At 6.9% CAGR, Europe Automotive Board to Board Connector Market is Projected to be WWorth US$ 1,203.72 Million by 2031 says Business Market Insights

According to Business Market Insights’ research, the Europe automotive board to board connector market was valued at US$ 705.78 million in 2023 and is expected to reach US$ 1,203.72 million by 2031, registering a CAGR of 6.9% from 2023 to 2031. Growing adoption of IoT and edge computing in automotive industry and rising strategy initiatives globally are among the critical factors attributed to drive the Europe automotive board to board connector market.

Automotive IoT is a critical component of connected automobile technology, allowing cars to communicate with other vehicles, pedestrians, and road infrastructure, among others, resulting in improved road safety and traffic efficiency. This necessitates high-speed data transmission to handle the growing volume of information efficiently. Automotive Board to Board Connectors play a crucial role in facilitating this rapid data flow.

The need for automotive Board to Board Connectors to facilitate interconnection between devices, sensors, and edge computing modules is expected to propel by the growing usage of IoT devices and edge computing solutions. This provides low power consumption and secure connections for IoT and edge computing applications. Automotive Board to Board Connectors allow processing units, actuators, and sensors to be connected, facilitating effective data transfer and decision-making at the network's edge. Thus, the IoT, along with other disruptive technologies, is expected to transform the automotive industry and create lucrative opportunities during the forecast period.

On the contrary, complex design of connectors hampers the growth of Europe automotive board to board connector market.

Based on type, the Europe automotive board to board connector market is segmented into pin headers, socket, floating connector, and card edge connector. The pin headers segment held 41.9% market share in 2023, amassing US$ 296.04 million. It is projected to garner US$ 537.44 million by 2031 to register 7.7% CAGR during 2023–2031. Further pin header is sub segmented into stacked headers, and shrouded headers.  

By application, the Europe automotive board to board connector market is segmented into powertrain control systems, infotainment and navigation systems, advanced driver assistance systems, electric vehicles and hybrid vehicle systems, lighting control systems, and autonomous vehicles. The powertrain control systems segment held 31.5% share of Europe automotive board to board connector market in 2023, amassing US$ 222.28 million. It is projected to garner US$ 358.86 million by 2031 to expand at 6.2% CAGR from 2023 to 2031.

In terms of pitch, the Europe automotive board to board connector market is categorized into less than 1 mm, 1-2 mm, and more than 2 mm. The 1-2 mm segment held 48.4% share of Europe automotive board to board connector market in 2023, amassing US$ 341.26 million. It is projected to garner US$ 560.50 million by 2031 to expand at 6.4% CAGR from 2023 to 2031.

In terms of number of pins, the Europe automotive board to board connector market is categorized into 2-12 Pins, 12-30 Pins, 30-50 Pins, 50-100 Pins, and 100+ Pins. The 2-12 pins segment held 37.2% share of Europe automotive board to board connector market in 2023, amassing US$ 262.55 million. It is projected to garner US$ 401.42 million by 2031 to expand at 5.5% CAGR from 2023 to 2031

Based on country, the Europe automotive board to board connector market is categorized into Germany, France, Italy, Russia, the UK, and the Rest of Europe. Our regional analysis states that Germany captured 33.1% share of Europe automotive board to board connector market in 2023. It was assessed at US$ 233.40 million in 2023 and is likely to hit US$ 431.77 million by 2031, registering a CAGR of 8.0% during 2023 to 2031.

Key players operating in the automotive board to board connector market are include Amphenol Corp; GREENCONN Co., Ltd; Yamaichi Electronics Co., Ltd; Molex LLC; Japan Aviation Electronics Industry, Ltd; Hirose Electric Co Ltd; Samtec Inc; KYOCERA Corporation; ENNOVI Holdings Pte. Ltd; and SCONN Corporation, among others.

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