Report : North America Semiconductor Metrology and Inspection Market Forecast to 2028 – COVID-19 Impact and Regional Analysis – by Type (Wafer Inspection System, Mask Inspection System, and Thin Film Metrology), Technology (Optical and E-Beam), and Organization Size (Large Enterprises and SMEs)
At 6.5% CAGR, the North America Semiconductor Metrology and Inspection Market is speculated to be worth US$ 2,377.16 million by 2028, says Business Market Insights
According to Business Market Insights’ research, the North America semiconductor metrology and inspection market was valued at US$ 1,631.12 million in 2022 and is expected to reach US$ 2,377.16 million by 2028, registering an annual growth rate of 6.5% from 2022 to 2028. Rising use of metrology and inspection for advanced packaging processes and surging number of semiconductor applications are the critical factors attributed to the market expansion
Wafer fabrication, manufacturing, and other procedures use advanced packaging (AP) technology. Controlling these operations in the back end necessitates inspection and measurement methods. Shrinking feature sizes are driving demands for high accuracy, precision, sensitivity, and throughput. On the other hand, AP procedures face measurement and inspection issues that are unique to back-end applications, such as bump metrology and nonvisual flaws. Special requirements, combined with the increased diversity and rapid evolution of AP processes, propel the demand for flexible measurement and inspection systems that can control a wide range of parameters, including two-dimensional (2D) and three-dimensional (3D) geometries, and can be adapted to new requirements as they arise. Combining various competencies into a single platform is the most economical and effective use of capital. Keeping up with the industry's roadmap necessitates novel solutions from equipment providers focusing on the unique requirements of AP operations. For example, in advanced wafer-level packaging (AWLP) applications, such as 3D IC and high-density fan-out, KLA Corporation offers Kronos 1190 patterned wafer inspection system with high-resolution optics. The system gives sensitivity to important flaws for process development and production monitoring. Manufacturers are under pressure to improve quality and dependability. This is especially true in industries such as automotive, where consumer safety is a major concern. Thousands of semiconductor components exist in autos. In addition, the number of components might increase by orders of magnitude in completely driverless vehicles. For a car with 10,000 components, a component failure rate of one in a million amounts to a vehicle failure rate of one in 100, which is unacceptable. To meet this challenge in current and next-generation packages, defect sensitivity down to the micrometer level is required, and the ability to discern lethal faults swiftly and consistently amid massive raw data streams. Gauge repeatability and reproducibility (R&R) investigations are becoming relevant. Engineers need technologies to turn raw data into useful process knowledge. E-beam technology is also being adopted in advanced packaging. Electrons are created within the tool in an e-beam inspection system and then hit the surface of a die. The electrons scatter and bounce back to a detector, allowing it to detect chips with faults. The above-mentioned factors drive the semiconductor metrology and inspection market growth.
On the contrary, high setup cost of metrology and inspection equipment hurdles the growth of North America semiconductor metrology and inspection market.
- Based on type, the North America semiconductor metrology and inspection market is segmented into wafer inspection system, mask inspection system, and thin film metrology. The wafer inspection system segment held 66.5% market share in 2022, amassing US$ 1,085.12 million. It is projected to garner US$ 1,576.86 million by 2028 to expand at 6.4% CAGR during 2022–2028.
- Based on technology, the North America semiconductor metrology and inspection market is bifurcated into optical and E-beam. The optical segment held 72.4% market share in 2022, amassing US$ 1,181.49 million. It is projected to garner US$ 1,670.53 million by 2028 to expand at 5.9% CAGR during 2022–2028.
- Based on organization size, the North America semiconductor metrology and inspection market is bifurcated into large enterprises and SMEs. The large enterprises segment held 74.8% market share in 2022, amassing US$ 1,220.31 million. It is projected to garner US$ 1,790.64 million by 2028 to expand at 6.6% CAGR during 2022–2028.
- Based on country, the North America semiconductor metrology and inspection market has been categorized into the US, Canada, and Mexico. Our regional analysis states that the US captured 70.7% market share in 2022. It was assessed at US$ 1,153.81 million in 2022 and is likely to hit US$ 1,727.05 million by 2028, exhibiting a CAGR of 7.0% during the forecast period.
Key players dominating the North America semiconductor metrology and inspection market are Applied Materials, Inc.; ASML Holding N.V.; Hitachi High-Tech Corporation; JEOL Ltd; KLA Corporation; Lasertec Corporation; Nikon Metrology NV; Nova Ltd.; Onto Innovation; and Thermo Fisher Scientific Inc. among others.
- In 2021, Hitachi High-Tech Corporation has unveiled the GS1000 Electron Beam Area Inspection System's development. This newly designed tool provides precise and rapid e-beam inspection through the use of a common platform based on Hitachi High-proven Tech's high-speed inspection SEMs, Hitachi High-expertise Tech's in market-leading CD-SEM*1 technology, and high-speed and huge measurements.
- In 2021, KLA Corporation announced the official opening of its second U.S. headquarters, a $200 million facility in Ann Arbor, Michigan.
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