Report : North America Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Regional Analysis By Platform (IC Package Substrate, Rigid Board, and Flexible Board), Application (Smartphone and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications), and Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Other Industries)

IC Package Substrate Segment to Dominate North America Embedded Die Packaging Technology Market during 2020–2028

  According to a new market research study on “North America Embedded Die Packaging Technology Market to 2028 – COVID-19 Impact and Regional Analysis and Forecast by Platform, Application, and Industry,” is expected to reach US$ 80,904.35 thousand by 2028 from US$ 19,859.76 thousand in 2020. The market is estimated to grow at a CAGR of 19.5 % from 2021 to 2028. The report provides trends prevailing in the North America embedded die packaging technology market along with the drivers and restraints pertaining to the market growth. Rising demand for miniaturization of electronic devices and growing developments in embedded die packaging technology are the major factor driving the growth of the North America embedded die packaging technology market. However, technical problems and presence of alternative solutions hinder the growth of North America embedded die packaging technology market.

In case of COVID-19, North America is highly affected specially the US. Post lockdown, the market witnessed increasing demand for digital devices. North America is among the eminent regions in adopting smart or IoT-based devices due to favorable infrastructure support for high-speed internet services. The adoption of the 5G network is supposed to drive the market growth post lockdown. The COVID-19 outbreak has a major impact on manufacturing facilities as production capacities were lowered. As the demand for electronics remained constant, it helped the market to resume the growth. For instance, in December 2020, Qualcomm Inc, a leading manufacturer of microprocessors has predicted that the shipments of 5G smartphones will double in 2022, with the increasing 5G network deployment. Such increasing adoption of 5G smartphones is lowering the COVID- 19 impact for the post lockdown period; while in lockdown, it certainly hampered the market growth.

The North America embedded die packaging technology market is divided in four segments: platform, application, industry, and country. Based on platform, the market is sub-segmented into IC package substrate, rigid board, and flexible board. The IC package substrate segment dominated the market in 2020 and   is also expected to be fastest growing during forecast period. Based on application, the market is segmented into smartphones and tablets, medical and wearable devices, industrial devices, security devices, and other applications. The smartphones and tablets segment dominated the market in 2020, and medical and wearable devices segment is expected to fastest be growing during forecast period. Based on industry, the market is segmented as automotive, healthcare, consumer electronics, IT and telecommunication, and other industries. The consumer electronics segment dominated the market in 2020 and automotive segment is expected to be fastest growing during forecast period.

Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; Shinko Electric Industries Co., Ltd.; and Taiwan Semiconductor Manufacturing Company, Limited are among the leading companies in the North America embedded die packaging technology market. The companies are focused on adopting organic growth strategies such as product launches and expansions to sustain their position in the dynamic market. For instance, in 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea.

The report segments the North America Embedded Die Packaging Technology Market as follows:

North America Embedded Die Packaging Technology Market – By Platform

  • IC Package Substrate
  • Rigid Board
  • Flexible Board

North America Embedded Die Packaging Technology Market – By Application

  • Smartphone and Tablets
  • Medical and Wearable Devices
  • Industrial Devices
  • Security Devices
  • Other Applications

North America Embedded Die Packaging Technology Market – By Industry

  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Healthcare
  • Other Industries

North America Embedded Die Packaging Technology Market – By Country

  • US
  • Canada   
  • Mexico       
Contact Us
Contact Person: Sameer Joshi 
Phone: +1-646-491-9876
Email Id: sales@businessmarketinsights.com 

Download Free PDF Brochure