At 17.1% CAGR, North America 3D Stacking Market is Projected to be Worth US$ 1,904.41 Million by 2031, says Business Market Insights

According to Business Market Insights' research, the North America 3D stacking market was valued at US$ 538.48 million in 2023 and is expected to reach US$ 1,904.41 million by 2031, registering a CAGR of 17.1% from 2023 to 2031. Fast processors for gaming purposes and surge in demand for high-bandwidth memory are among the critical factors attributed to drive the North America 3D stacking market growth.

The gaming industry is continuously growing across the globe, with a rise in video game players. According to Accenture, in 2021, the gaming industry will be exceeded by US$ 300 million and reach over 400 million in 2023. The industry witnessed an increase of half a billion players in the past three years, accounting for 2.7 billion people worldwide. The launch of new gaming platforms and changing demographics are diverting gaming businesses from being product-centric by encouraging them to launch experience-oriented platforms. According to Accenture, gamers spend an average of 16 hours per week playing, eight hours watching or participating in game streams, and six hours interacting in game forums and communities. These social interactions are one of the primary drivers of online gaming's growth. The growing number of online gamers increases the need for high-speed processors among gamers. In April 2022, Advanced Micro Devices Inc. released a Ryzen 7 5800X3D Gaming Processor to improve and enhance gamers' experience. Ryzen 7 5800X3D gaming processor is designed with 3D stake technology that can deliver an average of 15% more gaming performance at 1080p. Further, processor speed is important, particularly when it comes to gaming and other intense tasks. Faster processors can cut load times, allowing users to get into their games quickly. They also facilitate multitasking by allowing numerous applications and programs to operate concurrently without causing slowdowns or lag. Also, greater processing speeds enable higher graphical settings and frame rates in games, resulting in a smoother experience with no stuttering or noticeable lag. Thus, the growing integration of fast processors for gaming purposes is expected to emerge as a significant trend in the North America 3D stacking market in the coming years.

On the contrary, complexity associated with 3D stacking technology hampers the growth of North America 3D stacking market.

Based on interconnecting technology, the North America 3D stacking market is segmented into through-silicon via, monolithic 3D integration, and 3D hybrid bonding. The through-silicon via segment held 41.2% market share in 2023, amassing US$ 221.73 million. It is projected to garner US$ 873.05 million by 2031 to register 18.7% CAGR during 2023-2031.

In terms of device type, the North America 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held 27.8% share of North America 3D stacking market in 2023, amassing US$ 149.55 million. It is anticipated to garner US$ 562.71 million by 2031 to expand at 18.0% CAGR during 2023-2031.

By end user, the North America 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held 27.2% share of North America 3D stacking market in 2023, amassing US$ 146.62 million. It is anticipated to garner US$ 576.40 million by 2031 to expand at 18.7% CAGR during 2023-2031.

Based on country, the North America 3D stacking market is categorized into the US, Canada, and Mexico. Our regional analysis states that the US captured 94.1% share of North America 3D stacking market in 2023. It was assessed at US$ 506.80 million in 2023 and is likely to hit US$ 1,820.17 million by 2031, registering a CAGR of 17.3% during 2023-2031.

Key players operating in the North America 3D stacking market are Taiwan Semiconductor Manufacturing Co Ltd; Samsung Electronics Co Ltd; Intel Corp; MediaTek Inc.; Texas Instruments Inc; Amkor Technology Inc; ASE Technology Holding Co Ltd; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc, among others.

• December 2023, Intel researchers showcased advancements in 3D stacked complementary metal oxide semiconductor (CMOS) transistors combined with backside power and direct backside contacts at the 2023 IEEE International Electron Devices Meeting (IEDM). The company also reported on scaling paths for recent R&D breakthroughs for backside power delivery, such as backside contacts, and it was the first to demonstrate successful large-scale 3D monolithic integration of silicon transistors with gallium nitride (GaN) transistors on the same 300-millimeter (mm) wafer, rather than on the package.
  
  

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