At 10.4% CAGR, the Europe Redistribution Layer Material Market is Projected to be Worth US$ 34.45 Million by 2030, Says Business Market Insights

According to Business Market Insights' research, the Europe redistribution layer material market was valued at US$ 15.62 million in 2022 and is expected to reach US$ 34.45 million by 2030, registering a CAGR of 10.4% from 2022 to 2030. Proliferation of IoT and connected devices across industry verticals and advancements in the packaging technology are among the critical factors attributed to the Europe redistribution layer material market expansion.

The Internet of Things (IoT) market across the globe has gained considerable popularity recently, with businesses acknowledging the significance of connectivity. IoT has enabled each device to be connected to the Internet. According to the International Data Corporation (IDC), 41.6 billion IoT devices will be in 2025, capable of generating 79.4 zettabytes (ZB) of data. This exponential increase in data traffic over the internet is due to the increasing penetration of smartphones and other consumer electronics that can be connected to the internet due to the rising popularity of IoT.

IoT encompasses a wide range of applications, from smart homes and wearable devices to industrial automation and smart cities. These applications rely on small, power-efficient, highly integrated semiconductor components, often requiring complex packaging solutions. Redistribution layers play a crucial role in these packaging technologies, enabling the miniaturization of devices, efficient interconnection, and the integration of various functions into a single chip package. IoT devices are being deployed across industry verticals across the globe, such as manufacturing, healthcare, agriculture, and logistics, to enhance efficiency, monitor processes, and gather data for informed decision-making. These devices demand advanced semiconductor packaging to withstand challenging environments and provide reliable performance.

Businesses across almost all industry verticals have realized the importance of communications, IoT, and sensors and have paved the way for integrating sensors into the devices. Numerous business functions such as supply chain planning and logistics and manufacturing across industry verticals such as automotive, healthcare, consumer electronic devices, and aerospace & defense can be optimized, thus enabling increased profitability. The positive impact on the companies' balance sheets due to the integration of sensor-enabled devices into the business processes has led to enormous demands for more such devices. Huge demands are further anticipated to be burdened on the semiconductor industry. The growth of the redistribution layer material in various IC manufacturing is therefore anticipated to rise rapidly during the forecast period, with IoT gaining more prominence over the coming years. Thus, the proliferation of IoT and connected devices across industry verticals across the globe is expected to provide an opportunity for the Europe redistribution layer material market.

On the contrary, fluctuation in raw material prices hampers the growth of Europe redistribution layer material market.

Based on type, the Europe redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held 48.8% share of the Europe redistribution layer material market in 2022, amassing US$ 7.62 million. It is projected to garner US$ 16.25 million by 2030 to expand at 9.9% CAGR during 2022-2030.

By application, the Europe redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held 76.1% share of the Europe redistribution layer material market in 2022, amassing US$ 11.88 million. It is projected to garner US$ 26.91 million by 2030 to expand at 10.8% CAGR during 2022-2030. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.

Based on country, the Europe redistribution layer material market is segmented into Germany, Austria, Italy, and the Rest of Europe. Germany held 68.4% share of Europe redistribution layer material market in 2022, amassing US$ 10.68 million. It is projected to garner US$ 25.32 million by 2030 to expand at 11.4% CAGR during 2022-2030.

Key players operating in the Europe redistribution layer material market are SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd, among others.




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