At 6.4% CAGR, the Asia Pacific Soldering in Electronics Assembly Market is projected to be worth US$ 1,101.38 million by 2028, says The Business Market Insights      

According to the Business Market Insights’ research, the Asia Pacific soldering in electronics assembly market was valued at US$ 805.89 million in 2023 and is expected to reach US$ 1,101.38 million by 2028, registering a CAGR of 6.4% from 2023 to 2028. Growth of electronic industry and new product developments are the critical factors attributed to the Asia Pacific soldering in electronics assembly market expansion.             

The miniaturization of electronic components plays an important role in the electronic industry. It helps save space so that additional parts or technology can be integrated, or the overall size of consumer electronics, medical devices, automobiles, and more can be reduced. For instance, the reduced size of batteries helps with computer miniaturization. Moreover, miniaturization helps save the cost of the overall material used. For the miniature components, less material is used for the soldering, which helps to save the cost on the material used compared to normal-size component or devices. Such benefits of miniaturization are fueling the demand for this technique in the electronics market. Moreover, the demand for solder pastes with smaller metal particle sizes for miniaturization propels the soldering in electronics assembly market growth. INVENTEC provides Ecorel Free JP32 and Ecorel Free HT 235-16LVD solder paste, which can be used in miniaturization for ultra-fine pitch electronics manufacturing applications. The company is developing more solder paste products due to the growing demand for miniaturization. Thus, an increase in miniaturization in the electronic industry is expected to provide growth opportunities for the Asia Pacific soldering in electronics assembly market.

On the contrary, increased cost of raw materials hurdles the growth of Asia Pacific soldering in electronics assembly market.  

Based on the product, the Asia Pacific soldering in electronics assembly market is segmented into wire, paste, bar, flux, and others. The wire segment held 36.5% share of Asia Pacific soldering in electronics assembly market in 2023, amassing US$ 293.86 million. It is projected to garner US$ 425.95 million by 2028 to expand at 7.7% CAGR during 2023–2028.       

Based on country, the Asia Pacific soldering in electronics assembly market has been categorized into China, India, Japan, South Korea, Taiwan, and the Rest of Asia Pacific. Our regional analysis states that China captured 32.0% share of Asia Pacific soldering in electronics assembly market in 2023. It was assessed at US$ 258.20 million in 2023 and is likely to hit US$ 351.89 million by 2028, exhibiting a CAGR of 6.4% during the forecast period.                  

Key players dominating the Asia Pacific soldering in electronics assembly market are AIM Metals & Alloys LP, Fusion Inc, Indium Corp, KOKI Co Ltd, Lucas-Milhaupt Inc, MacDermid Alpha Electronics Solutions, and Superior Flux & Manufacturing Co among others.         

• In 2021, Soldering equipment manufacturer Weller launched a new soldering station, the WXMT Micro-Soldering Station, which is designed for precision soldering on small components like mobile phone connectors and flex cables.         
• In 2020, Soldering equipment manufacturer Metcal launched a new soldering and rework system, the CV-5200 Connection Validation Soldering System, which uses advanced software and sensors to ensure consistent and reliable solder joints.  

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