At 12.2% CAGR, North America RF Front-End Chip Market is Projected to be Worth US$ 13,067.96 Million by 2030, says Business Market Insights

According to Business Market Insights' research, the North America RF front-end chip market was valued at US$ 5,210.41 million in 2022 and is projected to reach US$ 13,067.96 million by 2030, registering a CAGR of 12.2% from 2022 to 2030. Increasing adoption of wireless network infrastructure and miniaturization of RF frond-end modules are among the critical factors attributed to drive the North America RF front-end chip market growth.

RF front-end modules have been miniaturized to fulfill the demand for smaller, more advanced chips for wireless applications like smartphones. Smaller semiconductor devices and passives are typically utilized to miniaturize modules; however, embedding passives into substrates is occasionally required for further miniaturizing. Moreover, smaller chips enable the development of more compact and lightweight devices, which is crucial for applications such as smartphones, wearables, and the Internet of Things (IoT). Miniaturized chips require less material and can be manufactured more efficiently, leading to lower production costs. It can sometimes lead to improved performance, such as a higher signal-to-noise ratio or lower power consumption. These chips can be more easily integrated with other components on a single circuit board, leading to simpler and more efficient designs. As smartphones, tablets, and other mobile devices are constantly shrinking, miniaturized RF front-end chips are essential. Further, wearable devices such as smartwatches and fitness trackers require very small and low-power RF components. Miniaturized and highly integrated RF front-end chips are essential for tiny IoT devices. Integrating many functionalities onto a single chip decreases size, cost, and power consumption, setting a trend for the RF frond-end chip market.

On the contrary, the high manufacturing cost of RF front-end chips hampers the growth of the North America RF front-end chip market.

Based on component, the North America RF front-end chip market is segmented into power amplifier, radio frequency filter, low noise amplifier, RF switch, and others. The power amplifier segment held 29.5% market share in 2022, amassing US$ 1,535.21 million. It is projected to garner US$ 4,327.11 million by 2030 to register 13.8% CAGR during 2022-2030.

Based on application, the North America RF front-end chip market is segmented into consumer electronics, wireless communication, and others. The consumer electronics segment held 52.0% market share in 2022, amassing US$ 2,709.63 million. It is projected to garner US$ 6,730.44 million by 2030 to register 12.0% CAGR during 2022-2030.

Based on country, the North America RF front-end chip market is categorized into the US, Canada, and Mexico. Our regional analysis states that the US captured 80.3% share of North America RF front-end chip market in 2022. It was assessed at US$ 4,185.00 million in 2022 and is likely to hit US$ 10,828.91 million by 2030, registering a CAGR of 12.6% during 2022-2030.

Key players operating in the North America RF front-end chip market are Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp, and Texas Instruments Inc, among others.

• In June 2023, Broadcom Inc introduced four RF front-end modules for powering routers using Wi-Fi 7, a new wireless networking standard. These modules can also be used to build Wi-Fi access points (APs), devices used by enterprises for wireless connectivity. The first routers and access points with Wi-Fi 7 support are set to become available later this year. The technology facilitates maximum network speeds of 46 gigabits per second and allows more devices to connect to a router at once. However, routers that implement Wi-Fi 7 can require more power than earlier devices and may face higher risks of network interference, reducing the reliability of wireless connections. Broadcom's new modules address these challenges by reducing electricity requirements by up to 40%. The modules also address network interference by including a FBAR filter, an advanced interference filter used for tasks such as increasing the reliability of smartphones' 5G connections. Broadcom claims its modules take up little space on routers' circuit boards and offer low insertion loss, ensuring the strength of the radio signals isn't significantly reduced during processing.
  
  
• In January 2023, Skyworks' SiP supports 5G massive IoT (LTE-M/NB-IoT) platforms, integrating the entire RF front end, transceiver, power management, memory, crystals, and baseband modem for an LTE multiband radio operating from 698 to 2200 MHz.
  
  

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