At 10.9% CAGR, Europe RF Front-End Chip Market is Projected to be worth US$ 10,572.19 million by 2030, says Business Market Insights

According to Business Market Insights' research, the Europe RF front-end chip market was valued at US$ 4,616.07 million in 2022 and is projected to reach US$ 10,572.19 million by 2030, registering a CAGR of 10.9% from 2022 to 2030. Increasing adoption of wireless network infrastructure and proliferation of Internet of Things (IoT) devices are among the critical factors attributed to drive the Europe RF front-end chip market growth.

With the continuous expansion of high-speed internet technologies, the backbone network has seen substantial improvements in both speed and bandwidth. These mature technologies have provided a solid foundation for the growth of the Internet of Things (IoT). Also, there is an increase in IoT devices to make operations more efficient and deliver enhanced customer service. According to Symmetry Electronics, in 2023, there were ~14.76 billion connected IoT devices. IoT devices require different communication options (Bluetooth, Wi-Fi, cellular, etc.). This drives the demand for RF front-end chips that meet specified frequency, protocol, and power requirements. The radio frequency (RF) front-end circuit's commendable attributes of low power consumption and wideband characteristics make it highly suitable for integration into front-end circuits used in Internet of Things (IoT) sensor node communication or for awakening receivers. Advanced chip functionalities are necessary for characteristics such as low latency, large data rates, and long-range communication, leading to market expansion through innovation. Smaller and more integrated RF front-end chips are essential for tiny IoT devices. As the number of IoT devices grows, lowering device power consumption has become a key area of research in the IoT arena. The Internet of Things (IoT) is simple wireless communication between sensors and the internet. The integration of RF/microwave functionality in highly integrated front-end modules paves the way for smaller, lower-power, cost-effective IoT solutions for a wide range of applications. The radio frequency (RF) front-end circuit's commendable attributes of low power consumption and wideband characteristics make it highly suitable for integration into front-end circuits used in Internet of Things (IoT) sensor node communication or for awakening receivers. Thus, the growing adoption of IoT devices is anticipated to create growth opportunities for the RF front-end chip market.

On the contrary, the high manufacturing cost of RF front-end chips hampers the growth of the Europe RF front-end chip market.

Based on component, the Europe RF front-end chip market is segmented into power amplifier, radio frequency filter, low noise amplifier, RF switch, and others. The power amplifier segment held 35.7% market share in 2022, amassing US$ 1,645.70 million. It is projected to garner US$ 4,111.15 million by 2030 to register 12.1% CAGR during 2022-2030.

Based on application, the Europe RF front-end chip market is segmented into consumer electronics, wireless communication, and others. The consumer electronics segment held 51.9% market share in 2022, amassing US$ 2,396.01 million. It is projected to garner US$ 5,474.27 million by 2030 to register 10.9% CAGR during 2022-2030.

Based on country, the Europe RF front-end chip market is categorized into Germany, the UK, France, Italy, Russia, and the Rest of Europe. Our regional analysis states that Germany captured 28.1% share of Europe RF front-end chip market in 2022. It was assessed at US$ 1,294.81 million in 2022 and is likely to hit US$ 3,449.26 million by 2030, registering a CAGR of 13.0% during 2022-2030.

Key players operating in the Europe RF front-end chip market are Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp, and Texas Instruments Inc, among others.

• In March 2023, Microchip Technology Inc announced its MPLAB SiC Power Simulator that quickly evaluates Microchip's SiC power devices and modules across various topologies before committing a design to hardware. It aims to help power design engineers transition to SiC power solutions with ease, speed and confidence, Microchip Technology.
  
  
• In January 2023, Skyworks' SiP supports 5G massive IoT (LTE-M/NB-IoT) platforms, integrating the entire RF front end, transceiver, power management, memory, crystals, and baseband modem for an LTE multiband radio operating from 698 to 2200 MHz.

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