At 12.8% CAGR, the Asia Pacific Electronic Contract Assembly Market is projected to be worth US$ 1,10,409.02 million by 2028, says The Business Market Insights 

According to the Business Market Insights’ research, the Asia Pacific electronic contract assembly market was valued at US$ 60,378.60 million in 2023 and is expected to reach US$ 1,10,409.02 million by 2028, registering a CAGR of 12.8% from 2023 to 2028. Growth of semiconductor industry and integration of advanced technologies in electronic manufacturing are the critical factors attributed to the Asia Pacific electronic contract assembly market expansion.

The growing advancement of telecommunication networks is bringing higher speeds, better reliability, and lower latency. Various key players are enhancing the 5G infrastructure in developing countries. For instance, in August 2021, Indosat Ooredoo, an Indonesian communications service provider, signed a partnership agreement with Ericsson to launch commercial 5G services in the nation's capital, Jakarta. Similarly, in February 2022, Siemens launched its first industry-ready 5G routers in India. Such commercial 5G networks serve various applications such as intralogistics, autonomous machines, industrial edge, remote diagnostics, augmented reality, assisted work, wireless backhaul, edge computing, and mobile equipment. This 5G telecommunication network is the key enabler of applications such as intelligent automation, smart manufacturing, and connected mobility. Moreover, the growing 5G infrastructure is propelling the demand for new smartphones. The smartphone manufacturing industry is one of the industries witnessing a growing number of outsourcing electronic manufacturing contracts. Thus, rising number of smartphones, smart manufacturing, and intelligent automation owing to increasing penetration of the 5G network is expected to offer lucrative opportunities for the electronic contract assembly market.  

On the contrary, growing concerns about information leaks and intellectual property theft, and instability hurdles the growth of Asia Pacific electronic contract assembly market. 

Based on service, the Asia Pacific electronic contract assembly market is segmented into electronic design & engineering, electronic assembly, and electronic manufacturing. The electronic manufacturing segment held 40.4% share of Asia Pacific electronic contract assembly market in 2023, amassing US$ 24398.68 million. It is projected to garner US$ 44,444.28 million by 2028 to expand at 12.7% CAGR during 2023–2028.

Based on end user, the Asia Pacific electronic contract assembly market is segmented into aerospace, industrial/automation, semiconductor/robotics, IT and telecom, and others. The others segment held 28.4% share of Asia Pacific electronic contract assembly market in 2023, amassing US$ 17165.73 million. It is projected to garner US$ 30,441.43million by 2028 to expand at 12.1 % CAGR during 2023–2028.  

Based on country, the Asia Pacific electronic contract assembly market has been categorized into Australia, China, India, Japan, South Korea, and the Rest of Asia Pacific. Our regional analysis states that China captured 24.8% share of Asia Pacific electronic contract assembly market in 2023. It was assessed at US$ 14957.12 million in 2023 and is likely to hit US$ 27,602.26 million by 2028, exhibiting a CAGR of 13.0% during the forecast period.      

Key players dominating the Asia Pacific electronic contract assembly market are Benchmark Electronics Inc; Celestica Inc; Compal Electronics Inc; Creation Technologies LP; Fabrinet Co Ltd; Flex Ltd; and Jabil Inc among others.   

• In May 2023, Fabrinet advanced precision optical and electronic manufacturing services, the company announced that it would partner with Quanergy Systems Inc to produce Quanergy’s LiDAR sensors.

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