DRAM Module and Component Market by Type (LPDRAM, DDR5, DDR4, DDR3, GDDR, HBM), Memory (above 8GB, 6-8GB, 3-4GB, 2GB), End User (Server, Mobile Devices, Computers, Consumer Electronics, Automobiles): Global Market Size Estimates and Forecast (2019-2030)

Code: BMIRE00026968 | Pages: 100 | Industry: Electronics and Semiconductor | Date: Oct 2022 | Type: Global

The market is expected to cross US$ 95.52 billion in 2022 and is projected to hit US$ 110.14 billion by 2030, recording a CAGR of 1.64 during the forecast period.

The advent of 5G technology will drive market growth over the forecast period.

The advent of the 5G cellular network has opened more lanes on the information superhighway, enabling vast amounts of data to move faster and more freely, declining traffic jams. Additionally, enabled by innovations in memory and storage, 5G, coupled with next-generation technologies such as artificial intelligence, shows enormous ability to transform mobile devices into visionary, intuitive, and smart companions. The 5G/AI revolution stands to modify the way people communicate, work, consume, recreate, and experience.

Furthermore, the 5G technology will integrate mobile devices with new capabilities, expanding the requirement for storage capacities from 512GB to 1TB; data transmission speeds of up to 20Gbps; and bandwidths allowing connections to multiple devices simultaneously, including sensors and other “smart” devices such as autonomous vehicles. Moreover, the fast-processing speed, low latency, high bandwidth, and vast storage capabilities 5G wireless technology offers are expected to bring the intelligence of mobile devices to rival the human brain.

Within the report, the market is segmented into type, memory, end user, and geography. By type, the market is segmented into LPDRAM, DDR5, DDR4, DDR3, GDDR, HBM. Based on memory, the market is segmented into above 8GB, 6-8GB, 3-4GB, 2GB. Based on end user, the market is segmented into Server, Mobile Devices, Computers, Consumer Electronics, Automobiles. Geographically, the market is sub-segmented into North America, Europe, Asia Pacific, and rest of the world.

The emergence of the 5G network propels the market growth over the forecast period.

The advent of the 5G cellular network has added more lanes to the information superhighway, allowing large volumes of data to travel quicker and more freely, declining traffic congestion. Additionally, when combined with next-generation technologies like artificial intelligence, the 5G, enabled by advances in memory and storage, has the potential to convert mobile gadgets into foresightful, intuitive, and smart companions. Furthermore, the 5G revolution will modify how people communicate, work, consume, recreate, and experience the world.

The growing adoption of IoT devices will create lucrative growth opportunities over the forecast period.

Internet of Things allows physical and virtual objects to connect through cloud technology and exchange data and information. Additionally, IoT is not only a network of internet-connected things but a network of machines and humans. IoT refers to the ever-rising network of physical objects and the communication that occurs between these objects and other internet-enabled devices and systems.

Furthermore, the IoT ecosystem is increasing fast due to various smart products for domestic and industrial usage. The IoT applies to smart homes, smart grids, industrial internet, connected cars, and others. Moreover, as the IoT modules used in various applications become compact, the demand for more memory in IoT devices rises. The DRAMs are small, making them the best option for low-energy, high-density applications for the smaller design of IoT solutions. Thus, the high demand for DRAMs from various IoT applications.

Recent Strategic Developments in DRAM Module and Component Market  

The DRAM Module and Component market has undergone several significant developments, and a few of these have been mentioned below:

  • In March 2022, Kingston FURY launched a Kingston FURY Impact DDR5 SODIMMs, 50% faster than DDR4, to boost gaming, rendering, and multitasking, while its low power consumption and increased efficiency keep systems cool at 1.1V.
  • In February 2022, SMART Modular Technologies, Inc. introduced its new DDR5 32GB Very Low-Profile Registered Dual In-Line Memory Module (VLP RDIMM).
  • In December 2022, ADATA Technology Co., Ltd. introduced ADATA DDR5-4800 and XPG LANCER DDR5, the next-generation, high-performance memory modules capable of reaching frequencies up to 5200MT/s for the upcoming 12th Gen Intel platform.

The DRAM Module and Component market is driven by several players by implementing strategic activities such as investments, new launches, mergers & acquisitions, and partnerships. Samsung Electronics Co., Ltd., SK Hynix Inc., Micron Technology, Inc., Nanya Technology Corporation, Winbond Electronics Corporation, Powerchip Technology Corporation, ADATA Technology Co. Ltd., Ramaxel Technology Co, Ltd, Kingston Technology Corporation, SMART Modular Technologies, are among the prominent players operating in the market.

Target audience for the report:

  • DRAM Module and Component manufacturers
  • Raw material providers
  • DRAM Module and Component providers
  • DRAM Module and Component -related service providers
  • DRAM Module and Component -related associations, organizations, forums, and alliances
  • Government bodies, such as regulating authorities and policy makers
  • Venture capitalists, private equity firms, and start-up companies
  • Electronics component suppliers
  • DRAM Module and Component and devices distributors and sales firms
  • Research institutes, organizations, and consulting companies

Scope of the report:

In this report, the market has been segmented on the basis of:

  • Type
    • LPDRAM
    • DDR5
    • DDR4
    • DDR3
    • GDDR
    • HBM
  • Memory
    • above 8GB
    • 6-8GB
    • 3-4GB
    • 2GB
  • End User
    • Server, Mobile Devices
    • Computers
    • Consumer Electronics
    • Automobiles
  • Region
    • North America
    • Europe
    • Asia Pacific (APAC)
    • Rest of World
  • Companies profiles
    • Samsung Electronics Co., Ltd.
    • SK Hynix Inc.
    • Micron Technology, Inc.
    • Nanya Technology Corporation
    • Winbond Electronics Corporation

The List of Companies

- Samsung Electronics Co., Ltd.
- SK Hynix Inc.
- Micron Technology, Inc.
- Nanya Technology Corporation
- Winbond Electronics Corporation

Report Code
Full Name
Country Name
Email Id
Phone Number
Job Title
Company
Requirement

Note : Your data will never be shared with third parties, however, we may send you information from time to time about our products that may be of interest to you. By submitting your details, you agree to be contacted by us. You may contact us at any time to opt-out.


Purchase Options
Single User License
$2000
Site License
$3000
Enterprise License
$4000