Asia Pacific Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Regional Analysis By Platform (IC Package Substrate, Rigid Board, and Flexible Board), Application (Smartphone and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications), and Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Other Industries)
Market Introduction
Taiwan and China are the leading semiconductor manufacturing countries in APAC. Rising disposable income in developing countries, such as India and China are leading to a large client base for high-tech consumer electronics such as smart wearables, smartphones, and electric vehicles. This factor is expected to drive the embedded die packaging technology market growth. China is a leading manufacturing hub for the IC packaging technology-based products, while Taiwan, South Korea, and Japan are also significant contributors to the regional market growth. Many of the APAC countries are characterized by the mass production of electronic devices required for consumer electronics, automotive components, telecommunication devices, and other industrial machineries. Rising number of electronics manufacturing companies in India and China owing to strong availability of skilled human resources is driving the embedded die packaging technology market growth. According to the Cisco annual internet report, Asia Pacific would mark ~3.1 billion Internet users by 2023. Further, according to the Ericsson Mobility Report, their mobile connections in Asia Pacific are expected rise from ~4 billion to 4.6 billion by 2021. Increase in smartphones and advanced internet connecting devices is anticipated to support the adoption of the embedded die packaging technology in components such as ICs, RF modules, and processors.
In case of COVID-19, APAC is highly affected specially India. Countries such as China, India, South Korea, and Japan are moving toward new networking solutions such as 5G, 4G, and VoLTE. China and India are the most prominent manufacturing hub in the region and have an enhanced focus on industrialization. The growth of the manufacturing industry has been hampered due to lockdown but soon recovered the development by enhancing the production capabilities in the second half of the year. The demand for advanced electronics such as a smartwatch, smart wearables, and healthcare machines has risen significantly. Also, companies in the Asian region have restructured their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, in 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea
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Market Overview and Dynamics
The APAC embedded die packaging technology market is expected to grow from US$ 32,019.28 thousand in 2020 to US$ 1,21,957.05 thousand by 2028; it is estimated to grow at a CAGR of 18.5 % from 2021 to 2028. Burgeoning demand for miniaturization of electronic devices is expected to surge the APAC embedded die packaging technology market. The growing trend of the small form factor-based handheld electronic devices is one of the significant factors accelerating the APAC market growth. Technological advancements, such as miniaturization, in electronics forming have influenced various markets including military, aerospace, medical, retail, and consumer electronics. Devices with small form factor-based packages embed more functionality and are considered the best alternative for traditional packaging systems. Personalized healthcare gadgets, thin-sized smartphones, and compact PCs are equipped with embedded die packaging technology-based components, such as ICs, processors, sensors, and RF modules. Continuous development in advanced packaging technologies, including flexible boards and IC package substrate, further supplement the APAC market growth by resolving the technical challenges. Innovations in solutions such as multi-die integration and flexible ICs enhance device performance by offering small form factors. New packaging technologies are aiding the integration of multiple components in a single die. Moreover, market players across APAC region are making efforts to optimize the embedded die packaging technology for better solution formation. The embedded die packaging technology is used to form chiplets with high bandwidth and low power consumption. So the miniaturization of electronics devices is expected to increase the demand of embedded die packaging technology, which will drive the APAC embedded die packaging technology market.
Key Market Segments
In terms of platform, the IC package substrate segment accounted for the largest share of the APAC embedded die packaging technology market in 2020. In terms of application, the smartphone and tablets segment held a larger market share of the APAC embedded die packaging technology market in 2020. Further, the consumer electronics segment held a larger share of the APAC embedded die packaging technology market based on industry in 2020.
Major Sources and Companies Listed
A few major primary and secondary sources referred to for preparing this report on the APAC embedded die packaging technology market are company websites, annual reports, financial reports, national government documents, and statistical database, among others. Major companies listed in the report are Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; Shinko Electric Industries Co., Ltd.; and Taiwan Semiconductor Manufacturing Company, Limited
Reasons to buy report
- To understand the APAC embedded die packaging technology market landscape and identify market segments that are most likely to guarantee a strong return
- Stay ahead of the race by comprehending the ever-changing competitive landscape for APAC embedded die packaging technology market
- Efficiently plan M&A and partnership deals in APAC embedded die packaging technology market by identifying market segments with the most promising probable sales
- Helps to take knowledgeable business decisions from perceptive and comprehensive analysis of market performance of various segment form APAC embedded die packaging technology market
- Obtain market revenue forecast for market by various segments from 2021-2028 in APAC region.
APAC Embedded Die Packaging Technology Market Segmentation
APAC Embedded Die Packaging Technology Market - By Platform
- IC Package Substrate
- Rigid Board
- Flexible Board
APAC Embedded Die Packaging Technology Market - By Application
- Smartphone and Tablets
- Medical and Wearable Devices
- Industrial Devices
- Security Devices
- Other Applications
APAC Embedded Die Packaging Technology Market - By Industry
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Other Industries
APAC Embedded Die Packaging Technology Market - By Country
- Australia
- China
- India
- Japan
- South Korea
- Rest of APAC
APAC Embedded Die Packaging Technology Market - Company Profiles
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- Infineon Technologies AG
- Microsemi
- Schweizer Electronic AG
- Shinko Electric Industries Co., Ltd.
- Taiwan Semiconductor Manufacturing Company, Limited
1. Introduction
1.1 Study Scope
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
1.3.1 APAC Embedded Die Packaging Technology Market – By Platform
1.3.2 APAC Embedded Die Packaging Technology Market – By Application
1.3.3 APAC Embedded Die Packaging Technology Market – By Industry
1.3.4 APAC Embedded Die Packaging Technology Market- By Country
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. APAC Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 APAC PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinion
5. APAC Embedded Die Packaging Technology Market – Key Market Dynamics
5.1 Market Drivers
5.1.1 Burgeoning Demand for Miniaturization of Electronic Devices
5.1.2 Escalating Developments in Embedded Die Packaging Technology
5.2 Market Restraints
5.2.1 Technical Issues and Availability of Alternative Solutions
5.3 Market Opportunities
5.3.1 Surging Demand to Enhance Smartphone and Automotive Device Performance
5.4 Future Trends
5.4.1 Mounting Adoption of Wearable Devices and Internet of Things
5.5 Impact Analysis of Drivers and Restraints
6. Embedded Die Packaging Technology Market – APAC Analysis
6.1 APAC Embedded Die Packaging Technology Market Overview
6.2 APAC Embedded Die Packaging Technology Market –Revenue and Forecast to 2028 (US$ Thousand)
7. APAC Embedded Die Packaging Technology Market Analysis – By Platform
7.1 Overview
7.2 APAC Embedded Die Packaging Technology Market, By Platform (2020 and 2028)
7.3 IC Package Substrate
7.3.1 Overview
7.3.2 IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.4 Rigid Board
7.4.1 Overview
7.4.2 Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
7.5 Flexible Board
7.5.1 Overview
7.5.2 Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8. APAC Embedded Die Packaging Technology Market – By Application
8.1 Overview
8.2 APAC Embedded Die Packaging Technology Market, by Application (2020 and 2028)
8.3 Smartphone and Tablets
8.3.1 Overview
8.3.2 Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.4 Medical and Wearable Devices
8.4.1 Overview
8.4.2 Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.5 Industrial Devices
8.5.1 Overview
8.5.2 Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.6 Security Devices
8.6.1 Overview
8.6.2 Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
8.7 Other Applications
8.7.1 Overview
8.7.2 Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9. APAC Embedded Die Packaging Technology Market – By Industry
9.1 Overview
9.2 APAC Embedded Die Packaging Technology Market, by Industry (2020 and 2028)
9.3 Consumer Electronics
9.3.1 Overview
9.3.2 Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.4 IT and Telecommunication
9.4.1 Overview
9.4.2 IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.5 Automotive
9.5.1 Overview
9.5.2 Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.6 Healthcare
9.6.1 Overview
9.6.2 Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
9.7 Other Industries
9.7.1 Overview
9.7.2 Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10. APAC Embedded Die Packaging Technology Market – Country Analysis
10.1 Overview
10.1.1 APAC: Embedded Die Packaging Technology Market- by Key Country
10.1.1.1 Australia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.1.1 Australia: Embedded Die Packaging Technology Market- By Platform
10.1.1.1.2 Australia: Embedded Die Packaging Technology Market- By Application
10.1.1.1.3 Australia: Embedded Die Packaging Technology Market- By Industry
10.1.1.2 China: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.2.1 China: Embedded Die Packaging Technology Market- By Platform
10.1.1.2.2 China: Embedded Die Packaging Technology Market- By Application
10.1.1.2.3 China: Embedded Die Packaging Technology Market- By Industry
10.1.1.3 India: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.3.1 India: Embedded Die Packaging Technology Market- By Platform
10.1.1.3.2 India: Embedded Die Packaging Technology Market- By Application
10.1.1.3.3 India: Embedded Die Packaging Technology Market- By Industry
10.1.1.4 Japan: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.4.1 Japan: Embedded Die Packaging Technology Market- By Platform
10.1.1.4.2 Japan: Embedded Die Packaging Technology Market- By Application
10.1.1.4.3 Japan: Embedded Die Packaging Technology Market- By Industry
10.1.1.5 South Korea: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.5.1 South Korea: Embedded Die Packaging Technology Market- By Platform
10.1.1.5.2 South Korea: Embedded Die Packaging Technology Market- By Application
10.1.1.5.3 South Korea: Embedded Die Packaging Technology Market- By Industry
10.1.1.6 Rest of APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.6.1 Rest of APAC: Embedded Die Packaging Technology Market- By Platform
10.1.1.6.2 Rest of APAC: Embedded Die Packaging Technology Market- By Application
10.1.1.6.3 Rest of APAC: Embedded Die Packaging Technology Market- By Industry
11. APAC Embedded Die Packaging Technology Market- COVID-19 Impact Analysis
11.1 APAC
12. Industry Landscape
12.1 Overview
12.2 Market Initiative
12.3 New Product Development
13. Company Profiles
13.1 ASE Group
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Amkor Technology, Inc.
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 Fujikura Ltd.
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 General Electric Company
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 Infineon Technologies AG
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Microsemi
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Shinko Electric Industries Co., Ltd.
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 Schweizer Electronic AG
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
13.10 Taiwan Semiconductor Manufacturing Company, Limited
13.10.1 Key Facts
13.10.2 Business Description
13.10.3 Products and Services
13.10.4 Financial Overview
13.10.5 SWOT Analysis
13.10.6 Key Developments
14. Appendix
14.1 About The Insight Partners
14.2 Word Index
LIST OF TABLES
Table 1. APAC Embedded Die Packaging Technology Market – Revenue, and Forecast to 2028 (US$ Thousand)
Table 2. Australia: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 3. Australia: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 4. Australia: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 5. China: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 6. China: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 7. China: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 8. India: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 9. India: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 10. India: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 11. Japan: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 12. Japan: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 13. Japan: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 14. South Korea: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 15. South Korea: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 16. South Korea: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 17. Rest of APAC: Embedded Die Packaging Technology Market- By Platform –Revenue and Forecast to 2028 (US$ Thousand)
Table 18. Rest of APAC: Embedded Die Packaging Technology Market- By Application –Revenue and Forecast to 2028 (US$ Thousand)
Table 19. Rest of APAC: Embedded Die Packaging Technology Market- By Industry –Revenue and Forecast to 2028 (US$ Thousand)
Table 20. List of Abbreviation
LIST OF FIGURES
Figure 1. APAC Embedded Die Packaging Technology Market Segmentation
Figure 2. APAC Embedded Die Packaging Technology Market Segmentation – By Country
Figure 3. APAC Embedded Die Packaging Technology Market Overview
Figure 4. IC Package Substrate Platform Held the Largest Market Share in 2020
Figure 5. Smartphones and Tablets Held the Largest Market Share in 2020
Figure 6. Consumer Electronics Held the Largest Market Share in 2020
Figure 7. China was the Largest Revenue Contributor in 2020
Figure 8. APAC – PEST Analysis
Figure 9. APAC Embedded Die Packaging Technology Market– Ecosystem Analysis
Figure 10. Expert Opinion
Figure 11. APAC Embedded Die Packaging Technology Market Impact Analysis of Drivers and Restraints
Figure 12. APAC Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 13. APAC Embedded Die Packaging Technology Market Revenue Share, by Platform (2020 and 2028)
Figure 14. APAC IC Package Substrate: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 15. APAC Rigid Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 16. APAC Flexible Board: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 17. APAC Embedded Die Packaging Technology Market Revenue Share, by Application (2020 and 2028)
Figure 18. APAC Smartphone and Tablets: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 19. APAC Medical and Wearable Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 20. APAC Industrial Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 21. APAC Security Devices: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 22. APAC Other Applications: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 23. APAC Embedded Die Packaging Technology Market Revenue Share, by Industry (2020 and 2028)
Figure 24. APAC Consumer Electronics: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 25. APAC IT and Telecommunication: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 26. APAC Automotive: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 27. APAC Healthcare: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 28. APAC Other Industries: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 29. APAC: Embedded Die Packaging Technology Market, by Key Country – Revenue (2020) (USD Thousand)
Figure 30. APAC: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)
Figure 31. Australia: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 32. China: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 33. India: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 34. Japan: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 35. South Korea: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 36. Rest of APAC: Embedded Die Packaging Technology Market – Revenue and Forecast to 2028 (US$ Thousand)
Figure 37. Impact of COVID-19 Pandemic in APAC Country Markets
- Amkor Technology, Inc.
- ASE Group
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- General Electric Company
- Infineon Technologies AG
- Microsemi
- Schweizer Electronic AG
- Shinko Electric Industries Co., Ltd.
- Taiwan Semiconductor Manufacturing Company, Limited
- Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the APAC embedded die packaging technology market.
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- Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
- Scrutinize in-depth APAC market trends and outlook coupled with the factors driving the embedded die packaging technology market, as well as those hindering it
- Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution