The Europe semiconductor metrology and inspection market is expected to grow from US$ 1,187.08 million in 2022 to US$ 1,653.57 million by 2028; it is estimated to grow at a CAGR of 4.8% from 2022 to 2028.
Wafer fabrication, manufacturing, and other procedures use advanced packaging (AP) technology. Controlling these operations in the back end necessitates inspection and measurement methods. Shrinking feature sizes are driving the demand for high accuracy, precision, sensitivity, and throughput. On the other hand, AP procedures face measurement and inspection issues, such as bump metrology and nonvisual flaws, that are unique to back-end applications. Special requirements, combined with the increased diversity and rapid evolution of AP processes, propel the demand for flexible measurement and inspection systems that can control a wide range of parameters, including two-dimensional (2D) and three-dimensional (3D) geometries, and can be adapted to new requirements as they arise. Combining various competencies into a single platform is the most economical and effective use of capital. Keeping up with the industry's roadmap necessitates novel solutions from equipment providers focusing on the unique requirements of AP operations. For example, KLA Corporation offers Kronos 1190 patterned wafer inspection system with high-resolution optics in advanced wafer-level packaging (AWLP) applications such as 3D IC and high-density fan-out. The system gives sensitivity to important flaws for process development and production monitoring. Manufacturers are under pressure to improve quality and dependability. This is especially true in industries such as automotive, where consumer safety is a major concern. Thousands of semiconductor components exist in autos. In addition, the number of components might increase by orders of magnitude in completely driverless vehicles. For a car with 10,000 components, a component failure rate of one in a million amounts to a vehicle failure rate of one in 100, which is unacceptable. To meet this challenge in current and next-generation packages, defect sensitivity down to the micrometer level and the ability to discern lethal faults swiftly and consistently amid massive raw data streams are required. Gauge repeatability and reproducibility (R&R) investigations are becoming relevant. Engineers need technologies to turn raw data into useful process knowledge. E-beam technology is also being adopted in advanced packaging. Electrons are created within the tool in an e-beam inspection system and then hit the surface of a die. The electrons scatter and bounce back to a detector, allowing it to detect chips with faults.
With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the Europe semiconductor metrology and inspection market. The Europe semiconductor metrology and inspection market is expected to grow at a good CAGR during the forecast period.
Europe Semiconductor Metrology and Inspection Market Revenue and Forecast to 2028 (US$ Million)
Europe Semiconductor Metrology and Inspection Market Segmentation
The Europe semiconductor metrology and inspection market is segmented based on type, technology, organization size, and country. Based on type, the Europe semiconductor metrology and inspection market is segmented into wafer inspection system, mask inspection system, and thin film metrology. The wafer inspection system segment dominated the market in 2022. Based on technology, the Europe semiconductor metrology and inspection market is bifurcated into optical and e-beam. The optical segment dominated the market in 2022. Based on organization size, the Europe semiconductor metrology and inspection market is bifurcated into large enterprises and SMEs. The large enterprises segment dominated the market in 2022. Based on country, the Europe semiconductor metrology and inspection market has been segmented into the UK, Germany, France, Italy, Russia, and the Rest of Europe. Germany dominated the market in 2022.
Applied Materials, Inc.; ASML Holding N.V.; Hitachi High-Tech Corporation; JEOL Ltd; KLA Corporation; Lasertec Corporation; Nikon Metrology NV; Nova Ltd.; Onto Innovation; and Thermo Fisher Scientific Inc. are among the leading companies in the Europe semiconductor metrology and inspection market.