Report : Asia Pacific Redistribution Layer Material Market Forecast to 2030 - Regional Analysis - By Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and Application {Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging [High Bandwidth Memory (HBM), Multi-Chip Integration, Package on Package (FOPOP), and Others]}
At 11.8% CAGR, the Asia Pacific Redistribution Layer Material Market is Speculated to be Worth US$ 351.93 Million by 2030, Says Business Market Insights
According to Business Market Insights' research, the Asia Pacific redistribution layer material market was valued at US$ 143.81 million in 2022 and is expected to reach US$ 351.93 million by 2030, registering a CAGR of 11.8% from 2022 to 2030. Advancements in the packaging technology and increasing demand from automotive and telecommunication industries are among the critical factors attributed to the Asia Pacific redistribution layer material market expansion.
In the quest for cost reduction, the semiconductor industry has always been involved in developing innovative solutions. One approach currently considered by the leading semiconductor players is the migration from wafer and strip size to large-size panels dedicated to IC assembly. Efficiency and economies of scale are the added value of this path. Moving fan-out package manufacturing from a wafer, Fan-Out Wafer Level Packaging (FOWLP) to a large-scale panel, Fan-Out Panel Level Packaging (FOPLP), could be the solution for a wider adoption. As consumer electronics, automotive systems, and industrial devices become more compact and complex, there is a growing need for advanced semiconductor packaging technologies. Redistribution layers are integral to this process, it enables the creasing of smaller form factors, increases functionality and improves performance. Manufacturers in across the globe are positioned to capitalize on this trend by producing and supplying the necessary materials.
Advancements in the packaging industries, specifically the adoption of 2.5D and 3D packaging technologies, are poised to be significant drivers of the Asia Pacific redistribution layer material market. 2.5D and 3D packaging technologies significantly increase chip density and functionality. By stacking multiple semiconductors die on each other or side by side, these technologies allow for more robust and compact electronic devices. Redistribution layers are essential for creating interconnections between these stacked or adjacent dies, ensuring efficient data transfer and electrical connectivity.
These packaging technologies offer notable advantages in terms of improved performance and energy efficiency. With 2.5D and 3D packaging, shorter interconnect lengths and reduced signal paths contribute to faster data processing and lower power consumption. As a result, demand for redistribution layer materials capable of maintaining signal integrity and thermal management becomes even more crucial. Furthermore, the automotive industry is embracing 2.5D and 3D packaging to enable the integration of advanced driver-assistance systems (ADAS) and autonomous driving technologies. These applications rely on tightly integrated, high-performance semiconductor packages that demand reliable redistribution layer materials. Manufacturers across the globe are developing new packaging technologies. For instance, in May 2021, Samsung Electronics launched I-Cube4, for High-Performance Computing (HPC) to AI, 5G, cloud, and large data center, fast communication, and improving power efficiency between logic & memory through heterogeneous integration. In addition, in September 2023, Faraday Technology Corporation, an ASIC design service, and IP provider, announced the launch of its 2.5D/3D advanced package service. The 2.5D package technology is used for achieving the highest performance, targeting HPC such as AI accelerator, graph processing unit, and networking processor. Such advancements in packaging technology are expected to bolster the Asia Pacific redistribution layer material market growth.
On the contrary, fluctuation in raw material prices hampers the growth of Asia Pacific redistribution layer material market.
Based on type, the Asia Pacific redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held 45.2% share of the Asia Pacific redistribution layer material market in 2022, amassing US$ 65.00 million. It is projected to garner US$ 153.01 million by 2030 to expand at 11.3% CAGR during 2022-2030.
By application, the Asia Pacific redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held 69.8% share of the Asia Pacific redistribution layer material market in 2022, amassing US$ 100.33 million. It is projected to garner US$ 252.21 million by 2030 to expand at 12.2% CAGR during 2022-2030. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.
Based on country, the Asia Pacific redistribution layer material market is segmented into China, Taiwan, Japan, South Korea, and the Rest of Asia Pacific. Taiwan held 36.6% share of Asia Pacific redistribution layer material market in 2022, amassing US$ 52.67 million. It is projected to garner US$ 133.10 million by 2030 to expand at 12.3% CAGR during 2022-2030.
Key players operating in the Asia Pacific redistribution layer material market are SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd, among others.
Contact Us
Contact Person: Sameer Joshi
Phone: +1-646-491-9876
Email Id: sales@businessmarketinsights.com