number of interconnected devices often necessitates smaller form factors.
High-speed connector manufacturers are constantly innovating to create miniaturized connectors that offer high data rates while maintaining design flexibility for diverse applications. In June 2023, Hirose released a multi-RF board-to-board connector that provides a size reduction of up to 71% compared to conventional designs. With the industry's smallest width of only 2.2 mm, the BM56 Series supports multiple RF and digital signals with a single connector. High-speed connectors enabling faster, more reliable, and versatile data transmission are continuously in demand in applications ranging from consumer electronics to automotive & aerospace industries. Thus, technological advancements to support trends such as high-speed networking technologies and miniaturization are likely to bring new high-speed connector market trends in the coming years.
Based on product, the South & Central America high speed connector market is segmented into board-to-cable, board-to-board, and others. The board-to-board segment held 62.7% share of the South & Central America high speed connector market in 2023, amassing US$ 142.67 million. It is projected to garner US$ 237.35 million by 2031 to expand at 6.6% CAGR during 2023–2031.
In terms of application, the South & Central America high speed connector market is segmented into communication, automotive, aerospace & defense, energy & power, electronics, and others. The aerospace & defense segment held 45.9% share of the South & Central America high speed connector market in 2023, amassing US$ 104.44 million. It is estimated to garner US$ 160.93 million by 2031 to expand at 5.6% CAGR during 2023–2031.
Based on country, the South & Central America high speed connector market is categorized into Brazil, Argentina, and the Rest of South & Central America. Brazil held 45.2% share of South & Central America high speed connector market in 2023, amassing US$ 102.87 million. It is projected to garner US$ 173.99 million by 2031 to expand at 6.8% CAGR during 2023–2031.
Key players operating in the South & Central America high speed connector market are Samtech lnc, Molex LLC, TE Connectivity Ltd, Fujitsu Ltd, OMRON Corp, IMS Connector Systems GmbH, and Amphenol Corp, among others.
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