At 6.2% CAGR, North America SMT Equipment Market is Projected to be Worth US$ 2,699.35 Million by 2031, says Business Market Insights

According to Business Market Insights' research, the North America SMT equipment market was valued at US$ 1,671.57 million in 2023 and is expected to reach US$ 2,699.35 million by 2031, registering a CAGR of 6.2% from 2023 to 2031. Growing consumer electronics industry and evolution of 3D packaging and through silicon via (TSV) technologies are among the critical factors attributed to drive the North America SMT equipment market growth.

Future electronic device development is expected to be strongly influenced by through-silicon-via technology, a type of vertical interconnect access (VIA) connection used in IC packaging to provide vertical electrical connections between silicon wafers or dies. TSV technology establishes electrical contact with surface-mounted devices while mirrored sidewalls enhance package reflectivity and improve light efficiency. Due to the growing need for small and compact electronic devices, semiconductor firms are focusing on developing three-dimensional (3D) SIP technology to create 3D ICs. TSV is the core technology underpinning these 3D integrated circuits. To solve the problems of miniaturization and performance, the industry is looking at novel 3D packaging options. Through Silicon Via (TSV) technology allows vertical stacking of several dies or chips, resulting in high-density 3D integrated circuits (3D ICs). This method not only decreases the total package footprint but also shortens interconnect lengths and increases signal integrity and performance. The evolution of 3D packaging and TSV is expected to be a trend in the North America SMT equipment market.

On the contrary, the high initial investments hamper the growth of North America SMT equipment market.

Based on component, the North America SMT equipment market is bifurcated into passive component and active component. The active component segment held 62.1% market share in 2023, amassing US$ 1,038.42 million. It is projected to garner US$ 1,721.22 million by 2031 to register 6.5% CAGR during 2023-2031.

In terms of equipment type, the North America SMT equipment market is segmented into inspection equipment, placement equipment, soldering equipment, screen printing equipment, cleaning equipment, and others. The placement equipment segment held 32.6% share of North America SMT equipment market in 2023, amassing US$ 544.55 million. It is anticipated to garner US$ 955.17 million by 2031 to expand at 7.3% CAGR during 2023-2031.

By end user, the North America SMT equipment market is divided into consumer electronics, telecommunication, aerospace and defense, automotive, industrial, and others. The consumer electronics segment held 35.1% share of North America SMT equipment market in 2023, amassing US$ 587.32 million. It is projected to garner US$ 1,037.54 million by 2031 to expand at 7.4% CAGR from 2023 to 2031.

Based on country, the North America SMT equipment market is categorized into the US, Canada, and Mexico. Our regional analysis states that the US captured 82.6% share of North America SMT equipment market in 2023. It was assessed at US$ 1,380.44 million in 2023 and is likely to hit US$ 2,322.41 million by 2031, registering a CAGR of 6.7% during 2023-2031.

Key players operating in the North America SMT equipment market are ASMPT Ltd, FUJI CORPORATION, Hitachi High-Tech Corp, JUKI CORPORATION, KLA Corp, Mycronic, Nordson Corp, SAKI CORPORATION, Viscom AG, and Yamaha Motor Co Ltd, among others.

- In 2023, Saki Corporation announced the addition of a new 3D X-ray Automated Inspection System (3D-AXI) to its popular 3Xi-M110 range, bringing further improvements in cycle time and inspection accuracy. The newly developed 3Xi-M110 V3 delivers an impressive 50% cycle-time reduction. Saki's Planar CT technology used in the 3Xi-M110 detects solder joint defects and microstructure abnormalities in high-density PCBs. The automated X-ray inspection system utilizes Real 3D volumetric inspection to clearly identify voids in multi-layer solder, THT assembly BGA head-in-pillow issues, and defective parts based on fillet position and other factors.



Contact Us
Phone: +16467917070
Email Id: sales@businessmarketinsights.com